TW200602155A - Method for assembling a carrier head for chemical mechanical polishing - Google Patents

Method for assembling a carrier head for chemical mechanical polishing

Info

Publication number
TW200602155A
TW200602155A TW093121055A TW93121055A TW200602155A TW 200602155 A TW200602155 A TW 200602155A TW 093121055 A TW093121055 A TW 093121055A TW 93121055 A TW93121055 A TW 93121055A TW 200602155 A TW200602155 A TW 200602155A
Authority
TW
Taiwan
Prior art keywords
carrier head
assembling
mechanical polishing
chemical mechanical
retaining ring
Prior art date
Application number
TW093121055A
Other languages
Chinese (zh)
Other versions
TWI280174B (en
Inventor
Ming-Kung Lee
Gilbert Lu
Philip Shih
Jui-Tang Huang
Original Assignee
Applied Materials Taiwan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Taiwan Ltd filed Critical Applied Materials Taiwan Ltd
Priority to TW93121055A priority Critical patent/TWI280174B/en
Publication of TW200602155A publication Critical patent/TW200602155A/en
Application granted granted Critical
Publication of TWI280174B publication Critical patent/TWI280174B/en

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A method for assembling a carrier head for chemical mechanical polishing is disclosed. Firstly, a retaining ring and a wafer support assembly are provided. The retaining ring is secured with a base of carrier head by bolts, then a waferless lapping process is performed. When an abrasive surface of the retaining ring is lapped, the wafer support assembly is kept under an raised condition or without air-flating pressure to ensure flatness of the abrasive surface.
TW93121055A 2004-07-14 2004-07-14 Method for assembling a carrier head for chemical mechanical polishing TWI280174B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93121055A TWI280174B (en) 2004-07-14 2004-07-14 Method for assembling a carrier head for chemical mechanical polishing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93121055A TWI280174B (en) 2004-07-14 2004-07-14 Method for assembling a carrier head for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
TW200602155A true TW200602155A (en) 2006-01-16
TWI280174B TWI280174B (en) 2007-05-01

Family

ID=38742410

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93121055A TWI280174B (en) 2004-07-14 2004-07-14 Method for assembling a carrier head for chemical mechanical polishing

Country Status (1)

Country Link
TW (1) TWI280174B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413571B (en) * 2006-10-27 2013-11-01 Shinetsu Handotai Kk Grinding head and grinding device
TWI625196B (en) * 2012-10-26 2018-06-01 應用材料股份有限公司 Method of selecting retaining ring
CN113290426A (en) * 2021-04-15 2021-08-24 金华博蓝特电子材料有限公司 Method for improving polishing thickness uniformity of wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413571B (en) * 2006-10-27 2013-11-01 Shinetsu Handotai Kk Grinding head and grinding device
TWI625196B (en) * 2012-10-26 2018-06-01 應用材料股份有限公司 Method of selecting retaining ring
CN113290426A (en) * 2021-04-15 2021-08-24 金华博蓝特电子材料有限公司 Method for improving polishing thickness uniformity of wafer

Also Published As

Publication number Publication date
TWI280174B (en) 2007-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees