TW200611286A - Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same - Google Patents

Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same

Info

Publication number
TW200611286A
TW200611286A TW093128279A TW93128279A TW200611286A TW 200611286 A TW200611286 A TW 200611286A TW 093128279 A TW093128279 A TW 093128279A TW 93128279 A TW93128279 A TW 93128279A TW 200611286 A TW200611286 A TW 200611286A
Authority
TW
Taiwan
Prior art keywords
metallization surface
surface treatment
multilayer ceramic
ceramic capacitor
stacked body
Prior art date
Application number
TW093128279A
Other languages
Chinese (zh)
Other versions
TWI237836B (en
Inventor
Wei-Chang Li
Sheng-Huei Shang
Original Assignee
Prosperity Dielectrics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prosperity Dielectrics Co Ltd filed Critical Prosperity Dielectrics Co Ltd
Priority to TW93128279A priority Critical patent/TWI237836B/en
Application granted granted Critical
Publication of TWI237836B publication Critical patent/TWI237836B/en
Publication of TW200611286A publication Critical patent/TW200611286A/en

Links

Landscapes

  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A process of metallization surface treatment for the multilayer ceramic capacitor is provided, which utilizes the technique of convenient and low-cost metallization surface treatment to manufacture the multilayer ceramic capacitor. The disclosed process includes soaking on the surfaces of two lateral ends of the ceramic stacked body with thin solution of nano-scaled metals, drying the soaked solution of nano-scaled metals under the condition of 100 DEG C for 5 minutes, and carrying out thermal adhesion treatment under 400 DEG C for 10 minutes, so that uniform and delicate metallization surface layer can be formed on the surfaces of two lateral ends of the ceramic stacked body; and finally forming an external electrode which comprises one nickel protecting layer and one solder layer on the surfaces of two lateral ends of the stacked body by electroplating with the plating technique, which comprises one nickel protecting layer and one solder layer.
TW93128279A 2004-09-17 2004-09-17 Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same TWI237836B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93128279A TWI237836B (en) 2004-09-17 2004-09-17 Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93128279A TWI237836B (en) 2004-09-17 2004-09-17 Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same

Publications (2)

Publication Number Publication Date
TWI237836B TWI237836B (en) 2005-08-11
TW200611286A true TW200611286A (en) 2006-04-01

Family

ID=36929964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93128279A TWI237836B (en) 2004-09-17 2004-09-17 Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same

Country Status (1)

Country Link
TW (1) TWI237836B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115274319A (en) * 2022-07-18 2022-11-01 广东风华高新科技股份有限公司 Preparation method of multilayer ceramic capacitor

Also Published As

Publication number Publication date
TWI237836B (en) 2005-08-11

Similar Documents

Publication Publication Date Title
TW200701275A (en) Ceramic electronic component and manufacturing method thereof
TW200508425A (en) Method of manufacturing electronic device
MY120628A (en) Electronic component having external electrodes and method for the manufacture thereof
ATE479520T1 (en) FLUX-FREE BRAZING
MY138109A (en) Electronic part and surface treatment method of the same
ATE394909T1 (en) THIN FILM ARRANGEMENT AND METHOD FOR PRODUCING SUCH A THIN FILM ARRANGEMENT
BR0114432A (en) Metallized sheet process for its production as well as its use
KR20100068593A (en) Method for laminating copper layer on seramic board
WO2008020910A3 (en) Process for improving the adhesion of polymeric materials to metal surfaces
WO2005104190A3 (en) Semiconductor processing methods for forming electrical contacts, and semiconductor structures
TW200726336A (en) Ceramic substrate, electronic device, and manufacturing method of ceramic substrate
TW200700221A (en) Copper clad laminated sheet and its manufacturing method
TW200710287A (en) Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
MY140407A (en) Leadframe comprising tin plating or an intermetallic layer formed therefrom
TW200707666A (en) Semiconductor device and semiconductor device production method
JP2001130986A (en) Copper plated ceramic board, peltier element using the same and method for producing copper plated ceramic board
TW200746330A (en) Microelectronic assembly with back side metallization and method for forming the same
WO2011056698A3 (en) Immersion tin silver plating in electronics manufacture
ATE500063T1 (en) METHOD FOR PRODUCING BONDED SUBSTRATES AND ASSOCIATED SUBSTRATE
TW200610128A (en) Chip carrier and chip package structure thereof
TW201118059A (en) Manufacturing process for high precision ceramic substrate
TW200615135A (en) Carrier film for ceramic green sheet, ceramic green sheet processing method using it and manufacturing method of electronic part
TW200611286A (en) Process of metallization surface treatment for the multilayer ceramic capacitor and structure of the same
TW200640938A (en) Resin base material, electronic part base material having electroless plating applied thereon, and manufacturing method of the electronic part base material
JP7118426B2 (en) Printed Circuit Surface Finishes, Methods of Use, and Assemblies Made Therefrom

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees