TW200634936A - Thermally enhanced flip-chip-on-film package - Google Patents

Thermally enhanced flip-chip-on-film package

Info

Publication number
TW200634936A
TW200634936A TW094108261A TW94108261A TW200634936A TW 200634936 A TW200634936 A TW 200634936A TW 094108261 A TW094108261 A TW 094108261A TW 94108261 A TW94108261 A TW 94108261A TW 200634936 A TW200634936 A TW 200634936A
Authority
TW
Taiwan
Prior art keywords
chip
flexible substrate
film package
thermally enhanced
heat sink
Prior art date
Application number
TW094108261A
Other languages
Chinese (zh)
Other versions
TWI283447B (en
Inventor
Geng-Shin Shen
Kun-Hsien Tsai
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW094108261A priority Critical patent/TWI283447B/en
Priority to US11/202,820 priority patent/US20060208365A1/en
Publication of TW200634936A publication Critical patent/TW200634936A/en
Application granted granted Critical
Publication of TWI283447B publication Critical patent/TWI283447B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

A thermally enhanced flip-chip-on-film package is disclosed. It mainly includes a flexible substrate, a heat sink, a flip chip and a sealant. The heat sink is disposed on a lower surface of the flexible substrate, and the flip chip is corresponded to the heat sink and disposed on an upper surface of the flexible substrate so as to be electrically connected to a lead layer on the upper surface of the flexible substrate. The heat sink can support the flip chip on the flexible substrate and conduct the heat from the flip chip worked.
TW094108261A 2005-03-17 2005-03-17 Thermally enhanced flip-chip-on-film package TWI283447B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW094108261A TWI283447B (en) 2005-03-17 2005-03-17 Thermally enhanced flip-chip-on-film package
US11/202,820 US20060208365A1 (en) 2005-03-17 2005-08-12 Flip-chip-on-film package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094108261A TWI283447B (en) 2005-03-17 2005-03-17 Thermally enhanced flip-chip-on-film package

Publications (2)

Publication Number Publication Date
TW200634936A true TW200634936A (en) 2006-10-01
TWI283447B TWI283447B (en) 2007-07-01

Family

ID=39428179

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094108261A TWI283447B (en) 2005-03-17 2005-03-17 Thermally enhanced flip-chip-on-film package

Country Status (1)

Country Link
TW (1) TWI283447B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761060B (en) * 2021-02-03 2022-04-11 南茂科技股份有限公司 Chip on film package structure
CN114721188A (en) * 2022-03-29 2022-07-08 颀中科技（苏州）有限公司 Forming method of flip chip packaging structure, flip chip packaging structure and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761060B (en) * 2021-02-03 2022-04-11 南茂科技股份有限公司 Chip on film package structure
CN114721188A (en) * 2022-03-29 2022-07-08 颀中科技（苏州）有限公司 Forming method of flip chip packaging structure, flip chip packaging structure and display device
CN114721188B (en) * 2022-03-29 2024-05-17 颀中科技（苏州）有限公司 Flip chip packaging structure forming method, flip chip packaging structure and display device

Also Published As

Publication number Publication date
TWI283447B (en) 2007-07-01

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