TW200634984A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
TW200634984A
TW200634984A TW094126033A TW94126033A TW200634984A TW 200634984 A TW200634984 A TW 200634984A TW 094126033 A TW094126033 A TW 094126033A TW 94126033 A TW94126033 A TW 94126033A TW 200634984 A TW200634984 A TW 200634984A
Authority
TW
Taiwan
Prior art keywords
power source
source voltage
integrated circuit
semiconductor integrated
area
Prior art date
Application number
TW094126033A
Other languages
English (en)
Other versions
TWI272696B (en
Inventor
Takashi Inukai
Yukihiro Urakawa
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200634984A publication Critical patent/TW200634984A/zh
Application granted granted Critical
Publication of TWI272696B publication Critical patent/TWI272696B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/002—Calibrated temperature sources, temperature standards therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/425—Thermal management of integrated systems
TW094126033A 2005-03-31 2005-08-01 Semiconductor integrated circuit TWI272696B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005101446A JP4864338B2 (ja) 2005-03-31 2005-03-31 半導体集積回路

Publications (2)

Publication Number Publication Date
TW200634984A true TW200634984A (en) 2006-10-01
TWI272696B TWI272696B (en) 2007-02-01

Family

ID=36010975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126033A TWI272696B (en) 2005-03-31 2005-08-01 Semiconductor integrated circuit

Country Status (7)

Country Link
US (2) US7392152B2 (zh)
EP (1) EP1864097A1 (zh)
JP (1) JP4864338B2 (zh)
KR (1) KR100848202B1 (zh)
CN (1) CN100582699C (zh)
TW (1) TWI272696B (zh)
WO (1) WO2006112048A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8118483B2 (en) 2006-06-21 2012-02-21 Intel Corporation Thermal sensor having toggle control

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100846387B1 (ko) 2006-05-31 2008-07-15 주식회사 하이닉스반도체 반도체 메모리 소자의 온도 정보 출력 장치
JP5168927B2 (ja) * 2007-02-14 2013-03-27 株式会社リコー 半導体装置およびそのトリミング方法
JP2009058438A (ja) * 2007-08-31 2009-03-19 Toshiba Corp 温度検出回路
JP5498047B2 (ja) * 2009-04-01 2014-05-21 株式会社東芝 半導体集積回路
US8321170B2 (en) 2010-02-19 2012-11-27 Freescale Semiconductor, Inc. Offset error automatic calibration integrated circuit
US8899828B2 (en) * 2012-03-22 2014-12-02 Texas Instruments Incorporated Heat sensor correction
US9000829B2 (en) * 2012-04-16 2015-04-07 International Rectifier Corporation System on chip for power inverter
US9329614B1 (en) * 2012-07-31 2016-05-03 Cirrus Logic, Inc. Bandgap with thermal drift correction
KR20190064893A (ko) 2017-12-01 2019-06-11 에스케이하이닉스 주식회사 디지털 온도 센싱 회로

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2577495B2 (ja) * 1990-08-21 1997-01-29 株式会社東芝 半導体評価回路
JPH0764956A (ja) * 1993-08-31 1995-03-10 Copal Co Ltd ワンチップマイクロコンピュータｉｃ装置
US5875142A (en) * 1997-06-17 1999-02-23 Micron Technology, Inc. Integrated circuit with temperature detector
US5956289A (en) 1997-06-17 1999-09-21 Micron Technology, Inc. Clock signal from an adjustable oscillator for an integrated circuit
US6006169A (en) 1997-12-31 1999-12-21 Intel Corporation Method and apparatus for trimming an integrated circuit
CN2341134Y (zh) * 1998-02-20 1999-09-29 振吉电化厂股份有限公司 电能热水器的温度表校准装置
JP3712537B2 (ja) * 1998-08-06 2005-11-02 富士通株式会社 温度検出回路、温度検出回路の校正方法、及び、半導体記憶装置
JP2000338193A (ja) * 1999-05-31 2000-12-08 Hitachi Ltd 集積回路及び物理量検出システム
US6850125B2 (en) * 2001-08-15 2005-02-01 Gallitzin Allegheny Llc Systems and methods for self-calibration
US6996491B2 (en) * 2002-02-19 2006-02-07 Sun Microsystems, Inc. Method and system for monitoring and profiling an integrated circuit die temperature
JP2004048518A (ja) * 2002-07-15 2004-02-12 Kawasaki Microelectronics Kk 半導体集積回路とその調整方法および調整装置
KR100475736B1 (ko) 2002-08-09 2005-03-10 삼성전자주식회사 고속 테스트에 적합한 편이온도 검출회로를 갖는온도감지기 및 편이온도 검출방법
WO2005001405A1 (en) * 2003-06-27 2005-01-06 Koninklijke Philips Electronics N. V. Method and arrangement for temperature calibration
CN2636216Y (zh) * 2003-08-26 2004-08-25 北京市科海龙华工业自动化仪器有限公司 微机钢水测温仪工作状态的检验装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8118483B2 (en) 2006-06-21 2012-02-21 Intel Corporation Thermal sensor having toggle control
US8684597B2 (en) 2006-06-21 2014-04-01 Intel Corporation Thermal sensor having toggle control
US9714868B2 (en) 2006-06-21 2017-07-25 Intel Corporation Thermal sensor having toggle control

Also Published As

Publication number Publication date
WO2006112048A1 (en) 2006-10-26
TWI272696B (en) 2007-02-01
JP4864338B2 (ja) 2012-02-01
US7392152B2 (en) 2008-06-24
JP2006286721A (ja) 2006-10-19
US20060224351A1 (en) 2006-10-05
KR20070069153A (ko) 2007-07-02
US8000923B2 (en) 2011-08-16
CN100582699C (zh) 2010-01-20
EP1864097A1 (en) 2007-12-12
US20080162067A1 (en) 2008-07-03
CN101031784A (zh) 2007-09-05
KR100848202B1 (ko) 2008-07-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees