TW200616056A - Spin cleaning and drying apparatus and method of spin cleaning and drying - Google Patents

Spin cleaning and drying apparatus and method of spin cleaning and drying

Info

Publication number
TW200616056A
TW200616056A TW094128983A TW94128983A TW200616056A TW 200616056 A TW200616056 A TW 200616056A TW 094128983 A TW094128983 A TW 094128983A TW 94128983 A TW94128983 A TW 94128983A TW 200616056 A TW200616056 A TW 200616056A
Authority
TW
Taiwan
Prior art keywords
drying
spin
substrate
cleaning
spin cleaning
Prior art date
Application number
TW094128983A
Other languages
English (en)
Inventor
Shinichi Tsujimura
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200616056A publication Critical patent/TW200616056A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
TW094128983A 2004-08-25 2005-08-24 Spin cleaning and drying apparatus and method of spin cleaning and drying TW200616056A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004245053A JP2006066501A (ja) 2004-08-25 2004-08-25 スピン洗浄乾燥装置及びスピン洗浄乾燥方法

Publications (1)

Publication Number Publication Date
TW200616056A true TW200616056A (en) 2006-05-16

Family

ID=35941323

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128983A TW200616056A (en) 2004-08-25 2005-08-24 Spin cleaning and drying apparatus and method of spin cleaning and drying

Country Status (4)

Country Link
US (1) US7434588B2 (zh)
JP (1) JP2006066501A (zh)
KR (1) KR20060053113A (zh)
TW (1) TW200616056A (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4607755B2 (ja) * 2005-12-19 2011-01-05 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
WO2007099021A1 (en) * 2006-02-28 2007-09-07 Sez Ag Device and method for liquid treating disc-like articles
KR100739478B1 (ko) * 2006-08-24 2007-07-13 세메스 주식회사 매엽식 기판 처리 장치 및 방법
JP5554661B2 (ja) * 2010-08-27 2014-07-23 株式会社ディスコ ダイシング加工装置
JP6295023B2 (ja) 2012-10-03 2018-03-14 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および研磨装置
CN104388935B (zh) * 2014-10-13 2017-05-03 黄山市恒悦电子有限公司 半导体硅平板芯片台面旋转腐蚀酸及台面旋转腐蚀工艺
KR102493017B1 (ko) * 2015-12-18 2023-01-31 주식회사 케이씨텍 스핀식 헹굼 건조 장치
TWI638394B (zh) * 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
EP3577680A4 (en) 2017-02-06 2020-11-25 Planar Semiconductor, Inc. SUB-NANOMETRIC LEVEL SUBSTRATE CLEANING MECHANISM
US11069521B2 (en) 2017-02-06 2021-07-20 Planar Semiconductor, Inc. Subnanometer-level light-based substrate cleaning mechanism
TWI770115B (zh) * 2017-02-06 2022-07-11 新加坡商平面半導體公司 加工汙水之去除
CN112997277B (zh) * 2018-11-16 2024-04-09 东京毅力科创株式会社 基板处理装置和基板处理装置的清洗方法
JP7214550B2 (ja) * 2019-04-19 2023-01-30 株式会社Ｓｃｒｅｅｎ Ｓｐｅ テック 乾燥装置
JP7233294B2 (ja) * 2019-04-25 2023-03-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、半導体製造方法、および、基板処理装置
CN111775056A (zh) * 2020-07-04 2020-10-16 刘永 一种化学机械研磨的防溅罩
CN113197681A (zh) * 2021-05-07 2021-08-03 太和县人民医院 一种医疗器械手术钳灭菌清洗收集装置
CN115440633B (zh) * 2022-10-17 2023-07-11 北京北方华创微电子装备有限公司 半导体工艺设备和排气调节机构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927229B2 (ja) * 1979-09-19 1984-07-04 富士通株式会社 スピンナ−
JP3116297B2 (ja) * 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
JP3745140B2 (ja) 1998-03-16 2006-02-15 大日本スクリーン製造株式会社 基板処理装置
JP4018958B2 (ja) * 2001-10-30 2007-12-05 大日本スクリーン製造株式会社 基板処理装置
JP4494840B2 (ja) * 2003-06-27 2010-06-30 大日本スクリーン製造株式会社 異物除去装置、基板処理装置および基板処理方法

Also Published As

Publication number Publication date
US20060042666A1 (en) 2006-03-02
KR20060053113A (ko) 2006-05-19
JP2006066501A (ja) 2006-03-09
US7434588B2 (en) 2008-10-14

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