TW200605412A - Luminous diodes arrangement - Google Patents

Luminous diodes arrangement

Info

Publication number
TW200605412A
TW200605412A TW094119823A TW94119823A TW200605412A TW 200605412 A TW200605412 A TW 200605412A TW 094119823 A TW094119823 A TW 094119823A TW 94119823 A TW94119823 A TW 94119823A TW 200605412 A TW200605412 A TW 200605412A
Authority
TW
Taiwan
Prior art keywords
luminous diodes
arrangement
radiation
luminous
coupling
Prior art date
Application number
TW094119823A
Other languages
English (en)
Other versions
TWI341041B (en
Inventor
Stefan Groetsch
Guenter Waitl
Mario Wanninger
Georg Bogner
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200605412A publication Critical patent/TW200605412A/zh
Application granted granted Critical
Publication of TWI341041B publication Critical patent/TWI341041B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW094119823A 2004-06-30 2005-06-15 Luminous diodes arrangement TWI341041B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004031686 2004-06-30
DE102004045947A DE102004045947A1 (de) 2004-06-30 2004-09-22 Leuchtdiodenanordnung

Publications (2)

Publication Number Publication Date
TW200605412A true TW200605412A (en) 2006-02-01
TWI341041B TWI341041B (en) 2011-04-21

Family

ID=34970574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119823A TWI341041B (en) 2004-06-30 2005-06-15 Luminous diodes arrangement

Country Status (8)

Country Link
US (1) US8003998B2 (zh)
EP (2) EP1761959B1 (zh)
JP (1) JP5166871B2 (zh)
KR (1) KR101187090B1 (zh)
CN (1) CN1981390B (zh)
DE (1) DE102004045947A1 (zh)
TW (1) TWI341041B (zh)
WO (1) WO2006002603A2 (zh)

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WO2009000106A1 (fr) * 2007-06-25 2008-12-31 Jenshyan Chen Dispositif électroluminescent
DE102007039291A1 (de) 2007-08-20 2009-02-26 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleitermodul und Verfahren zur Herstellung eines solchen
JP5125437B2 (ja) * 2007-11-15 2013-01-23 豊田合成株式会社 照明体
DE102008013028A1 (de) 2008-03-07 2009-09-10 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil, Gerät zur Aufzeichnung von Bildinformation und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
WO2010029872A1 (ja) * 2008-09-09 2010-03-18 昭和電工株式会社 発光装置、発光モジュール、表示装置
DE102009022682A1 (de) * 2009-05-26 2010-12-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Leuchtdiode
WO2011027267A1 (en) * 2009-09-01 2011-03-10 Koninklijke Philips Electronics N.V. Illumination system and luminaire
DE102009042479A1 (de) 2009-09-24 2011-03-31 Msg Lithoglas Ag Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug
KR20120024104A (ko) * 2010-09-06 2012-03-14 서울옵토디바이스주식회사 발광 소자
US8624482B2 (en) * 2011-09-01 2014-01-07 Toshiba Techno Center Inc. Distributed bragg reflector for reflecting light of multiple wavelengths from an LED
US8845115B2 (en) 2012-02-16 2014-09-30 Qualcomm Mems Technologies, Inc. Flash illumination system
US8979347B2 (en) 2012-04-24 2015-03-17 Qualcomm Mems Technologies, Inc. Illumination systems and methods
US9223080B2 (en) 2012-04-24 2015-12-29 Qualcomm Mems Technologies, Inc. Light guide with narrow angle light output and methods
US8727567B1 (en) 2012-12-18 2014-05-20 Jds Uniphase Corporation Semiconductor light source having a reflector
DE102013207111B4 (de) * 2013-04-19 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
EP3001466B1 (en) 2013-05-23 2019-07-03 LG Innotek Co., Ltd. Light-emitting module
KR102086359B1 (ko) * 2013-08-23 2020-03-10 삼성전자주식회사 발광모듈
KR101834087B1 (ko) * 2016-09-30 2018-04-13 조성은 리플렉터 및 렌즈 일체형 하우징을 포함하는 패키지 및 그 제조방법
DE102016122770B4 (de) * 2016-11-25 2022-01-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauteil mit einem optoelektronischen Bauelement
DE102019218203A1 (de) * 2019-11-25 2021-05-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Led-hintergrundbeleuchtungssystem

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JP4504662B2 (ja) 2003-04-09 2010-07-14 シチズン電子株式会社 Ｌｅｄランプ
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Also Published As

Publication number Publication date
EP1761959B1 (de) 2018-10-24
EP1761959A2 (de) 2007-03-14
US20080315227A1 (en) 2008-12-25
KR101187090B1 (ko) 2012-09-28
JP5166871B2 (ja) 2013-03-21
US8003998B2 (en) 2011-08-23
TWI341041B (en) 2011-04-21
EP2328191A2 (de) 2011-06-01
DE102004045947A1 (de) 2006-01-19
WO2006002603A3 (de) 2006-04-27
EP2328191B1 (de) 2014-09-03
CN1981390B (zh) 2010-11-17
WO2006002603A2 (de) 2006-01-12
KR20070036155A (ko) 2007-04-02
CN1981390A (zh) 2007-06-13
EP2328191A3 (de) 2011-07-06
JP2008505504A (ja) 2008-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees