TW200744228A - LED device module with high heat-dissipation - Google Patents

LED device module with high heat-dissipation

Info

Publication number
TW200744228A
TW200744228A TW095118390A TW95118390A TW200744228A TW 200744228 A TW200744228 A TW 200744228A TW 095118390 A TW095118390 A TW 095118390A TW 95118390 A TW95118390 A TW 95118390A TW 200744228 A TW200744228 A TW 200744228A
Authority
TW
Taiwan
Prior art keywords
heat
dissipation
led device
flip
chip type
Prior art date
Application number
TW095118390A
Other languages
Chinese (zh)
Other versions
TWI325640B (en
Inventor
Wen-Liang Tseng
Lung-Hsin Chen
Original Assignee
Advanced Optoelectronic Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Optoelectronic Tech filed Critical Advanced Optoelectronic Tech
Priority to TW95118390A priority Critical patent/TWI325640B/en
Publication of TW200744228A publication Critical patent/TW200744228A/en
Application granted granted Critical
Publication of TWI325640B publication Critical patent/TWI325640B/en

Links

Landscapes

  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An LED device module with high heat-dissipation is disclosed, which comprises: a module substrate having plural through holes, plural flip-chip type LED devices fixed to the module substrate, and at least a heat-dissipation plate. The package baseboard of the LED device has a circuit layer formed on a heat-conducting and electrically-insulative base material surface to transmit the electrical signal. Since the heat-dissipation path is different from the electrical-conduction path, the illumination-brightness stability of the flip-chip type LED is increased. Also, the surface of flip-chip type LED has a heat-dissipation sheet. The heat-dissipation sheet is mutually connected with the heat-dissipation plate through the corresponding through hole on the module substrate by heat-conduction glue or solder.
TW95118390A 2006-05-24 2006-05-24 Led device module with high heat dissipation TWI325640B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95118390A TWI325640B (en) 2006-05-24 2006-05-24 Led device module with high heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95118390A TWI325640B (en) 2006-05-24 2006-05-24 Led device module with high heat dissipation

Publications (2)

Publication Number Publication Date
TW200744228A true TW200744228A (en) 2007-12-01
TWI325640B TWI325640B (en) 2010-06-01

Family

ID=45074279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95118390A TWI325640B (en) 2006-05-24 2006-05-24 Led device module with high heat dissipation

Country Status (1)

Country Link
TW (1) TWI325640B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7985006B2 (en) 2008-06-10 2011-07-26 Advanced Optoelectronic Technology, Inc. Light source device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108990254B (en) * 2017-06-01 2021-04-16 瑷司柏电子股份有限公司 Printed circuit board with built-in longitudinal heat dissipation ceramic block and circuit assembly with same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7985006B2 (en) 2008-06-10 2011-07-26 Advanced Optoelectronic Technology, Inc. Light source device

Also Published As

Publication number Publication date
TWI325640B (en) 2010-06-01

Similar Documents

Publication Publication Date Title
TW200736755A (en) Heat dissipation structure of backlight module
WO2008099784A1 (en) Led package and structure for mounting three-dimensional circuit component
EP1667226A3 (en) Thermal management of surface-mount circuit devices
TW200733436A (en) Light emitting diode package structure and fabrication method thereof
TW200802790A (en) Electronic substrate, semiconductor device, and electronic device
WO2011031417A3 (en) Electronic device submounts with thermally conductive vias and light emitting devices including the same
ATE532400T1 (en) HEAT-CONDUCTIVE MOUNTING ELEMENT FOR ATTACHING AN EMBLED CIRCUIT BOARD TO A HEATSINK
WO2007136941A3 (en) Flip chip mlp with folded heat sink
TW200705621A (en) Interposer and semiconductor device
WO2008146603A1 (en) Semiconductor device and its manufacturing method, and display and its manufacturing method
EP1770773A3 (en) Heat spreader module and method of manufacturing same
WO2008112128A3 (en) Light emitting diode for harsh environments
WO2009022808A3 (en) Circuit board for light emitting device package and light emitting unit using the same
WO2008083145A3 (en) Control of standoff height between packages with a solder-embedded tape
EP2170024A3 (en) Backlight unit equipped with light emitting diodes
SG148987A1 (en) Inter-connecting structure for semiconductor device package and method of the same
TW200504952A (en) Method of manufacturing semiconductor package and method of manufacturing semiconductor device
TWI402949B (en)
ATE517434T1 (en) ELECTRONIC DEVICE HAVING A BASE PLATE
SG128546A1 (en) Low cte substrates for use with low-k flip-chip package devices
TW200802834A (en) Semiconductor device and method for making same
TW200704354A (en) Printed circuit board with improved thermal dissipating structure and electronic device with the same
TW200744228A (en) LED device module with high heat-dissipation
TW200742116A (en) Surface mounting optoelectronic device
TWI268589B (en) Electronic apparatus with thermal module

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees