TW200606084A - Storage box for FOSB (front opening shipping box) - Google Patents

Storage box for FOSB (front opening shipping box)

Info

Publication number
TW200606084A
TW200606084A TW093123979A TW93123979A TW200606084A TW 200606084 A TW200606084 A TW 200606084A TW 093123979 A TW093123979 A TW 093123979A TW 93123979 A TW93123979 A TW 93123979A TW 200606084 A TW200606084 A TW 200606084A
Authority
TW
Taiwan
Prior art keywords
fosb
box
housing member
storage box
front opening
Prior art date
Application number
TW093123979A
Other languages
Chinese (zh)
Inventor
Yu-Chuan Liou
Original Assignee
Power Geode Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Power Geode Technology Co Ltd filed Critical Power Geode Technology Co Ltd
Priority to TW093123979A priority Critical patent/TW200606084A/en
Priority to JP2004369242A priority patent/JP2006052014A/en
Priority to US11/035,512 priority patent/US20060032785A1/en
Publication of TW200606084A publication Critical patent/TW200606084A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl

Abstract

To form a closed space within a storage box for an FOSB by engaging first and second housing members by the use of first and second fastening elements. The storage box of the FOSB used for storage includes: the first housing member having a first portion of the FOSB and the first fastening element mounted on the first housing member, the second housing member used for containing a second portion of the FOSB such that a closed space is formed by the first housing member and the second housing member for containing the FOSB, and a second fastening member mounted on the second housing member and forming a first engaging mechanism by engaging with the first fastening element for positioning and securing the FOSB in the closed space.
TW093123979A 2004-08-10 2004-08-10 Storage box for FOSB (front opening shipping box) TW200606084A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093123979A TW200606084A (en) 2004-08-10 2004-08-10 Storage box for FOSB (front opening shipping box)
JP2004369242A JP2006052014A (en) 2004-08-10 2004-12-21 Storage box for fosb (front opening shipping box)
US11/035,512 US20060032785A1 (en) 2004-08-10 2005-01-14 Storage box for wafer shipping box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093123979A TW200606084A (en) 2004-08-10 2004-08-10 Storage box for FOSB (front opening shipping box)

Publications (1)

Publication Number Publication Date
TW200606084A true TW200606084A (en) 2006-02-16

Family

ID=35798975

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123979A TW200606084A (en) 2004-08-10 2004-08-10 Storage box for FOSB (front opening shipping box)

Country Status (3)

Country Link
US (1) US20060032785A1 (en)
JP (1) JP2006052014A (en)
TW (1) TW200606084A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI348443B (en) * 2008-08-07 2011-09-11 Gudeng Prec Industral Co Ltd Carrier of reticle pod and the fixing element thereof
CN101677073B (en) * 2008-09-17 2010-12-08 家登精密工业股份有限公司 Front opening type wafer box with elliptic latch structure
JP5687575B2 (en) * 2011-07-11 2015-03-18 株式会社東芝 Wafer transfer container protection case
JP6119287B2 (en) * 2013-02-14 2017-04-26 株式会社Sumco Buffer material for packing wafer storage containers
TWI550216B (en) * 2014-07-21 2016-09-21 第一傳動科技股份有限公司 Linear actuator
US10843852B2 (en) * 2017-05-25 2020-11-24 Creative Plastic Concepts, Llc Lid with pylons for supporting cross beams

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5873468A (en) * 1995-11-16 1999-02-23 Sumitomo Sitix Corporation Thin-plate supporting container with filter means
US6230895B1 (en) * 1999-08-20 2001-05-15 David P. Laube Container for transporting refurbished semiconductor processing equipment
AU2002218763A1 (en) * 2000-07-10 2002-01-21 Asyst Technologies, Inc. Smif container including an electrostatic dissipative reticle support structure

Also Published As

Publication number Publication date
JP2006052014A (en) 2006-02-23
US20060032785A1 (en) 2006-02-16

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