TW200621432A - Polishing tool and method for making the same - Google Patents

Polishing tool and method for making the same

Info

Publication number
TW200621432A
TW200621432A TW093141640A TW93141640A TW200621432A TW 200621432 A TW200621432 A TW 200621432A TW 093141640 A TW093141640 A TW 093141640A TW 93141640 A TW93141640 A TW 93141640A TW 200621432 A TW200621432 A TW 200621432A
Authority
TW
Taiwan
Prior art keywords
abrasion
polishing tool
clusters
particle
making
Prior art date
Application number
TW093141640A
Other languages
Chinese (zh)
Other versions
TWI286097B (en
Inventor
Wey Hwang
Martin Yang
Cliff Lin
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Priority to TW93141640A priority Critical patent/TWI286097B/en
Publication of TW200621432A publication Critical patent/TW200621432A/en
Application granted granted Critical
Publication of TWI286097B publication Critical patent/TWI286097B/en

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The invention provides a polishing tool and method for making the same. The polishing tool structure includes a substrate, plural abrasion particle clusters, and a bonding adhesive layer. The abrasion particle clusters include plural abrasion particles that are grouped into clusters. The plural abrasion particle clusters are arranged in a regular manner and secured to the substrate surface by the bonding adhesive layer at the surface. The regular arrangement of the abrasion particle clusters are controlled by the manufacturing process. An abrasion particles template is used to form the regular arrangement pattern as desired. The sizes of the abrasion particles positioning holes of the abrasion particles template serve to adjust the particle numbers in each abrasion particle cluster.
TW93141640A 2004-12-31 2004-12-31 Polishing tool and method for making the same TWI286097B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93141640A TWI286097B (en) 2004-12-31 2004-12-31 Polishing tool and method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93141640A TWI286097B (en) 2004-12-31 2004-12-31 Polishing tool and method for making the same

Publications (2)

Publication Number Publication Date
TW200621432A true TW200621432A (en) 2006-07-01
TWI286097B TWI286097B (en) 2007-09-01

Family

ID=39458581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93141640A TWI286097B (en) 2004-12-31 2004-12-31 Polishing tool and method for making the same

Country Status (1)

Country Link
TW (1) TWI286097B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114346922A (en) * 2021-12-17 2022-04-15 淄博理研泰山涂附磨具有限公司 Integrated glue-coated pattern type coated abrasive tool and preparation method thereof
CN116619246A (en) * 2023-07-24 2023-08-22 北京寰宇晶科科技有限公司 CMP polishing pad trimmer with diamond columnar crystal clusters and preparation method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417169B (en) * 2009-06-11 2013-12-01 Wei En Chen Cutting tools with the top of the complex cutting
TWI464839B (en) * 2010-09-21 2014-12-11 Ritedia Corp Diamond particle mololayer heat spreaders and associated methods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114346922A (en) * 2021-12-17 2022-04-15 淄博理研泰山涂附磨具有限公司 Integrated glue-coated pattern type coated abrasive tool and preparation method thereof
CN116619246A (en) * 2023-07-24 2023-08-22 北京寰宇晶科科技有限公司 CMP polishing pad trimmer with diamond columnar crystal clusters and preparation method thereof
CN116619246B (en) * 2023-07-24 2023-11-10 北京寰宇晶科科技有限公司 CMP polishing pad trimmer with diamond columnar crystal clusters and preparation method thereof

Also Published As

Publication number Publication date
TWI286097B (en) 2007-09-01

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