TW200613864A - Photosensitive resin composition for spacer - Google Patents
Photosensitive resin composition for spacerInfo
- Publication number
- TW200613864A TW200613864A TW094126722A TW94126722A TW200613864A TW 200613864 A TW200613864 A TW 200613864A TW 094126722 A TW094126722 A TW 094126722A TW 94126722 A TW94126722 A TW 94126722A TW 200613864 A TW200613864 A TW 200613864A
- Authority
- TW
- Taiwan
- Prior art keywords
- spacer
- resin composition
- photosensitive resin
- liquid crystal
- voltage holding
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Liquid Crystal (AREA)
- Materials For Photolithography (AREA)
Abstract
The object of this invention is to provide a photosensitive resin composition for spacer that can reduce the defect of unfilled area due to the liquid crystal drop amount and prevent the color filter from being damaged by the pressure. The photosensitive resin composition for spacer can not only eliminate the thickness deviation produced in the process, but also prevent decreasing the voltage holding ratio without eluting ions, impurities into the liquid crystal. Also, the photosensitive resin composition for spacer will not affect the alignment of the liquid crystal and has excellent rubbing resistance, sufficient voltage holding ratio and liquid crystal alignment property, as well as good developing property, thermal stability, size stability and compression strength. The photosensitive resin composition for spacer of this invention comprises (a) a resin selected from the group consisting of (i) alkali solvable acrylic resin, (ii) photopolymer resin, and (iii)the mixture thereof; (b) urethane resin; (c) at least two crosslinkable ethylenically unsaturated monomers; (d) a photo-polymerization initiator; and (e) a solvent.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20040062502 | 2004-08-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200613864A true TW200613864A (en) | 2006-05-01 |
TWI407216B TWI407216B (en) | 2013-09-01 |
Family
ID=36076832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094126722A TWI407216B (en) | 2004-08-09 | 2005-08-08 | Photosensitive resin composition for spacer |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4864375B2 (en) |
KR (1) | KR101247243B1 (en) |
CN (1) | CN1734351B (en) |
TW (1) | TWI407216B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI693470B (en) * | 2015-06-30 | 2020-05-11 | 日商富士軟片股份有限公司 | Photosensitive resin composition, method for producing cured film, cured film, and liquid crystal display device |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006257220A (en) * | 2005-03-16 | 2006-09-28 | Jsr Corp | Copolymer, radiation-sensitive resin composition using this, spacer for liquid crystal display element, and liquid crystal display element |
JP4816917B2 (en) * | 2006-03-17 | 2011-11-16 | Jsr株式会社 | Radiation-sensitive resin composition, spacer for liquid crystal display panel, method for forming spacer for liquid crystal display panel, and liquid crystal display panel |
WO2008002660A2 (en) | 2006-06-28 | 2008-01-03 | Northwestern University | Crosslinked polymeric dielectric materials and methods of manufacturing and use thereof |
EP2089442B1 (en) * | 2006-11-28 | 2014-10-01 | Polyera Corporation | Photopolymer-based dielectric materials and methods of preparation and use thereof |
KR100839046B1 (en) * | 2006-12-14 | 2008-06-19 | 제일모직주식회사 | Photosensitive resin composition for liquid crystal device, column spacer using the composition, and display device using the column spacer |
KR101404459B1 (en) * | 2007-04-06 | 2014-06-09 | 주식회사 동진쎄미켐 | Photosensitive paste composition for plasma display panel barrier rib and method for forming plasma display panel barrier rib |
KR100835605B1 (en) * | 2007-06-19 | 2008-06-09 | 제일모직주식회사 | Thermosetting resin composition for color filter of cmos image sensor and color filter using the composition, and cmos image sensor using the color filter |
CN101910928B (en) * | 2007-12-26 | 2013-08-07 | Jsr株式会社 | Liquid crystal aligning agent and method for forming liquid crystal alignment film |
JP5328175B2 (en) * | 2008-02-25 | 2013-10-30 | 富士フイルム株式会社 | Photosensitive resin composition, photospacer and method for producing the same, display device substrate and display device |
KR20090108781A (en) * | 2008-04-14 | 2009-10-19 | 주식회사 동진쎄미켐 | Black paste composition having conductivity property, filter for shielding electromagnetic interference and display device comprising the same |
TWI647532B (en) * | 2014-07-01 | 2019-01-11 | 南韓商東友精細化工有限公司 | Photosensitive resin composition |
CN104730863B (en) * | 2014-11-03 | 2018-08-14 | 杭州福斯特应用材料股份有限公司 | A kind of dry film photoresist |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2933145B2 (en) * | 1991-05-23 | 1999-08-09 | 日本化薬株式会社 | UV curable resin composition for color filter protective film and cured product thereof |
JP3638660B2 (en) * | 1995-05-01 | 2005-04-13 | 松下電器産業株式会社 | Photosensitive resin composition, photosensitive dry film for sandblasting using the same, and etching method using the same |
JP3366859B2 (en) * | 1998-03-05 | 2003-01-14 | 日立化成デュポンマイクロシステムズ株式会社 | Developer for photosensitive polyimide precursor and pattern manufacturing method using the same |
JP3940535B2 (en) * | 1998-11-30 | 2007-07-04 | Jsr株式会社 | Radiation sensitive composition for black resist |
JP2001117225A (en) * | 1999-10-14 | 2001-04-27 | Asahi Kasei Corp | Photosensitive resin composition |
JP2001154206A (en) * | 1999-11-25 | 2001-06-08 | Jsr Corp | Radiation sensitive resin composition for spacer, spacer and liquid crystal display element |
JP2002040225A (en) * | 2000-07-27 | 2002-02-06 | Jsr Corp | Radiation sensitive composition for color liquid crystal display device and color liquid crystal display device |
CN1462284A (en) * | 2000-08-16 | 2003-12-17 | 部鲁尔科学公司 | Photosensitive resin compositions for color filter applications |
JP3467488B2 (en) * | 2001-03-31 | 2003-11-17 | アダムス テクノロジー カンパニー リミテッド | Resist composition for column spacer of liquid crystal display device |
JP2002365795A (en) * | 2001-06-06 | 2002-12-18 | Jsr Corp | Radiation sensitive composition for color liquid crystal display |
JP2004151691A (en) * | 2002-09-30 | 2004-05-27 | Rohm & Haas Electronic Materials Llc | Improved photoresist |
KR100481014B1 (en) * | 2002-10-04 | 2005-04-07 | 주식회사 동진쎄미켐 | Photosensitive resin composition using photopolymer |
JP4082186B2 (en) * | 2002-11-19 | 2008-04-30 | 三菱化学株式会社 | Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same |
EP1567518B1 (en) * | 2002-12-03 | 2009-01-14 | Ciba Holding Inc. | Oxime ester photoinitiators with heteroaromatic groups |
JP2004184871A (en) * | 2002-12-05 | 2004-07-02 | Mitsubishi Chemicals Corp | Blue-violet laser photosensitive composition and image forming material, imaging material and image forming method using the same |
JP2004318047A (en) * | 2003-03-31 | 2004-11-11 | Sumitomo Bakelite Co Ltd | Photosensitive resin composition, laminate, wiring board, and flexible wiring board |
JP2005092198A (en) * | 2003-08-12 | 2005-04-07 | Showa Denko Kk | Photosensitive resin composition |
JP4830310B2 (en) * | 2004-02-23 | 2011-12-07 | 三菱化学株式会社 | Oxime ester-based compound, photopolymerizable composition, and color filter using the same |
-
2005
- 2005-08-05 JP JP2005227393A patent/JP4864375B2/en not_active Expired - Fee Related
- 2005-08-08 KR KR1020050072120A patent/KR101247243B1/en active IP Right Grant
- 2005-08-08 TW TW094126722A patent/TWI407216B/en active
- 2005-08-09 CN CN2005100900241A patent/CN1734351B/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI693470B (en) * | 2015-06-30 | 2020-05-11 | 日商富士軟片股份有限公司 | Photosensitive resin composition, method for producing cured film, cured film, and liquid crystal display device |
Also Published As
Publication number | Publication date |
---|---|
TWI407216B (en) | 2013-09-01 |
JP2006053557A (en) | 2006-02-23 |
KR20060050296A (en) | 2006-05-19 |
CN1734351A (en) | 2006-02-15 |
KR101247243B1 (en) | 2013-03-25 |
CN1734351B (en) | 2010-04-21 |
JP4864375B2 (en) | 2012-02-01 |
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