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Application filed by Gigno Technology Co LtdfiledCriticalGigno Technology Co Ltd
Priority to TW95124048ApriorityCriticalpatent/TW200802954A/en
Publication of TW200802954ApublicationCriticalpatent/TW200802954A/en
A light emitting diode module includes a metal circuit substrate and a plurality of light emitting diodes (LEDs). The metal circuit substrate sequentially includes a metal board, a heat conductive insulating layer and an interconnection layer. The LEDs are respectively disposed on the metal circuit substrate and are electrically connected with the interconnection layer.