TW200618918A - Substrate working device and substrate working method - Google Patents

Substrate working device and substrate working method

Info

Publication number
TW200618918A
TW200618918A TW094126443A TW94126443A TW200618918A TW 200618918 A TW200618918 A TW 200618918A TW 094126443 A TW094126443 A TW 094126443A TW 94126443 A TW94126443 A TW 94126443A TW 200618918 A TW200618918 A TW 200618918A
Authority
TW
Taiwan
Prior art keywords
substrate
laser beams
substrate working
laser
sublimed
Prior art date
Application number
TW094126443A
Other languages
Chinese (zh)
Other versions
TWI282295B (en
Inventor
Shin Hotta
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200618918A publication Critical patent/TW200618918A/en
Application granted granted Critical
Publication of TWI282295B publication Critical patent/TWI282295B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

To provide a substrate working device and a substrate working method for forming a scribe line to stably divide a substrate. Laser beams emitted from a laser beam source 2 are parallelized by a beam shaping optical system 3, and the power of the laser beams is regulated. The deflection direction is regulated by a 1/2 wavelength plate 4, and the laser beams are condensed on a substrate 7 by a condensing optical system 5. By condensing the laser beams on the substrate 7, multiple photon absorption occurs inside the substrate 7, and glass in the ionized zone formed by the multiple photon absorption is sublimed. Since the substrate 7 is relatively moved to the laser beams by an XY-stage 8, a sublimed portion forming a groove forms a scribe line. The rotation of the 1/2 wavelength plate 4 is controlled so that the deflection direction of the laser beams becomes constant in the laser beam moving direction with respect to the substrate 7.
TW094126443A 2004-08-27 2005-08-03 Substrate working device and substrate working method TWI282295B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004248432A JP2006061954A (en) 2004-08-27 2004-08-27 Substrate working device and substrate working method

Publications (2)

Publication Number Publication Date
TW200618918A true TW200618918A (en) 2006-06-16
TWI282295B TWI282295B (en) 2007-06-11

Family

ID=36092513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126443A TWI282295B (en) 2004-08-27 2005-08-03 Substrate working device and substrate working method

Country Status (4)

Country Link
JP (1) JP2006061954A (en)
KR (1) KR20060050283A (en)
CN (1) CN1739903A (en)
TW (1) TWI282295B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
KR100746340B1 (en) * 2006-03-17 2007-08-03 한국광기술원 Real-time and high-precision measurement apparatus by analyzing the fabry-perot interference pattern
JP5154838B2 (en) * 2007-05-31 2013-02-27 株式会社ディスコ Laser processing equipment
CN101515096B (en) * 2008-02-22 2011-02-09 中华映管股份有限公司 Method for manufacturing substrate
JP2011218398A (en) * 2010-04-08 2011-11-04 Fujikura Ltd Method for forming microstructure, laser irradiation device, and substrate
CN102405426B (en) * 2010-05-28 2014-07-09 Lg化学株式会社 Method for manufacturing polarizing plate
JP2012040573A (en) * 2010-08-16 2012-03-01 Fuji Electric Co Ltd Microprocessing method of sample
JP6034097B2 (en) * 2012-08-28 2016-11-30 株式会社ディスコ Laser processing equipment
CN103785947B (en) * 2014-01-27 2018-01-23 英诺激光科技股份有限公司 A kind of laser cutting machine that can improve LED chip splitting yield
KR101581787B1 (en) 2014-06-02 2015-12-31 주식회사 크린？ Lift goods case and pull out method using lift goods case
DE112017003592T5 (en) * 2016-07-15 2019-03-28 TeraDiode, Inc. Material processing using a laser with variable beam shape
CN108581182A (en) * 2018-04-28 2018-09-28 大族激光科技产业集团股份有限公司 Laser processing device and method

Also Published As

Publication number Publication date
JP2006061954A (en) 2006-03-09
TWI282295B (en) 2007-06-11
KR20060050283A (en) 2006-05-19
CN1739903A (en) 2006-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees