TW200608595A - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
TW200608595A
TW200608595A TW093124827A TW93124827A TW200608595A TW 200608595 A TW200608595 A TW 200608595A TW 093124827 A TW093124827 A TW 093124827A TW 93124827 A TW93124827 A TW 93124827A TW 200608595 A TW200608595 A TW 200608595A
Authority
TW
Taiwan
Prior art keywords
light
heat
emitting device
circuit board
led
Prior art date
Application number
TW093124827A
Other languages
Chinese (zh)
Other versions
TWI244776B (en
Inventor
Chun-Long Chen
jia-hong Li
Cang-Xian Huang
Original Assignee
Invni Tech Developing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Invni Tech Developing Corp filed Critical Invni Tech Developing Corp
Priority to TW93124827A priority Critical patent/TWI244776B/en
Application granted granted Critical
Publication of TWI244776B publication Critical patent/TWI244776B/en
Publication of TW200608595A publication Critical patent/TW200608595A/en

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Abstract

This invention relates to a light-emitting device with enhanced heat-dissipation efficiency and a positioning circuit board of light-emitting module and its light-emitting device suitable in the occasion of mass production. This disclosed light-emitting device comprises: a plurality of LED modules, one substrate containing a plurality of through holes and printed with electronic circuits, and one heat-dissipation unit. The heat energy generated by LED modules is transferred, by means of its LED base and metallic heat-dissipation plate, to the heat-dissipation unit, which contacts the external environment. During installation, each of LED modules is placed into the plural through holes on the printed circuit board to position each LED module and make it connected to the electronic circuit on the board; and, subsequently, the heat-dissipation unit is fixed to complete the installation. Therefore, this disclosed positioning circuit board of light-emitting module and its light-emitting device are suitable in the occasion of mass production.
TW93124827A 2004-08-18 2004-08-18 Light-emitting device TWI244776B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93124827A TWI244776B (en) 2004-08-18 2004-08-18 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93124827A TWI244776B (en) 2004-08-18 2004-08-18 Light-emitting device

Publications (2)

Publication Number Publication Date
TWI244776B TWI244776B (en) 2005-12-01
TW200608595A true TW200608595A (en) 2006-03-01

Family

ID=37154891

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93124827A TWI244776B (en) 2004-08-18 2004-08-18 Light-emitting device

Country Status (1)

Country Link
TW (1) TWI244776B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401017B (en) * 2010-05-25 2013-07-01 Sunonwealth Electr Mach Ind Co Combining method for heat dissipating module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381128B (en) * 2007-12-31 2013-01-01 Foxsemicon Integrated Tech Inc Lighting emitting diode illuminator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401017B (en) * 2010-05-25 2013-07-01 Sunonwealth Electr Mach Ind Co Combining method for heat dissipating module

Also Published As

Publication number Publication date
TWI244776B (en) 2005-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees