TW200630316A - A composition for forming a thick film conductor - Google Patents

A composition for forming a thick film conductor

Info

Publication number
TW200630316A
TW200630316A TW095105210A TW95105210A TW200630316A TW 200630316 A TW200630316 A TW 200630316A TW 095105210 A TW095105210 A TW 095105210A TW 95105210 A TW95105210 A TW 95105210A TW 200630316 A TW200630316 A TW 200630316A
Authority
TW
Taiwan
Prior art keywords
mass
al2o3
powder
composition
li2o
Prior art date
Application number
TW095105210A
Other languages
Chinese (zh)
Other versions
TWI312770B (en
Inventor
Katsuhiro Kawakubo
Yoshinori Adachi
Shingo Awagakubo
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW200630316A publication Critical patent/TW200630316A/en
Application granted granted Critical
Publication of TWI312770B publication Critical patent/TWI312770B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)

Abstract

This invention provides a composition for forming a thick film conductor, which almost does not cause solder biting (i.e. solder corrosion) and is lead-free. The composition comprises a conductive powder, an oxide powder and an organic vehicle, wherein the oxide powder comprises SiO2-B2O3-Al2O3-CaO-Li2O based glass powder and Al2O3 powder; the SiO2-B2O3-Al2O3-CaO-Li2O based glass powder comprises 20-60 mass% of SiO2, 2-25 mass% of B2O3, 2-25 mass% of Al2O3, 20-50 mass% of CaO, and 0.1-10 mass% of Li2O. Compared to 100 parts by mass of the conductive powder, the SiO2-B2O3-Al2O3-CaO-Li2O based glass powder is 0.1-15 parts by mass and the Al2O3 powder is 0.1-8 parts by mass.
TW95105210A 2005-02-17 2006-02-16 A composition for forming a thick film conductor TWI312770B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005041048A JP4466402B2 (en) 2005-02-17 2005-02-17 Thick film conductor composition

Publications (2)

Publication Number Publication Date
TW200630316A true TW200630316A (en) 2006-09-01
TWI312770B TWI312770B (en) 2009-08-01

Family

ID=36923472

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95105210A TWI312770B (en) 2005-02-17 2006-02-16 A composition for forming a thick film conductor

Country Status (3)

Country Link
JP (1) JP4466402B2 (en)
CN (1) CN1822240B (en)
TW (1) TWI312770B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5488282B2 (en) * 2010-07-13 2014-05-14 昭栄化学工業株式会社 Conductive paste
JP5454414B2 (en) 2010-08-18 2014-03-26 住友金属鉱山株式会社 Thick film conductor forming composition, thick film conductor formed using the composition, and chip resistor using the thick film conductor
JP5835325B2 (en) * 2011-06-21 2015-12-24 住友金属鉱山株式会社 Ruthenium oxide powder, composition for thick film resistor, thick film resistor paste and thick film resistor using the same
JP5673515B2 (en) * 2011-12-12 2015-02-18 住友金属鉱山株式会社 Thick film conductor forming composition, thick film conductor using the same, and method for producing the same
JP6114001B2 (en) * 2012-10-26 2017-04-12 京セラ株式会社 Conductive paste, circuit board and electronic device
CN103456388B (en) * 2013-08-06 2017-11-07 浙江光达电子科技有限公司 It is a kind of that the thick film ink of insulating barrier can be generated on solar silicon wafers
JP6201190B2 (en) 2014-04-25 2017-09-27 住友金属鉱山株式会社 Thick film conductor forming composition and thick film conductor obtained using the same
JP2016219256A (en) * 2015-05-20 2016-12-22 住友金属鉱山株式会社 Cu paste composition and thick film conductor
JP6354970B2 (en) 2015-10-01 2018-07-11 昭栄化学工業株式会社 Method for forming terminal electrode of conductive paste and multilayer ceramic component
CN106229028B (en) * 2016-08-18 2017-11-28 贵研铂业股份有限公司 A kind of tubular oxygen sensor burning platinum slurry and preparation method thereof altogether
CN110714133B (en) * 2019-10-22 2021-12-21 西安宏星电子浆料科技股份有限公司 Silver palladium alloy powder for conductive composition and preparation method thereof
CN110970151B (en) * 2019-12-18 2021-03-30 广东顺德弘暻电子有限公司 High-weldability anti-warping thick film conductor slurry for stainless steel base material and preparation method thereof
CN113707359B (en) * 2021-09-09 2023-04-28 南京汇聚新材料科技有限公司 Electrode paste, conductive thick film and preparation method thereof
TWI839636B (en) * 2021-09-09 2024-04-21 大陸商南京匯聚新材料科技有限公司 Electrode paste and method of preparing conductive thick film therefrom
CN116354604A (en) * 2023-05-31 2023-06-30 江苏精瓷智能传感技术研究院有限公司 Preparation method of glass ceramic sealing material for platinum resistance film temperature sensing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1213441C (en) * 2003-03-07 2005-08-03 中国科学院上海硅酸盐研究所 Leadless thick film conductor slurry composition for aluminium nitride substrate

Also Published As

Publication number Publication date
JP2006228572A (en) 2006-08-31
CN1822240B (en) 2010-05-12
JP4466402B2 (en) 2010-05-26
TWI312770B (en) 2009-08-01
CN1822240A (en) 2006-08-23

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