TW200610430A - Method and device for mounting thin metal plate on frame - Google Patents

Method and device for mounting thin metal plate on frame

Info

Publication number
TW200610430A
TW200610430A TW094124565A TW94124565A TW200610430A TW 200610430 A TW200610430 A TW 200610430A TW 094124565 A TW094124565 A TW 094124565A TW 94124565 A TW94124565 A TW 94124565A TW 200610430 A TW200610430 A TW 200610430A
Authority
TW
Taiwan
Prior art keywords
metal plate
thin metal
frame
tensile force
state
Prior art date
Application number
TW094124565A
Other languages
Chinese (zh)
Other versions
TWI422270B (en
Inventor
Terunao Tsuchiya
Takaichi Shimomura
Takashi Yaguchi
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004215121A external-priority patent/JP4656886B2/en
Priority claimed from JP2004364081A external-priority patent/JP4671680B2/en
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of TW200610430A publication Critical patent/TW200610430A/en
Application granted granted Critical
Publication of TWI422270B publication Critical patent/TWI422270B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Resistance Welding (AREA)

Abstract

Each side (11a) of a thin metal plate (11) is held with clamps (27). The thin metal plate (11) is pulled by the clamps (27), and tensile force by each clamp is adjusted to hold the thin metal plate (11) in a flat state without distortion and sagging. At the same time, a frame (13) is elastically deformed by pressing it, with a force having the same magnitude as the tensile force applied to the thin metal plate (11), in the opposite direction to the tensile force. Then, in this state the thin metal plate (11) is welded and fixed to the frame (13) by a spot welding machine (40). When the thin metal plate (11) and the frame (13) are freed, tensile force remaining in the plate (11) is cancelled by restoring force of the frame (13). This prevents the frame (13) from being pulled by the thin metal plate (11) and deformed, and the frame (13) can hold the thin metal plate (11) in a state without distortion and sagging.
TW094124565A 2004-07-23 2005-07-20 Method and apparatus for sealing sheet of metal thin plate for manufacturing step of organic EL element TWI422270B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004215121A JP4656886B2 (en) 2004-07-23 2004-07-23 Method and apparatus for laminating metal thin plate
JP2004364081A JP4671680B2 (en) 2004-12-16 2004-12-16 Metal mask frame mounting method and apparatus

Publications (2)

Publication Number Publication Date
TW200610430A true TW200610430A (en) 2006-03-16
TWI422270B TWI422270B (en) 2014-01-01

Family

ID=35785287

Family Applications (2)

Application Number Title Priority Date Filing Date
TW094124565A TWI422270B (en) 2004-07-23 2005-07-20 Method and apparatus for sealing sheet of metal thin plate for manufacturing step of organic EL element
TW100149219A TWI399123B (en) 2004-07-23 2005-07-20 The organic EL element manufacturing step is a metal sheet mechanism

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100149219A TWI399123B (en) 2004-07-23 2005-07-20 The organic EL element manufacturing step is a metal sheet mechanism

Country Status (3)

Country Link
KR (2) KR100972183B1 (en)
TW (2) TWI422270B (en)
WO (1) WO2006009180A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503049B (en) * 2011-08-25 2015-10-01 Hansong Co Ltd Apparatus for manufacturing divided mask frame assembly for big size of amoled multi cell tv and mobile panel using horizontal moving type gripper and anticline lighting device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101352353B1 (en) * 2012-08-31 2014-01-16 주식회사 힘스 Clamping apparatus
KR101374759B1 (en) * 2012-10-10 2014-03-17 주식회사 케이피에스 Pressure deformation apparatus for mask frame
CN106148892B (en) * 2016-07-25 2019-04-02 京东方科技集团股份有限公司 Throw the net method and mask plate, substrate, the display device of one seed mask plate
JP7240623B2 (en) * 2018-11-30 2023-03-16 大日本印刷株式会社 Evaporation mask device manufacturing apparatus and deposition mask device manufacturing method
KR102600425B1 (en) * 2019-01-02 2023-11-09 에이피에스홀딩스 주식회사 Jig for sheet and processing apparatus thereof
CN114346717B (en) * 2021-12-22 2024-02-27 中国电子科技集团公司第十四研究所 Clamp combination for controlling machining deformation of unilateral slotting thin-wall waveguide cavity

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373950A (en) * 1989-08-14 1991-03-28 Fujitsu Ltd Manufacture of mask for exposing
JP3076800B1 (en) * 1999-06-08 2000-08-14 三谷電子工業株式会社 Screen mask
JP3598927B2 (en) * 1999-12-27 2004-12-08 松下電器産業株式会社 Method of manufacturing shadow mask assembly and method of manufacturing cathode ray tube
US6878208B2 (en) * 2002-04-26 2005-04-12 Tohoku Pioneer Corporation Mask for vacuum deposition and organic EL display manufactured by using the same
JP4173722B2 (en) * 2002-11-29 2008-10-29 三星エスディアイ株式会社 Vapor deposition mask, organic EL element manufacturing method using the same, and organic EL element
JP2004311336A (en) * 2003-04-10 2004-11-04 Dainippon Printing Co Ltd Method and device for frame-sticking metal thin plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503049B (en) * 2011-08-25 2015-10-01 Hansong Co Ltd Apparatus for manufacturing divided mask frame assembly for big size of amoled multi cell tv and mobile panel using horizontal moving type gripper and anticline lighting device

Also Published As

Publication number Publication date
KR20070052281A (en) 2007-05-21
KR20100018625A (en) 2010-02-17
TWI399123B (en) 2013-06-11
TWI422270B (en) 2014-01-01
TW201223324A (en) 2012-06-01
KR100972183B1 (en) 2010-07-26
WO2006009180A1 (en) 2006-01-26
KR100972182B1 (en) 2010-07-26

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