TW200601585A - III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof - Google Patents

III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof

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Publication number
TW200601585A
TW200601585A TW093119053A TW93119053A TW200601585A TW 200601585 A TW200601585 A TW 200601585A TW 093119053 A TW093119053 A TW 093119053A TW 93119053 A TW93119053 A TW 93119053A TW 200601585 A TW200601585 A TW 200601585A
Authority
TW
Taiwan
Prior art keywords
reflective film
chip structure
iii
manufacturing
multiple layers
Prior art date
Application number
TW093119053A
Other languages
Chinese (zh)
Other versions
TWI229954B (en
Inventor
Chien-Jen Wang
Nai-Wen Chang
Wei-Jen Wang
Kuo-Chun Chiang
Chuan-Ming Chang
Original Assignee
Ledarts Opto Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ledarts Opto Corp filed Critical Ledarts Opto Corp
Priority to TW93119053A priority Critical patent/TWI229954B/en
Application granted granted Critical
Publication of TWI229954B publication Critical patent/TWI229954B/en
Publication of TW200601585A publication Critical patent/TW200601585A/en

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Abstract

The present invention provides a III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof, in which plural alternative layers of reflective film made mainly of different dielectric materials are added onto the front surface of the LED and epitaxy structure for forming a reflective layer, which reflects the light originally emitting toward the front side into the back side (transparent substrate) direction, thereby forming the flip-chip structure for capturing light from the transparent substrate on the back surface, so that the efficiency of capturing light is increased.
TW93119053A 2004-06-29 2004-06-29 III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof TWI229954B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93119053A TWI229954B (en) 2004-06-29 2004-06-29 III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93119053A TWI229954B (en) 2004-06-29 2004-06-29 III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI229954B TWI229954B (en) 2005-03-21
TW200601585A true TW200601585A (en) 2006-01-01

Family

ID=36083245

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93119053A TWI229954B (en) 2004-06-29 2004-06-29 III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof

Country Status (1)

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TW (1) TWI229954B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102270724A (en) * 2010-06-01 2011-12-07 陈文彬 Method for color purification of light emitting diode (LED) wafer
TWI393273B (en) * 2009-08-27 2013-04-11 Edison Opto Corp Method for manufacturing light emitting diode assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393273B (en) * 2009-08-27 2013-04-11 Edison Opto Corp Method for manufacturing light emitting diode assembly
CN102270724A (en) * 2010-06-01 2011-12-07 陈文彬 Method for color purification of light emitting diode (LED) wafer
CN102270724B (en) * 2010-06-01 2014-04-09 陈文彬 Method for color purification of light emitting diode (LED) wafer

Also Published As

Publication number Publication date
TWI229954B (en) 2005-03-21

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MM4A Annulment or lapse of patent due to non-payment of fees