TW200633118A - Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus - Google Patents

Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus

Info

Publication number
TW200633118A
TW200633118A TW095102467A TW95102467A TW200633118A TW 200633118 A TW200633118 A TW 200633118A TW 095102467 A TW095102467 A TW 095102467A TW 95102467 A TW95102467 A TW 95102467A TW 200633118 A TW200633118 A TW 200633118A
Authority
TW
Taiwan
Prior art keywords
film pattern
electro
manufacturing
same
forming film
Prior art date
Application number
TW095102467A
Other languages
English (en)
Other versions
TWI284380B (en
Inventor
Toshimitsu Hirai
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200633118A publication Critical patent/TW200633118A/zh
Application granted granted Critical
Publication of TWI284380B publication Critical patent/TWI284380B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0585—Second resist used as mask for selective stripping of first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
TW095102467A 2005-02-04 2006-01-23 Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus TWI284380B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005028584A JP4337744B2 (ja) 2005-02-04 2005-02-04 膜パターンの形成方法、アクティブマトリクス基板の製造方法

Publications (2)

Publication Number Publication Date
TW200633118A true TW200633118A (en) 2006-09-16
TWI284380B TWI284380B (en) 2007-07-21

Family

ID=36780471

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102467A TWI284380B (en) 2005-02-04 2006-01-23 Method of forming film pattern, device, method of manufacturing the same, electro-optical apparatus, and electronic apparatus

Country Status (5)

Country Link
US (1) US7524764B2 (zh)
JP (1) JP4337744B2 (zh)
KR (1) KR100737307B1 (zh)
CN (1) CN1816254A (zh)
TW (1) TWI284380B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2430178A (en) * 2005-09-20 2007-03-21 Seiko Epson Corp Method of producing a substrate having areas of different hydrophilicity and/or oleophilicity on the same surface
KR100951320B1 (ko) 2007-07-26 2010-04-05 주식회사 엘지화학 레이저 조사에 의한 전기전도성 구리 패턴층의 형성방법
JP4867904B2 (ja) * 2007-12-10 2012-02-01 セイコーエプソン株式会社 導体パターン形成用インク、導体パターン、導体パターンの形成方法および配線基板
JP4867905B2 (ja) * 2007-12-11 2012-02-01 セイコーエプソン株式会社 導体パターン形成用インク、導体パターン、および配線基板
JP5615002B2 (ja) * 2010-03-02 2014-10-29 株式会社ミマキエンジニアリング プリンタ装置およびその印刷方法
US10408896B2 (en) 2017-03-13 2019-09-10 University Of Utah Research Foundation Spintronic devices
CN113050306B (zh) * 2021-03-10 2022-05-17 济南晶正电子科技有限公司 用于电光调制器的电光晶体薄膜、制备方法及电子元器件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100530758C (zh) * 1998-03-17 2009-08-19 精工爱普生株式会社 薄膜构图的衬底及其表面处理
JP3646510B2 (ja) 1998-03-18 2005-05-11 セイコーエプソン株式会社 薄膜形成方法、表示装置およびカラーフィルタ
TW490997B (en) * 2000-03-31 2002-06-11 Seiko Epson Corp Method of manufacturing organic EL element, and organic EL element
JP2002237383A (ja) 2000-03-31 2002-08-23 Seiko Epson Corp 有機ｅｌ素子の製造方法、有機ｅｌ素子
KR100335502B1 (ko) * 2000-06-12 2002-05-08 윤종용 윤곽선 정보에 의한 2차원 비선형 보간 시스템 및 그 방법
JP4035968B2 (ja) * 2000-06-30 2008-01-23 セイコーエプソン株式会社 導電膜パターンの形成方法
JP2003273111A (ja) * 2002-03-14 2003-09-26 Seiko Epson Corp 成膜方法及びその方法を用いて製造したデバイス、並びにデバイスの製造方法
JP3578162B2 (ja) * 2002-04-16 2004-10-20 セイコーエプソン株式会社 パターンの形成方法、パターン形成装置、導電膜配線、デバイスの製造方法、電気光学装置、並びに電子機器
JP4192674B2 (ja) 2003-05-16 2008-12-10 セイコーエプソン株式会社 薄膜パターン形成方法及びデバイスの製造方法
US8053171B2 (en) * 2004-01-16 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and EL television
US7732334B2 (en) * 2004-08-23 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7510951B2 (en) * 2005-05-12 2009-03-31 Lg Chem, Ltd. Method for forming high-resolution pattern with direct writing means

Also Published As

Publication number Publication date
KR20060089630A (ko) 2006-08-09
CN1816254A (zh) 2006-08-09
TWI284380B (en) 2007-07-21
JP4337744B2 (ja) 2009-09-30
KR100737307B1 (ko) 2007-07-09
US20060177951A1 (en) 2006-08-10
JP2006212555A (ja) 2006-08-17
US7524764B2 (en) 2009-04-28

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees