TW200605101A - Thermistor thin-film and its forming method - Google Patents

Thermistor thin-film and its forming method

Info

Publication number
TW200605101A
TW200605101A TW094120307A TW94120307A TW200605101A TW 200605101 A TW200605101 A TW 200605101A TW 094120307 A TW094120307 A TW 094120307A TW 94120307 A TW94120307 A TW 94120307A TW 200605101 A TW200605101 A TW 200605101A
Authority
TW
Taiwan
Prior art keywords
film
mn3o4
co3o4
thermistor thin
metal oxide
Prior art date
Application number
TW094120307A
Other languages
Chinese (zh)
Other versions
TWI371762B (en
Inventor
Syunichiro Ishigami
Kunio Yamaguchi
Koji Yotsumoto
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005144921A external-priority patent/JP2006032910A/en
Priority claimed from JP2005147142A external-priority patent/JP2006324520A/en
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of TW200605101A publication Critical patent/TW200605101A/en
Application granted granted Critical
Publication of TWI371762B publication Critical patent/TWI371762B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008Thermistors
    • H01L31/02966
    • H01L31/09

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

This invention provides a forming method of a thermistor thin-film. It suppresses the generation of self-heating, and is exempted from mechanical defects, such as deformation and crack for relevant thermistor thin-film. Further, it provides an excellent mechanical strength and film uniformity for thermistor film. Furthermore, it can form the high-precision patterns. Moreover, it possesses the necessarily electric properties required for infrared detection sensors. Therefore, it is suitable for an infrared detection sensor utilized of a film of transition metal oxide. Such a thermistor thin-film comprises crystals whose 90% or more are occupied by crystal grains of 0.05 to 0.2 μm with aspect ratio larger than 0.5, but less than 2. It is composed of an Mn3O4-Co3O4 or Mn3O4-Co3O4-Fe2O3 composite metal oxide. Such a thermistor thin-film can be formed by a process providing by sputtering coating a 0.05 to 0.2 μm thick film of Mn3O4-Co3O4 or Mn3O4-Co3O4-Fe2O3 composite metal oxide on a foundation layer of SiO2 and subjecting the resultant film to heat treatment at 550 DEG C to 650 DEG C in an environment of atmospheric air or atmosphere of nitrogen and oxygen mixed together.
TW094120307A 2004-06-18 2005-06-17 Thermistor thin-film and its forming method TW200605101A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004181301 2004-06-18
JP2005041298 2005-02-17
JP2005144921A JP2006032910A (en) 2004-06-18 2005-05-18 Thermistor thin film and its forming method
JP2005147142A JP2006324520A (en) 2005-05-19 2005-05-19 Thermistor thin film and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200605101A true TW200605101A (en) 2006-02-01
TWI371762B TWI371762B (en) 2012-09-01

Family

ID=35782603

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120307A TW200605101A (en) 2004-06-18 2005-06-17 Thermistor thin-film and its forming method

Country Status (4)

