TW200626740A - CVD doped structures - Google Patents

CVD doped structures

Info

Publication number
TW200626740A
TW200626740A TW094134587A TW94134587A TW200626740A TW 200626740 A TW200626740 A TW 200626740A TW 094134587 A TW094134587 A TW 094134587A TW 94134587 A TW94134587 A TW 94134587A TW 200626740 A TW200626740 A TW 200626740A
Authority
TW
Taiwan
Prior art keywords
silicon
doped structures
cvd
dopant
cvd doped
Prior art date
Application number
TW094134587A
Other languages
English (en)
Other versions
TWI307369B (en
Inventor
Veli Matti Airaksinen
Maria Elina Hokkanen
Original Assignee
Okmetic Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okmetic Oyj filed Critical Okmetic Oyj
Publication of TW200626740A publication Critical patent/TW200626740A/zh
Application granted granted Critical
Publication of TWI307369B publication Critical patent/TWI307369B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02529—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02579—P-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
TW094134587A 2004-10-06 2005-10-04 Cvd doped structures TWI307369B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/959,602 US7435665B2 (en) 2004-10-06 2004-10-06 CVD doped structures

Publications (2)

Publication Number Publication Date
TW200626740A true TW200626740A (en) 2006-08-01
TWI307369B TWI307369B (en) 2009-03-11

Family

ID=35998603

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134587A TWI307369B (en) 2004-10-06 2005-10-04 Cvd doped structures

Country Status (4)

Country Link
US (1) US7435665B2 (zh)
EP (1) EP1812618B1 (zh)
TW (1) TWI307369B (zh)
WO (1) WO2006037844A2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547704A (zh) * 2011-04-04 2014-01-29 奥克美蒂克公共有限公司 用于在衬底上沉积一个或者多个多晶硅层的方法
CN112481606A (zh) * 2020-11-10 2021-03-12 江苏杰太光电技术有限公司 一种pecvd沉积太阳能电池掺杂层的气源和系统

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US7855126B2 (en) * 2004-06-17 2010-12-21 Samsung Electronics Co., Ltd. Methods of fabricating a semiconductor device using a cyclic selective epitaxial growth technique and semiconductor devices formed using the same
KR100593736B1 (ko) * 2004-06-17 2006-06-28 삼성전자주식회사 단결정 반도체 상에 선택적으로 에피택시얼 반도체층을형성하는 방법들 및 이를 사용하여 제조된 반도체 소자들
US7361563B2 (en) * 2004-06-17 2008-04-22 Samsung Electronics Co., Ltd. Methods of fabricating a semiconductor device using a selective epitaxial growth technique
KR100594327B1 (ko) * 2005-03-24 2006-06-30 삼성전자주식회사 라운드 형태의 단면을 가지는 나노와이어를 구비한 반도체소자 및 그 제조 방법
US7691730B2 (en) * 2005-11-22 2010-04-06 Corning Incorporated Large area semiconductor on glass insulator
US11311917B2 (en) 2007-08-09 2022-04-26 Bruker Nano, Inc. Apparatus and method for contamination identification
US7993464B2 (en) * 2007-08-09 2011-08-09 Rave, Llc Apparatus and method for indirect surface cleaning
US7772097B2 (en) * 2007-11-05 2010-08-10 Asm America, Inc. Methods of selectively depositing silicon-containing films
US20090269939A1 (en) * 2008-04-25 2009-10-29 Asm International, N.V. Cyclical oxidation process
JP5251243B2 (ja) * 2008-05-12 2013-07-31 信越半導体株式会社 気相成長装置およびシリコンエピタキシャル膜の気相成長方法
RU2520283C2 (ru) * 2008-06-04 2014-06-20 Доу Корнинг Корпорейшн Способ выращивания полупроводника и полупроводниковое устройство
US8889565B2 (en) * 2009-02-13 2014-11-18 Asm International N.V. Selective removal of oxygen from metal-containing materials
US9127340B2 (en) * 2009-02-13 2015-09-08 Asm International N.V. Selective oxidation process
US7829457B2 (en) * 2009-02-20 2010-11-09 Asm International N.V. Protection of conductors from oxidation in deposition chambers
US20110042685A1 (en) * 2009-08-18 2011-02-24 Qs Semiconductor Australia Pty Ltd Substrates and methods of fabricating epitaxial silicon carbide structures with sequential emphasis
CN201590029U (zh) * 2009-10-15 2010-09-22 鸿富锦精密工业（深圳）有限公司 散热系统
KR101714003B1 (ko) 2010-03-19 2017-03-09 삼성전자 주식회사 패시티드 반도체패턴을 갖는 반도체소자 형성방법 및 관련된 소자
US8507388B2 (en) 2010-04-26 2013-08-13 Asm International N.V. Prevention of oxidation of substrate surfaces in process chambers
US9306010B2 (en) * 2012-03-14 2016-04-05 Infineon Technologies Ag Semiconductor arrangement
US10249493B2 (en) * 2015-12-30 2019-04-02 Siltronic Ag Method for depositing a layer on a semiconductor wafer by vapor deposition in a process chamber
RU2644627C2 (ru) * 2016-02-24 2018-02-13 Федеральное государственное бюджетное образовательное учреждение высшего образования "Кабардино-Балкарский государственный университет им. Х.М. Бербекова" (КБГУ) Способ изготовления полупроводниковой структуры

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JP3312553B2 (ja) * 1996-03-09 2002-08-12 信越半導体株式会社 シリコン単結晶およびシリコン単結晶薄膜の製造方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547704A (zh) * 2011-04-04 2014-01-29 奥克美蒂克公共有限公司 用于在衬底上沉积一个或者多个多晶硅层的方法
CN103547704B (zh) * 2011-04-04 2016-03-30 奥克美蒂克公共有限公司 用于在衬底上沉积一个或者多个多晶硅层的方法
CN112481606A (zh) * 2020-11-10 2021-03-12 江苏杰太光电技术有限公司 一种pecvd沉积太阳能电池掺杂层的气源和系统

Also Published As

Publication number Publication date
US7435665B2 (en) 2008-10-14
EP1812618A2 (en) 2007-08-01
WO2006037844A2 (en) 2006-04-13
WO2006037844A3 (en) 2006-06-08
US20060073679A1 (en) 2006-04-06
TWI307369B (en) 2009-03-11
EP1812618B1 (en) 2014-11-26

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