TW200631110A - Appratus for processing semiconductor package - Google Patents

Appratus for processing semiconductor package

Info

Publication number
TW200631110A
TW200631110A TW095103253A TW95103253A TW200631110A TW 200631110 A TW200631110 A TW 200631110A TW 095103253 A TW095103253 A TW 095103253A TW 95103253 A TW95103253 A TW 95103253A TW 200631110 A TW200631110 A TW 200631110A
Authority
TW
Taiwan
Prior art keywords
package
packages
singulation
punch
singulated
Prior art date
Application number
TW095103253A
Other languages
Chinese (zh)
Inventor
Hyun-Gyun Jung
Seok-Bae Kim
Kyu-Seok Hwang
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of TW200631110A publication Critical patent/TW200631110A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Disclosed is a semiconductor package processing apparatus. The semiconductor package processing apparatus has a singulation device including a punch on which a package to be singulated is mounted and a die for singulating the package into individual packages in cooperation with the punch, a pair of package transfer devices, which alternately pick the packages singulated by the singulation device using a vacuum so as to transfer the packages after a singulation process for the package has been completed, and a package carrier including package mounting seats aligned in at least two rows corresponding to vacuum pads of the package transfer devices and carrying the packages from the package transfer devices to a package tray device. The package transfer device moves down to a singulation stage of the singulation device so as to directly pick the packages singulated through interaction between the punch and the die.
TW095103253A 2005-01-31 2006-01-27 Appratus for processing semiconductor package TW200631110A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050008420A KR100584517B1 (en) 2005-01-31 2005-01-31 Semiconductor package processing apparatus

Publications (1)

Publication Number Publication Date
TW200631110A true TW200631110A (en) 2006-09-01

Family

ID=36740764

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103253A TW200631110A (en) 2005-01-31 2006-01-27 Appratus for processing semiconductor package

Country Status (3)

Country Link
KR (1) KR100584517B1 (en)
TW (1) TW200631110A (en)
WO (1) WO2006080809A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI744484B (en) * 2017-03-13 2021-11-01 南韓商韓美半導體股份有限公司 Semiconductor manufacturing apparatus and controlling method of the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100795950B1 (en) * 2006-09-06 2008-01-21 한미반도체 주식회사 Handling device of the semiconductor package and controlling method for the same
SG164306A1 (en) * 2009-03-05 2010-09-29 Rokko Technology Pte Ltd Assembly and method for improved singulation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06293434A (en) * 1993-04-08 1994-10-21 Seiko Epson Corp Ic carrying method
JP3646687B2 (en) * 2001-10-16 2005-05-11 松下電器産業株式会社 Flip chip mounting apparatus and flip chip mounting method
KR100411297B1 (en) * 2002-01-17 2003-12-24 미래산업 주식회사 Picker for semiconductor test handler
KR20020079652A (en) * 2002-09-02 2002-10-19 주식회사 한미 Moving apparatus of semiconductor package
KR20020079653A (en) * 2002-09-02 2002-10-19 주식회사 한미 Singulation system of semiconductor package
KR100450583B1 (en) * 2002-10-09 2004-09-30 한미반도체 주식회사 apparatus transferring a semiconductor package for singulation equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI744484B (en) * 2017-03-13 2021-11-01 南韓商韓美半導體股份有限公司 Semiconductor manufacturing apparatus and controlling method of the same

Also Published As

Publication number Publication date
KR100584517B1 (en) 2006-05-29
WO2006080809A1 (en) 2006-08-03

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