Country Link
KR (1) KR101121399B1 (en)
CN (1) CN1969345B (en)
TW (1) TW200605101A (en)
WO (1) WO2006003791A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008084991A (en) * 2006-09-26 2008-04-10 Mitsubishi Materials Corp Thermistor thin film and thin film thermistor device
KR101768168B1 (en) 2015-05-29 2017-08-17 한국세라믹기술원 Method of forming flexible film thermistor and Temperature sensor
CN108168723A (en) * 2017-12-22 2018-06-15 雷念程 A kind of film temperature sensor chip and its manufacturing method
CN109484039B (en) * 2018-12-03 2020-03-24 山东华菱电子股份有限公司 Method for manufacturing heating substrate for thermal printing head
WO2020137681A1 (en) * 2018-12-28 2020-07-02 株式会社村田製作所 Composite, and structure and thermistor using same
JP7134920B2 (en) * 2019-06-17 2022-09-12 日立Astemo株式会社 Thermal sensor device
CN112366052A (en) * 2020-11-09 2021-02-12 肇庆市金龙宝电子有限公司 High-precision thermistor chip for medical body temperature measurement and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60208803A (en) 1984-04-02 1985-10-21 株式会社日立製作所 Method of producing thin film thermistor
JPH08306508A (en) * 1995-05-08 1996-11-22 Nippondenso Co Ltd Thin film thermistor element and its manufacturing method
CN1046049C (en) * 1996-12-14 1999-10-27 中国科学院新疆物理研究所 Oxidate semi-conductor thermosensitive resistance and mfg. method thereof
JPH10256004A (en) 1997-03-11 1998-09-25 Shibaura Denshi:Kk Thin-film thermistor
JP4279399B2 (en) * 1999-06-03 2009-06-17 パナソニック株式会社 Thin film thermistor element and method for manufacturing thin film thermistor element
JP2000348905A (en) * 1999-06-03 2000-12-15 Matsushita Electric Ind Co Ltd Thin-film thermistor element and manufacture of the same

Also Published As

Publication number Publication date
KR101121399B1 (en) 2012-03-21
TWI371762B (en) 2012-09-01
CN1969345A (en) 2007-05-23
CN1969345B (en) 2011-10-05
KR20070029219A (en) 2007-03-13
WO2006003791A1 (en) 2006-01-12

Similar Documents

Publication Publication Date Title
WO2011008456A3 (en) Methods of forming oxide layers on substrates
Zhang et al. Fabrication of transparent SiO2 glass by pressureless sintering and spark plasma sintering
TW200713453A (en) Methods of fabricating oxide layers on silicon carbide layers utilizing atomic oxygen
Qi et al. Improved hardness and oxidation resistance for CrAlN hard coatings with Y addition by magnetron co-sputtering
Li et al. Shear strength and interfacial characterization of borosilicate glass-to-metal seals
Khojier et al. On the influence of temperature gradient of annealing process on the nano-structure and sensing properties of WO3 thin films to NO2 gas and relative humidity
SG136098A1 (en) A method of revealing crystalline defects in a bulk substrate
TW200746354A (en) Multi-step anneal of thin films for film densification and improved gap-fill
Issartel et al. High temperature behavior of the metal/oxide interface of ferritic stainless steels
TW200605101A (en) Thermistor thin-film and its forming method
Kuo et al. Growth and properties of sputtered zirconia and zirconia–silica thin films
de Sousa Malafaia et al. Anomalous cyclic oxidation behaviour of a Fe–Mn–Si–Cr–Ni shape memory alloy
TWI526412B (en) Anti-corrosion film, metal substrate with anti-corrosion layer and manufacturing method thereof
Duval et al. Stable TiO2/Pt electrode structure for lead containing ferroelectric thick films on silicon MEMS structures
Kwon et al. Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions
Liu et al. Thermal stability of Ir–Re coatings annealed in oxygen-containing atmospheres
Martinez-Perdiguero et al. Electrical insulation and breakdown properties of SiO2 and Al2O3 thin multilayer films deposited on stainless steel by physical vapor deposition
JP4279816B2 (en) Transparent gas barrier substrate
Frenznick et al. A novel approach to determine high temperature wettability and interfacial reactions in liquid metal/solid interface
Lai et al. The microstructure and properties of C and W co-doped NiCr embedded thin film resistors
Feng et al. Oxidation behavior of the compound Ti–Al–Si–N/1Cr11Ni2W2MoV at 800° C for 1000 h in air
Amano et al. Hardness of oxide scales on Fe-Si alloys at room-and high-temperatures
Wu et al. Nanotribological behavior of thermal treatment of zinc titanate thin films
Maeder et al. Phase formation in cathodic arc synthesized Al–Hf and Al–Hf–O coatings during high temperature annealing in ambient air
Brückner et al. Stress and oxidation in CuNi thin films

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees