TW200601585A - III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof - Google Patents
III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereofInfo
- Publication number
- TW200601585A TW200601585A TW093119053A TW93119053A TW200601585A TW 200601585 A TW200601585 A TW 200601585A TW 093119053 A TW093119053 A TW 093119053A TW 93119053 A TW93119053 A TW 93119053A TW 200601585 A TW200601585 A TW 200601585A
- Authority
- TW
- Taiwan
- Prior art keywords
- reflective film
- chip structure
- iii
- manufacturing
- multiple layers
- Prior art date
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- Led Devices (AREA)
Abstract
The present invention provides a III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof, in which plural alternative layers of reflective film made mainly of different dielectric materials are added onto the front surface of the LED and epitaxy structure for forming a reflective layer, which reflects the light originally emitting toward the front side into the back side (transparent substrate) direction, thereby forming the flip-chip structure for capturing light from the transparent substrate on the back surface, so that the efficiency of capturing light is increased.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93119053A TWI229954B (en) | 2004-06-29 | 2004-06-29 | III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93119053A TWI229954B (en) | 2004-06-29 | 2004-06-29 | III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI229954B TWI229954B (en) | 2005-03-21 |
TW200601585A true TW200601585A (en) | 2006-01-01 |
Family
ID=36083245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93119053A TWI229954B (en) | 2004-06-29 | 2004-06-29 | III-V nitride compound LED flip-chip structure having multiple layers of reflective film and manufacturing method thereof |
Country Status (1)
Country | Link |
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TW (1) | TWI229954B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102270724A (en) * | 2010-06-01 | 2011-12-07 | 陈文彬 | Method for color purification of light emitting diode (LED) wafer |
TWI393273B (en) * | 2009-08-27 | 2013-04-11 | Edison Opto Corp | Method for manufacturing light emitting diode assembly |
-
2004
- 2004-06-29 TW TW93119053A patent/TWI229954B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI393273B (en) * | 2009-08-27 | 2013-04-11 | Edison Opto Corp | Method for manufacturing light emitting diode assembly |
CN102270724A (en) * | 2010-06-01 | 2011-12-07 | 陈文彬 | Method for color purification of light emitting diode (LED) wafer |
CN102270724B (en) * | 2010-06-01 | 2014-04-09 | 陈文彬 | Method for color purification of light emitting diode (LED) wafer |
Also Published As
Publication number | Publication date |
---|---|
TWI229954B (en) | 2005-03-21 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |