TW200620692A - Chip with high efficient heat dissipation and brightness - Google Patents

Chip with high efficient heat dissipation and brightness

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Publication number
TW200620692A
TW200620692A TW093136992A TW93136992A TW200620692A TW 200620692 A TW200620692 A TW 200620692A TW 093136992 A TW093136992 A TW 093136992A TW 93136992 A TW93136992 A TW 93136992A TW 200620692 A TW200620692 A TW 200620692A
Authority
TW
Taiwan
Prior art keywords
chip
light emitting
brightness
heat dissipation
high efficient
Prior art date
Application number
TW093136992A
Other languages
Chinese (zh)
Other versions
TWI285968B (en
Inventor
Chiu-Chung Yang
Original Assignee
Chiu-Chung Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36566544&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200620692(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Chiu-Chung Yang filed Critical Chiu-Chung Yang
Priority to TW093136992A priority Critical patent/TWI285968B/en
Priority to US11/285,799 priority patent/US20060113555A1/en
Priority to JP2005346314A priority patent/JP2006157025A/en
Publication of TW200620692A publication Critical patent/TW200620692A/en
Application granted granted Critical
Publication of TWI285968B publication Critical patent/TWI285968B/en

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

Disclosed is a chip with high efficient heat dissipation and brightness. When the produced chip is being etched, the area of the etching light emitting layer needs to be reduced to keep the light emitting layer with larger area for light emitting. A layer of big area of conductive layer is then laid at the P and N electrodes to increase the light emitting surface and the light reflection surface to enhance the heat dissipating efficiency. The chip without packaging has the function of the SMD and the flip chip for reducing the cost of packaging.
TW093136992A 2004-12-01 2004-12-01 Chip with high efficient heat dissipation and brightness TWI285968B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093136992A TWI285968B (en) 2004-12-01 2004-12-01 Chip with high efficient heat dissipation and brightness
US11/285,799 US20060113555A1 (en) 2004-12-01 2005-11-23 Light emitting diode chip with large heat dispensing and illuminating area
JP2005346314A JP2006157025A (en) 2004-12-01 2005-11-30 Chip for highly efficient heat dissipation and light intensity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093136992A TWI285968B (en) 2004-12-01 2004-12-01 Chip with high efficient heat dissipation and brightness

Publications (2)

Publication Number Publication Date
TW200620692A true TW200620692A (en) 2006-06-16
TWI285968B TWI285968B (en) 2007-08-21

Family

ID=36566544

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