TW200610079A - Die pickup device - Google Patents

Die pickup device

Info

Publication number
TW200610079A
TW200610079A TW094112335A TW94112335A TW200610079A TW 200610079 A TW200610079 A TW 200610079A TW 094112335 A TW094112335 A TW 094112335A TW 94112335 A TW94112335 A TW 94112335A TW 200610079 A TW200610079 A TW 200610079A
Authority
TW
Taiwan
Prior art keywords
die
push
pickup device
picked
raised
Prior art date
Application number
TW094112335A
Other languages
English (en)
Inventor
Kazuhiro Fujisawa
Yutaka Odaka
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200610079A publication Critical patent/TW200610079A/zh

Links

TW094112335A 2004-05-17 2005-04-19 Die pickup device TW200610079A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004145837 2004-05-17
JP2004160407A JP4369298B2 (ja) 2004-05-17 2004-05-31 ダイピックアップ装置及びダイピックアップ方法

Publications (1)

Publication Number Publication Date
TW200610079A true TW200610079A (en) 2006-03-16

Family

ID=35773111

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112335A TW200610079A (en) 2004-05-17 2005-04-19 Die pickup device

Country Status (3)

Country Link
JP (1) JP4369298B2 (zh)
KR (1) KR100639553B1 (zh)
TW (1) TW200610079A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046381B1 (ko) * 2007-11-22 2011-07-05 주식회사 하이닉스반도체 다이 픽업 장치 및 이를 이용한 반도체 칩 분리 방법
JP2013034001A (ja) * 2012-10-25 2013-02-14 Hitachi High-Tech Instruments Co Ltd ダイボンダ並びにピックアップ方法及びピックアップ装置
JP6324857B2 (ja) * 2014-09-18 2018-05-16 ファスフォードテクノロジ株式会社 ダイボンダ並びにボンディング方法及びピックアップ装置
KR101684802B1 (ko) * 2015-10-12 2016-12-08 세메스 주식회사 반도체 패키지들을 진공 흡착하기 위한 진공 테이블
KR101684803B1 (ko) * 2015-10-13 2016-12-08 세메스 주식회사 반도체 패키지들을 진공 흡착하기 위한 진공 테이블
JP7137306B2 (ja) * 2017-12-11 2022-09-14 株式会社Fuji 電子部品装着装置

Also Published As

Publication number Publication date
KR20060047924A (ko) 2006-05-18
JP2006004956A (ja) 2006-01-05
JP4369298B2 (ja) 2009-11-18
KR100639553B1 (ko) 2006-10-30

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