TW200744228A - LED device module with high heat-dissipation - Google Patents
LED device module with high heat-dissipationInfo
- Publication number
- TW200744228A TW200744228A TW095118390A TW95118390A TW200744228A TW 200744228 A TW200744228 A TW 200744228A TW 095118390 A TW095118390 A TW 095118390A TW 95118390 A TW95118390 A TW 95118390A TW 200744228 A TW200744228 A TW 200744228A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipation
- led device
- flip
- chip type
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An LED device module with high heat-dissipation is disclosed, which comprises: a module substrate having plural through holes, plural flip-chip type LED devices fixed to the module substrate, and at least a heat-dissipation plate. The package baseboard of the LED device has a circuit layer formed on a heat-conducting and electrically-insulative base material surface to transmit the electrical signal. Since the heat-dissipation path is different from the electrical-conduction path, the illumination-brightness stability of the flip-chip type LED is increased. Also, the surface of flip-chip type LED has a heat-dissipation sheet. The heat-dissipation sheet is mutually connected with the heat-dissipation plate through the corresponding through hole on the module substrate by heat-conduction glue or solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95118390A TWI325640B (en) | 2006-05-24 | 2006-05-24 | Led device module with high heat dissipation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95118390A TWI325640B (en) | 2006-05-24 | 2006-05-24 | Led device module with high heat dissipation |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200744228A true TW200744228A (en) | 2007-12-01 |
TWI325640B TWI325640B (en) | 2010-06-01 |
Family
ID=45074279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95118390A TWI325640B (en) | 2006-05-24 | 2006-05-24 | Led device module with high heat dissipation |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI325640B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7985006B2 (en) | 2008-06-10 | 2011-07-26 | Advanced Optoelectronic Technology, Inc. | Light source device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108990254B (en) * | 2017-06-01 | 2021-04-16 | 瑷司柏电子股份有限公司 | Printed circuit board with built-in longitudinal heat dissipation ceramic block and circuit assembly with same |
-
2006
- 2006-05-24 TW TW95118390A patent/TWI325640B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7985006B2 (en) | 2008-06-10 | 2011-07-26 | Advanced Optoelectronic Technology, Inc. | Light source device |
Also Published As
Publication number | Publication date |
---|---|
TWI325640B (en) | 2010-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |