TW200616138A - Substrate treating device - Google Patents

Substrate treating device

Info

Publication number
TW200616138A
TW200616138A TW094130988A TW94130988A TW200616138A TW 200616138 A TW200616138 A TW 200616138A TW 094130988 A TW094130988 A TW 094130988A TW 94130988 A TW94130988 A TW 94130988A TW 200616138 A TW200616138 A TW 200616138A
Authority
TW
Taiwan
Prior art keywords
substrate
support body
base stage
substrate support
top plate
Prior art date
Application number
TW094130988A
Other languages
English (en)
Inventor
Yoshikazu Iida
Masayuki Husano
Makoto Kobayashi
Eietsu Soneda
Original Assignee
Ses Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ses Co Ltd filed Critical Ses Co Ltd
Publication of TW200616138A publication Critical patent/TW200616138A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
TW094130988A 2004-09-16 2005-09-09 Substrate treating device TW200616138A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004270578A JP2006086384A (ja) 2004-09-16 2004-09-16 基板処理装置

Publications (1)

Publication Number Publication Date
TW200616138A true TW200616138A (en) 2006-05-16

Family

ID=36059822

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130988A TW200616138A (en) 2004-09-16 2005-09-09 Substrate treating device

Country Status (6)

Country Link
US (1) US20080264457A1 (zh)
JP (1) JP2006086384A (zh)
KR (1) KR20070058466A (zh)
CN (1) CN100481368C (zh)
TW (1) TW200616138A (zh)
WO (1) WO2006030561A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8377251B2 (en) 2008-06-30 2013-02-19 Shibaura Mechatronics Corporation Spin processing apparatus and spin processing method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010015018U1 (de) * 2010-11-07 2011-04-14 Bohnet, Hans Anordnung zur Herstellung von strukturierten Substraten
CN102650054B (zh) * 2011-02-28 2014-01-15 深南电路有限公司 一种覆铜板板边毛刺的去除方法
JP2013175544A (ja) * 2012-02-24 2013-09-05 Disco Abrasive Syst Ltd 保持テーブル
KR101504880B1 (ko) * 2014-11-14 2015-03-20 주식회사 기가레인 기판 안착유닛
CN109087870A (zh) * 2018-07-13 2018-12-25 上海华力集成电路制造有限公司 硅片清洗装置及其清洗方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198034A (en) * 1987-03-31 1993-03-30 Epsilon Technology, Inc. Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH0666381B2 (ja) * 1989-05-18 1994-08-24 株式会社エンヤシステム ウエハチヤツク方法及び装置
US5513688A (en) * 1992-12-07 1996-05-07 Rheo-Technology, Ltd. Method for the production of dispersion strengthened metal matrix composites
EP0611274B1 (de) * 1993-02-08 1998-12-02 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Träger für scheibenförmige Gegenstände
JPH09232206A (ja) * 1996-02-22 1997-09-05 Hitachi Ltd 塗布装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8377251B2 (en) 2008-06-30 2013-02-19 Shibaura Mechatronics Corporation Spin processing apparatus and spin processing method
TWI396233B (zh) * 2008-06-30 2013-05-11 Shibaura Mechatronics Corp A rotation processing device and a rotation processing method

Also Published As

Publication number Publication date
CN101015049A (zh) 2007-08-08
US20080264457A1 (en) 2008-10-30
WO2006030561A1 (ja) 2006-03-23
CN100481368C (zh) 2009-04-22
KR20070058466A (ko) 2007-06-08
JP2006086384A (ja) 2006-03-30

Similar Documents

Publication Publication Date Title
TW200616138A (en) Substrate treating device
WO2018154380A8 (en) Compositions and methods for treatment of proprotein convertase subtilisin/kexin type 9 (pcsk9)-related disorders
EP1850404A3 (en) Field effect transistor and manufacturing method thereof
WO2007146411A3 (en) Nanoshell therapy
EP2286838A3 (en) Treatment of obesity and related disorders
ATE516054T1 (de) Mikrodermabrasionssystem und anwendungsverfahren
WO2006078717A3 (en) Lipocalin 2 for the treatment, prevention, and management of cancer metastasis, angiogenesis, and fibrosis
ZA200901701B (en) Method of treating surface of metal base,metallic material treated by the surface treatment method,and method of coating the metallic material
TW200717593A (en) Semiconductor process chamber
WO2006130853A3 (en) Process and apparatus for increasing biological activity in waste treatment in bodies of water
EP1961447A3 (en) Treating depressive disorders with PKC activators
ZA200901700B (en) Method of treating surface of metal base,metallic material treated by the surface treatment method,and the method of coating the metallic material
TW200618086A (en) Substrate treating device
TW200625402A (en) Handling device for board type wafer
WO2000054310A1 (en) Method and device for rotating a wafer
KR101205828B1 (ko) 기판 세정 방법
ATE463080T1 (de) Elektrische steuervorrichtung
JP2012064800A5 (zh)
WO2008104762A3 (en) Bone-replacement materials, methods and devices
EP1505224A3 (en) Tile made of stone or agglomerate or the like including means suitable for insertion on slippery surfaces
JP2009061381A (ja) 減圧処理装置および減圧処理方法
PL1652650T3 (pl) Urządzenie podpierające oraz sposób zmiany obszaru podparcia urządzenia podpierającego
EP1267005A3 (de) Ablaufgarnitur für ein Becken oder eine Wanne
RU2001107688A (ru) Центробежный концентратор
DE502004010859D1 (de) Einrichtung zur aeroben biologischen Reinigung von Abwässern