TW200616138A - Substrate treating device - Google Patents
Substrate treating deviceInfo
- Publication number
- TW200616138A TW200616138A TW094130988A TW94130988A TW200616138A TW 200616138 A TW200616138 A TW 200616138A TW 094130988 A TW094130988 A TW 094130988A TW 94130988 A TW94130988 A TW 94130988A TW 200616138 A TW200616138 A TW 200616138A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- support body
- base stage
- substrate support
- top plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004270578A JP2006086384A (ja) | 2004-09-16 | 2004-09-16 | 基板処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200616138A true TW200616138A (en) | 2006-05-16 |
Family
ID=36059822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094130988A TW200616138A (en) | 2004-09-16 | 2005-09-09 | Substrate treating device |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080264457A1 (zh) |
JP (1) | JP2006086384A (zh) |
KR (1) | KR20070058466A (zh) |
CN (1) | CN100481368C (zh) |
TW (1) | TW200616138A (zh) |
WO (1) | WO2006030561A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8377251B2 (en) | 2008-06-30 | 2013-02-19 | Shibaura Mechatronics Corporation | Spin processing apparatus and spin processing method |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202010015018U1 (de) * | 2010-11-07 | 2011-04-14 | Bohnet, Hans | Anordnung zur Herstellung von strukturierten Substraten |
CN102650054B (zh) * | 2011-02-28 | 2014-01-15 | 深南电路有限公司 | 一种覆铜板板边毛刺的去除方法 |
JP2013175544A (ja) * | 2012-02-24 | 2013-09-05 | Disco Abrasive Syst Ltd | 保持テーブル |
KR101504880B1 (ko) * | 2014-11-14 | 2015-03-20 | 주식회사 기가레인 | 기판 안착유닛 |
CN109087870A (zh) * | 2018-07-13 | 2018-12-25 | 上海华力集成电路制造有限公司 | 硅片清洗装置及其清洗方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198034A (en) * | 1987-03-31 | 1993-03-30 | Epsilon Technology, Inc. | Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
JPH0666381B2 (ja) * | 1989-05-18 | 1994-08-24 | 株式会社エンヤシステム | ウエハチヤツク方法及び装置 |
US5513688A (en) * | 1992-12-07 | 1996-05-07 | Rheo-Technology, Ltd. | Method for the production of dispersion strengthened metal matrix composites |
EP0611274B1 (de) * | 1993-02-08 | 1998-12-02 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Träger für scheibenförmige Gegenstände |
JPH09232206A (ja) * | 1996-02-22 | 1997-09-05 | Hitachi Ltd | 塗布装置 |
-
2004
- 2004-09-16 JP JP2004270578A patent/JP2006086384A/ja not_active Ceased
-
2005
- 2005-05-23 WO PCT/JP2005/009332 patent/WO2006030561A1/ja active Application Filing
- 2005-05-23 KR KR1020077004738A patent/KR20070058466A/ko not_active Application Discontinuation
- 2005-05-23 CN CNB2005800303200A patent/CN100481368C/zh not_active Expired - Fee Related
- 2005-05-23 US US11/661,654 patent/US20080264457A1/en not_active Abandoned
- 2005-09-09 TW TW094130988A patent/TW200616138A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8377251B2 (en) | 2008-06-30 | 2013-02-19 | Shibaura Mechatronics Corporation | Spin processing apparatus and spin processing method |
TWI396233B (zh) * | 2008-06-30 | 2013-05-11 | Shibaura Mechatronics Corp | A rotation processing device and a rotation processing method |
Also Published As
Publication number | Publication date |
---|---|
CN101015049A (zh) | 2007-08-08 |
US20080264457A1 (en) | 2008-10-30 |
WO2006030561A1 (ja) | 2006-03-23 |
CN100481368C (zh) | 2009-04-22 |
KR20070058466A (ko) | 2007-06-08 |
JP2006086384A (ja) | 2006-03-30 |
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