TW200602155A - Method for assembling a carrier head for chemical mechanical polishing - Google Patents
Method for assembling a carrier head for chemical mechanical polishingInfo
- Publication number
- TW200602155A TW200602155A TW093121055A TW93121055A TW200602155A TW 200602155 A TW200602155 A TW 200602155A TW 093121055 A TW093121055 A TW 093121055A TW 93121055 A TW93121055 A TW 93121055A TW 200602155 A TW200602155 A TW 200602155A
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier head
- assembling
- mechanical polishing
- chemical mechanical
- retaining ring
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A method for assembling a carrier head for chemical mechanical polishing is disclosed. Firstly, a retaining ring and a wafer support assembly are provided. The retaining ring is secured with a base of carrier head by bolts, then a waferless lapping process is performed. When an abrasive surface of the retaining ring is lapped, the wafer support assembly is kept under an raised condition or without air-flating pressure to ensure flatness of the abrasive surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93121055A TWI280174B (en) | 2004-07-14 | 2004-07-14 | Method for assembling a carrier head for chemical mechanical polishing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93121055A TWI280174B (en) | 2004-07-14 | 2004-07-14 | Method for assembling a carrier head for chemical mechanical polishing |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200602155A true TW200602155A (en) | 2006-01-16 |
TWI280174B TWI280174B (en) | 2007-05-01 |
Family
ID=38742410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93121055A TWI280174B (en) | 2004-07-14 | 2004-07-14 | Method for assembling a carrier head for chemical mechanical polishing |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI280174B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI413571B (en) * | 2006-10-27 | 2013-11-01 | Shinetsu Handotai Kk | Grinding head and grinding device |
TWI625196B (en) * | 2012-10-26 | 2018-06-01 | 應用材料股份有限公司 | Method of selecting retaining ring |
CN113290426A (en) * | 2021-04-15 | 2021-08-24 | 金华博蓝特电子材料有限公司 | Method for improving polishing thickness uniformity of wafer |
-
2004
- 2004-07-14 TW TW93121055A patent/TWI280174B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI413571B (en) * | 2006-10-27 | 2013-11-01 | Shinetsu Handotai Kk | Grinding head and grinding device |
TWI625196B (en) * | 2012-10-26 | 2018-06-01 | 應用材料股份有限公司 | Method of selecting retaining ring |
CN113290426A (en) * | 2021-04-15 | 2021-08-24 | 金华博蓝特电子材料有限公司 | Method for improving polishing thickness uniformity of wafer |
Also Published As
Publication number | Publication date |
---|---|
TWI280174B (en) | 2007-05-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |