TW200611286A - Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same - Google Patents
Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the sameInfo
- Publication number
- TW200611286A TW200611286A TW093128279A TW93128279A TW200611286A TW 200611286 A TW200611286 A TW 200611286A TW 093128279 A TW093128279 A TW 093128279A TW 93128279 A TW93128279 A TW 93128279A TW 200611286 A TW200611286 A TW 200611286A
- Authority
- TW
- Taiwan
- Prior art keywords
- metallization surface
- surface treatment
- multilayer ceramic
- ceramic capacitor
- stacked body
- Prior art date
Links
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A process of metallization surface treatment for the multilayer ceramic capacitor is provided, which utilizes the technique of convenient and low-cost metallization surface treatment to manufacture the multilayer ceramic capacitor. The disclosed process includes soaking on the surfaces of two lateral ends of the ceramic stacked body with thin solution of nano-scaled metals, drying the soaked solution of nano-scaled metals under the condition of 100 DEG C for 5 minutes, and carrying out thermal adhesion treatment under 400 DEG C for 10 minutes, so that uniform and delicate metallization surface layer can be formed on the surfaces of two lateral ends of the ceramic stacked body; and finally forming an external electrode which comprises one nickel protecting layer and one solder layer on the surfaces of two lateral ends of the stacked body by electroplating with the plating technique, which comprises one nickel protecting layer and one solder layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93128279A TWI237836B (en) | 2004-09-17 | 2004-09-17 | Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93128279A TWI237836B (en) | 2004-09-17 | 2004-09-17 | Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI237836B TWI237836B (en) | 2005-08-11 |
TW200611286A true TW200611286A (en) | 2006-04-01 |
Family
ID=36929964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93128279A TWI237836B (en) | 2004-09-17 | 2004-09-17 | Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI237836B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115274319A (en) * | 2022-07-18 | 2022-11-01 | 广东风华高新科技股份有限公司 | Preparation method of multilayer ceramic capacitor |
-
2004
- 2004-09-17 TW TW93128279A patent/TWI237836B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI237836B (en) | 2005-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |