200541427 九、發明說明： 【發明所屬之技術領域】 本發明是闕於以溶融痒錫進行印刷電路板鑛焊錫 的方法，特別是鍍無鉛焊錫的方法。 【先前技術】 -般_電路板和電子零件顧焊鍚槽的炫融焊 錫進行鐘焊錫時，是利用淳錫槽的喷嘴喷流溶融焊錫進 • 到印刷電路板的裡面，進行鍵烊錫。印刷電路板所承載 的電子零件包括’具有長引腳的分離元件或是兩端側面 具有電極的晶片。 分離7G件在印刷電路板上鍍焊錫時，必須先將引腳 插入印刷電路板的穿孔，將引腳和導電層以溶融谭錫連 接起來。由於印刷電路板的表面和穿孔裡面有導電層， 利用該導通的導電層形成雙面基板。因此將分離元件插 入该穿孔進行鍍焊錫時，熔融焊錫必須要能夠進入穿孔 _ 内。 如果是晶片在印刷電路板上鍍焊錫時，印刷電路板 表面的導電層和晶片的電極間必須形成完全平面的焊 錫。因此晶片在印刷電路板上鐘谭錫時，會先在印刷電 路板的^電層之間塗上接著劑，織將晶片—邊的電極 放置在導電層上，另一邊的電極放置在相鄰的導電層 上，晶片本身則固定在導電層間的印刷電路板上。然 後，由焊錫槽的喷嘴噴流出來的熔融焊錫進入承載晶^ 的印刷電路板裡面，在印刷電路板的導電層和晶片電極 200541427 鍍上焊錫。 即使分離元件和穿孔間_·大，但是由於穿孔 的長度很長，因此㈣焊錫+容易完全由外到内進入印 刷電路板的穿孔…而晶片和導電層間轉錫的直角角 偶部，即使焊舰夠進入該角偶部，角偶部的空氣和助 溶劑也會阻礙絲焊鎖的進入❿無法鍵上谭锡。因此在 =電路板的穿孔和晶Μ偶部等位置容易成為炫融 焊錫不容易進入的部份。200541427 IX. Description of the invention: [Technical field to which the invention belongs] The present invention is a method for dissolving itching tin on a printed circuit board using molten tin, especially a method for plating lead-free solder. [Previous technology] -General_Bright soldering of circuit board and electronic parts Gu soldering grooves For bell soldering, the nozzle of the pure tin bath is used to melt the solder into the printed circuit board and perform key soldering. The electronic components carried on the printed circuit board include 'separated components with long pins or wafers with electrodes on both sides. When separating the 7G parts and soldering the printed circuit board, you must first insert the pins into the holes of the printed circuit board, and connect the pins and the conductive layer by melting Tan tin. Because the printed circuit board has a conductive layer on the surface and inside of the perforation, the conductive layer is used to form a double-sided substrate. Therefore, when inserting a separation element into the through hole for solder plating, the molten solder must be able to enter the through hole _. If the wafer is solder plated on a printed circuit board, a completely flat solder must be formed between the conductive layer on the surface of the printed circuit board and the electrodes of the wafer. Therefore, when the wafer is on the printed circuit board, Zhong Tan Xi will first apply an adhesive between the electrical layers of the printed circuit board, and weave the electrode on the side of the wafer on the conductive layer, and place the electrode on the other side on the adjacent conductive layer. On the layer, the wafer itself is fixed on a printed circuit board between conductive layers. Then, the molten solder sprayed from the nozzle of the solder bath enters the printed circuit board carrying the crystal, and the conductive layer of the printed circuit board and the wafer electrode 200541427 are plated with solder. Even if the space between the separation element and the perforation is large, but the length of the perforation is very long, so solder + easily enters the perforation of the printed circuit board from the outside to the inside ... and the right-angled corner of the wafer and the conductive layer transfer tin, even if soldered The ship can enter the corner coupler, and the air and solvent in the corner coupler will also prevent the entry of the wire welding lock. Tan Xi cannot be connected. Therefore, it is easy to become a part where the solder is not easy to enter at the positions such as the through hole of the circuit board and the crystal couple.
傳統印刷電路板的觸槽中，使用錯—踢（pb_Sn) 焊錫。錯-錫（Pb-Sn)焊錫具有低炫點、高流動性的特 點，因此，餅斜不料對電子零件和印刷電路板造 成熱傷害，而且，觸容易進人穿孔和晶片角偶部等不 容f進入馳心但祕渴⑽却_秘公害的 問題因此$子業界開始自律朗無錯焊錫的比例越來 越高。無鱗_主成份域㈤，其他添加適量的 銀（Αδ) ’ 銅（Cu)，綈（Sb)，絲（Bi)，銦（In)， 鋅（恥，鉻（Cr)，鎳、（Ni)，銘（㈤，鐵（Fe)， ’鍺（Ge) ’錄（Ga)，鱗⑺等。相較於 %錫（Pb-Sn)焊锡主成份為鎖㈤的祕焊锡流動 I·生較差’目此有些地方會有不容純入的問題 。與傳統 鐘焊錫的綠減，產生沒有賴烊祕域的比例變 高。 傳統上，解決熔融焊锡不容易進入的方法，是利用 喷射嗔流鍍焊錫法(專利文獻1、2)。喷射嗔流法是將焊 錫槽的喷嘴出口變小，使_焊錫的喷出速度增加讓焊 200541427 錫可以進入不容易進入的地方。使用喷射喷流鍍焊錫的 方法’可以幫助Pb-Sn焊錫進入原本不容易進入的地 方’但是對於流動性差的無錯焊錫而言，有些地方還是 無法進入。 此外，傳統印刷電路板利用焊錫槽的喷嘴，喷流熔 融焊錫在印刷電路板上的鍍焊錫方法，也會有焊錫槽容 易產生氧化物的問題。傳統鐘焊錫的方法，是以焊錫槽 上中设置的自動鐘焊鍚裝置，將多片印刷電路板以定間 • 距在傳送軌道上傳送，在焊錫槽中由喷嘴連續喷流出熔 融焊鎖。 由於焊錫槽中的焊錫為高温熔融狀態，當熔融焊錫 由高位置的喷嘴喷流口流出，落到熔融焊錫的液面上 時’在熔融焊錫的液面會產生瀑布狀的攪拌，而將空氣 帶入熔融焊錫中。高温熔融狀態的焊錫與空氣接觸後， 很容易氧化，由於在焊錫槽中由噴嘴噴出落下的攪拌會 帶入空氣，因此喷嘴附近會產生劇烈氧化而產生大量的 φ 焊錫氧化物。 焊錫槽中所產生的大量氧化物，會由焊錫槽中溢 出，造成焊錫槽下方的配線短路或是污染焊錫槽附近。 當焊錫槽中產生大量氧化物時，如果這些氧化物重新進 入熔融焊錫的循環喷流幫浦，而被噴流幫浦吸入，再由 喷嘴喷出，附著到印刷電路板上，會造成外觀不良，以 及電路板線路短路專問題。而且操作人員每隔一段時間 必須耗費時間以網子或長勺清除這些氧化物，這些清出 的氧化物必須花費成本委託廢棄物處理業者進行處理。 200541427 造成焊錫槽會產生大量氧化物的各種問題的原因 疋，由於印刷電路板雖然是以定間距間隔傳送，但是， 烊錫槽的喷嘴卻維持一直喷流熔融焊錫的狀態，因此會 直產生氧化物。因此，即使以傳送裝置定間距地傳送 印刷電路板，在印刷電路板尚未到達焊錫槽時 待機時間)健會產生氧錄。如果只有在印刷電路板 到達焊錫槽時（以下稱為作動時間）才喷流，便可以減 、產生的氧化物，因此，有人提出只有在作動時才喷流 焊錫的方法(参照專利文獻3〜4)。 專利文獻3是在谭錫槽前後設置2個檢測裝置，當被 鑛谭錫物在這__裝置L才進聽融谭锡的 噴流。該專利文獻3在待機時，熔融焊錫會下降到噴嘴 的最下面，也就是熔融焊錫的液面。 專利文獻4則是利用印刷電路板的偵測感應器，當 檢測出沒有印刷電路板時，抑制熔融焊錫的喷出，將^ 融焊錫維持在無法流出的位置，當感應器檢測到有印刷 電路板時，再讓熔融焊錫由喷嘴喷出。使喷流螺旋槳回 轉之馬達，係藉著頻率變換器供給電力，而得以調整回 轉數，因此，專利文獻4在待機時，熔融焊錫會維持在 噴嘴上部，也就是熔融焊錫不會由喷嘴流落的最 置。 [專利文獻1]特開昭58-178593號公報 [專利文獻2 ]特開平14-134898號公報 [專利文獻3]特開昭56-163074號公報 [專利文獻4]特開昭59-174270號公報 200541427 【發明内容】 根據專利文獻卜2的喷射鍍焊錫法，如果喷射喷流 太弱時，溶融焊錫無法進入不容易進入的地方，但是， 如果喷射喷流太強時，可能會造成插入穿孔内的分離元 件引腳移動，或是以接著劑固定的晶片剝離。使用喷射 喷流鍍焊錫時，如果只有要作動時，喷流熔融焊錫，要 讓在高比重的熔融焊錫中停止的幫浦達到高速運轉需 要較長的時間，因此，印刷電路板的傳送會產生短暫的 中斷。根據專利文獻3、4，待機時，停止喷嘴的喷流雖 然可以減錄化物的產生，但是卻無法冑祕融焊錫進 入不容易進入的地方。 本發明提供-餅職路板喃焊錫方法，除了能 讓無錯焊錫進人不容$進人的地方，而且，只有在作動 時，熔融焊錫相喷嘴倾，因此，可以減少氧化物的 產生。 本發明所使用的桿錫槽印刷電路板鑛焊锡方法，除 了在熔融觸㈣着辦，_料可峨入不容易 =入的地方之外，只有在作_，才由喷嘴喷流舰 踢0 ^明的第1實施方式，是一種在傳送印刷電路板 時’進入炫融焊錫槽的鍍烊錫方法，， 之前，一次喷嘴内的熔融焊= ，當印刷電路板接近—次喷嘴時，炫融焊 -人喷嘴喷流到不會接觸到印刷電路板的高度，隨 200541427 著印刷電路板繼續傳送，熔融焊錫的喷流高度繼續變 高，當到達原本熔融焊錫接觸不到印刷電路板的位置 時，隨著熔融焊錫的喷流高度的變高，熔融焊錫可以進 入原本不容易進入的地方，在印刷電路板由熔融焊鍚離 開前，熔融焊錫的噴流高度下降到接觸不到印刷電路板 的高度，因此，當印刷電路板離開熔融焊錫時，熔融焊 錫下降到焊錫槽液面。 本發明的第2實施方式，是一種在傳送印刷電路板 • 時，進入溶融焊錫槽的鍵焊錫方法，其特徵為，在印刷 電路板接近焊錫槽前，一次喷嘴内的熔融焊錫，維持在 不會由一次喷嘴流落的位置，當印刷電路板接近一次喷 嘴時，由一次喷嘴喷流的熔融焊錫，維持在不會接觸印 刷電路板的高度，隨著印刷電路板繼續傳送，溶融焊錫 的喷流高度變高，到達接觸印刷電路板的位置，隨著熔 融焊錫喷流高度的變高，熔融焊錫可以進入不容易進入 的地方，在印刷電路板離開熔融焊錫前，熔融焊錫的噴 φ 流高度下降到接觸不到印刷電路板的位置，當印刷電路 板離開熔融焊錫時，熔融焊錫下降至維持在不會由喷嘴 流落的位置。 根據本發明，印刷電路板在焊錫槽中鍍焊錫時，在 印刷電路板未到達焊錫槽的待機時間，由於熔融焊錫停 止由喷嘴喷流，可以減少炼融焊錫由高處落下所產生的 氧化。因此，本發明除了可以減少氧化物所造成焊錫的 浪費之外，也可以避免氧化物隨著熔融焊錫附著在印刷 電路板上的情形。根據本發明，印刷電路板與炫融焊錫 200541427 接觸之後，當印刷電路板的鍍焊錫部分在一次喷嘴的喷 出位置時，噴流高度會變高，使得喷流速度變強，因此， 熔融焊錫可以進入不容易進入的地方，並減少沒有鍍上 焊錫的問題。而且，本發明之第2實施方式在待機時， 溶融焊錫不會由喷嘴流落而留在喷嘴上部，因此，喷嘴 内的熔融焊錫會一直加熱喷嘴，避免喷嘴冷卻。因此， 第2實施例在作動時由喷嘴噴流的熔融焊錫會維持預定 温度，而附著在印刷電路板上，減少因為熔融焊錫溫度 過低造成鑛焊錫不良的問題。 本發明在待機時，停止熔融焊錫的喷流，當印刷電 路板到達喷嘴時，進行不會接觸印刷電路板的中間程度 喷流，隨著印刷電路板繼續傳送，增加熔融焊錫喷流的 強度以到達接觸印刷電路板的位置，讓熔融焊錫達到可 以進入不容易進入地方的高度的喷流三階段喷流。當電 子零件的鍍焊錫部份通過之後，熔融焊錫的喷流高度下 降到接觸不到印刷電路板的位置，然後，當印刷電路板 經過之後，下降熔融焊錫的位置。 本發明的第1實施方式是在待機時，喷嘴内熔融焊 錫的位置下降到與焊錫槽的液面相同位置。本發明的第 2實施方式是在待機時，喷嘴内熔融焊錫的位置下降到 不會由喷嘴流落的位置。根據第2實施方式，由於待機 時熔融焊錫留在喷嘴的上部，噴嘴受到熔融焊錫加熱， 因此，可以避免作動時由噴嘴噴流的熔融焊錫冷卻，並 以預定温度進行鍍焊錫。 溶融烊錫高度的調整，可以使用馬達控制幫浦來達 11 200541427 成。本發明可以使用伺服馬達或反向馬達。 【實施方式】 首先簡單説明印刷電路板錢焊踢的方法。在行 刷電路板_焊錫製辦，必須先將電子零件放置 刷電路板上。完成電子零件搭載的印刷電路會傳 動鑛焊錫裝置的傳送裝置。自動鍍焊錫裝置具有助溶劑 器、預熱器、痒錫槽、冷卻器等處理裝置，這些處理裝 置上具有傳送裝置。印刷電路板在該傳送裝置上傳送時 以助熔劑器塗佈助熔劑，以預熱器預熱，在焊錫槽中讓 焊錫附著，以冷卻器進行冷却等鍍焊錫的步驟。 如第1圖的焊錫槽1具有一次噴嘴2和二次喷嘴3，焊 錫槽内具有熔融焊錫4。一次喷嘴和二次噴嘴喷流的熔 融焊錫，分別由未圖示的幫浦控制個別的噴流狀態。一 次喷嘴2上具有喷流熔融焊錫的多個喷嘴出口5。一次喷 嘴所造成的劇烈波動讓熔融焊錫可以進入不容易進入 的地方，但是單純只有劇烈波動並無法讓熔融焊錫完全 進入不容易進入的地方。特別是流動性差的無鉛焊錫， 只以一次喷嘴鍍焊錫會產生未焊錫的地方。由於一次嘴 令的激烈喷流，無法均勻附著焊錫容易形成毛邊或橋接 短路。這些毛邊或橋接短路，可以使用二次噴嘴的穩定 噴流加以修正。二次噴嘴2的喷嘴出口較大，而且噴嘴 出口沒有障礙物，熔融焊錫會形成穩定噴流。印刷電路 板如虛線的箭號所示，由一次噴嘴往二次噴嘴的方向傳 送〇 12 200541427 在本發明中，印刷電路板到達噴嘴時的熔融焊錫喷 流，係從喷嘴喷流熔融烊錫的時刻，由自動鍍焊錫裝置 所設置的感應器和控制裝置來控制。當印刷電路板由前 製程，經由自動鍍焊錫裝置的傳送裝置傳送之後，自動 鍍焊錫裝置上的感應器將檢知到該印刷電路板的訊 號’傳送給控制裝置。控制裝置會計算從檢知到印刷電 路板訊號之後開始，到傳送到喷嘴的時間，當檢知印刷 電路板到達時間之後，幫浦傳送訊號給運轉馬達，將熔 融焊錫由喷嘴喷流。 接下來参照第2圖説明第1實施方式。 (A)印刷電路板6由未圓示的傳送裝置沿虛線的方 向傳送。這時，印刷電路板6還未到達一次喷嘴2,因此， 一次喷嘴内熔融焊錫4的液面位置與焊錫槽相同。 ⑻當印刷電路板6到達一次喷嘴2時，由未圖示的 控制裝置所發出的訊號，控制未圖示的馬達讓幫浦運 轉，炼融焊錫4由一次喷嘴2喷流。這時，熔融焊錫的喷 流高度(h〇為，印刷電路板前面熔融焊錫沒有接觸表面 的高度。 (C)隨著印刷電路板繼績傳送，溶融谭錫的高度提 高，熔融焊錫到達印刷電路板的表面無法接觸的地方， 馬達提前運轉，使得由一次喷嘴熔融焊錫的高度變得更 高。這時熔融焊錫的高度(h2)為，沒有印刷電路板時所 測量的如點線所示的高度。由於一次噴嘴喷流熔融浑錫 的itr度提局時’溶融焊錫的流速增加因此可以進入不容 易進入的地方。 13 200541427 (D)隨著印刷電路板繼續傳送，熔融浮錫以高速嗅 流進入不容易進入的地方，當熔融焊錫到達印刷電路板 後’部表面的接觸位置時，馬達運轉速度變慢熔融焊錫 喷流下降。這時的喷流高度與前述喷流高度(hi)大略一 致，為接觸不到印刷電路板表面的高度。 (E)當印刷電路板離開一次喷嘴時，根據控制裝置 的訊號，熔融嬋錫4降到與焊錫槽液面相同。 接下來參考第3圖來説明第2實施方式。 齡 （A)印刷電路板6由未圖示的傳送裝置沿虛線的方 向傳送。這時印刷電路板6由於還未到達一次喷嘴2，熔 融焊錫4位於一次喷嘴内不會由喷嘴流落的位置。 (B) 當印刷電路板6到達一次喷嘴2，時由未圖示的 控制裝置所發出的訊號控制未圖示馬達讓幫浦運轉，溶 融焊錫4由一次喷嘴2喷流。這時的熔融焊錫的喷流高度 (h)為印刷電路板前面熔融焊錫沒有接觸表面的高度。 (C) 隨著印刷電路板繼續傳送，熔融悍錫的高度提 • 高，溶融焊錫到達印刷電路板的表面無法接觸的地方， 馬達提前運轉，使得由一次喷嘴熔融焊錫的高度變得更 尚。這時溶融焊錫的高度(1¾)為沒有印刷電路板時所測 量如點線所示的高度。由於由一次喷嘴喷流熔融焊錫的 南度提尚時’溶融焊錫的流速增加，因此可以進入不容 易進入的地方。 (D) 隨著印刷電路板繼績傳送，藉由高速噴流，溶 融焊錫可以進入不容易進入的地方，當接觸到印刷電路 板後部的表面位置時，馬達的運轉速度變慢，降低熔融 ⑧ 14 200541427 焊錫的喷流。這_魏高度與前述喷流高度⑹約略 相同，為接觸不到印刷電路板表面的高度。 (E)當印刷電路板離開一次噴嘴時，根據控制裝置 的訊號，溶融焊錫4降到不會由一次喷嘴2流落的位置。 •根據本發明一次喷嘴熔融焊錫的喷流狀態説明， 不需要使用二次喷嘴的階段喷流控制。二次喷嘴的目 的，疋修正一次喷嘴所產生的毛邊和橋接短路，並讓焊 錫進入一次喷嘴鍍焊錫不容易進入的地方，因此不需要 • 二次喷嘴。作動時熔融焊錫喷流到達二次喷嘴預定高度， 待機時下降到預定喷流位置。 一般以錫（Sn)為主成份的無錯焊錫由於熔點高， 因此，焊錫槽内的焊錫温度必須較高，因此，焊錫槽内 也較容易氧化。本發明具有抑制焊錫槽内氧化的効果， 因此適合使用無鉛焊錫進行印刷電路板的鍍焊錫，當然 也適用於炫點比無鉛焊錫低的錫-鉛（Sn-Pb)焊錫。 ⑻In the printed circuit board's contact grooves, wrong-kick (pb_Sn) solder is used. False-tin (Pb-Sn) solder has the characteristics of low dazzle point and high fluidity. Therefore, the pie slant unexpectedly causes thermal damage to electronic parts and printed circuit boards. Moreover, it is easy to touch the perforations and chip corners. f enters the heart but the thirst _ _ the problem of public hazards. Therefore, the sub-industry began to self-regulate the proportion of error-free solder is getting higher and higher. No scale _ main component domain ㈤, others add appropriate amount of silver (Αδ) copper (Cu), 绨 (Sb), silk (Bi), indium (In), zinc (shame, chromium (Cr), nickel, (Ni ), Ming (㈤, iron (Fe), 'germanium (Ge)') (Ga), scales, etc. Compared to the% tin (Pb-Sn) solder, the main component of the solder is the lock, the flow of the solder is poor. 'At this point, there are some problems that cannot be penetrated. Compared with the traditional bell solder, the green ratio is reduced, and the proportion of non-reliable secret areas becomes higher. Traditionally, the solution to the difficult access of molten solder is to use spray jet plating. Soldering method (Patent Documents 1 and 2). The jet flow method is to reduce the nozzle outlet of the solder bath to increase the spraying speed of the solder so that the solder can enter the place where it is not easy to enter. Use spray jet plating to solder The method 'can help Pb-Sn solder to enter places that are not easy to enter', but for error-free solders with poor fluidity, some places are still inaccessible. In addition, traditional printed circuit boards use nozzles of solder baths to spray melt the solder. Solder plating method on printed circuit boards, there will also be solder The problem of oxides is apt to occur. The traditional method of bell soldering is to use automatic bell soldering equipment installed on the solder bath to transfer multiple printed circuit boards on the conveyor track at regular intervals. The nozzles are used in the solder bath. The molten solder lock is continuously sprayed out. Because the solder in the solder bath is in a high temperature molten state, when the molten solder flows out from the nozzle nozzle of the high position and falls on the molten solder liquid level, a waterfall will occur on the molten solder liquid level. This will cause air to melt into the solder. High-temperature molten solder will easily oxidize when it comes in contact with air. The stirring from the nozzle in the solder bath will bring in air, so intense oxidation will occur near the nozzle. A large amount of φ solder oxide is generated. A large amount of oxide generated in the solder bath will overflow from the solder bath, causing a short circuit in the wiring below the solder bath or polluting the vicinity of the solder bath. When a large amount of oxide is generated in the solder bath, If these oxides re-enter the circulating jet pump of the molten solder, they are sucked in by the jet pump, and then ejected from the nozzle and adhere to Brushing the circuit board will cause poor appearance and short circuit circuit board problems. Moreover, the operator must spend time to remove these oxides with a net or a long spoon at intervals, and these cleared oxides must be entrusted to waste The problem is caused by various problems caused by solder baths. 200541427 Although the printed circuit board is transported at regular intervals, the nozzles of the tin bath maintain a state of continuous jet molten solder. Therefore, oxides are generated directly. Therefore, even if the printed circuit board is transported at a fixed interval by the conveying device, the standby time is generated when the printed circuit board has not yet reached the solder bath. If only the printed circuit board reaches the solder bath, (Hereinafter referred to as the operation time), the oxide can be reduced or generated only by spraying. Therefore, a method has been proposed in which solder is sprayed only during operation (see Patent Documents 3 to 4). Patent Document 3 is provided with two detection devices before and after the Tan Xi tank. When the mine Tan Xiwu is here, the device L only listens to the jet of Rong Tan Xi. In Patent Document 3, the molten solder is lowered to the bottom of the nozzle during standby, that is, the liquid level of the molten solder. Patent Document 4 uses a printed circuit board detection sensor. When no printed circuit board is detected, the molten solder is suppressed from being ejected, and the molten solder is maintained at a position where it cannot flow out. When the sensor detects a printed circuit, When soldering the board, let the molten solder spray out from the nozzle. The motor that rotates the jet flow propeller can adjust the number of revolutions by supplying power to the frequency converter. Therefore, in patent document 4, when the standby is performed, the molten solder is maintained at the upper part of the nozzle, that is, the molten solder does not flow from the nozzle. Most set. [Patent Document 1] JP 58-178593 [Patent Document 2] JP 14-134898 [Patent Document 3] JP 56-163074 [Patent Document 4] JP 59-174270 Bulletin 200541427 [Summary of the Invention] According to the spray solder plating method of Patent Document 2, if the spray jet is too weak, the molten solder cannot enter the place where it is not easy to enter. However, if the spray jet is too strong, it may cause insertion perforation. The internal component pins move, or the wafer fixed by the adhesive is peeled off. When spray jet solder plating is used, if it is only necessary to operate, the jet melts the solder. It takes a long time for the pump stopped in the high specific gravity molten solder to run at a high speed. Therefore, the transfer of printed circuit boards will occur. A brief interruption. According to Patent Documents 3 and 4, although stopping the jet flow of the nozzle during standby can reduce the generation of recorded materials, it cannot secretly enter the place where the solder is not easy to enter. The present invention provides a method for baking solder on a breadboard, in addition to allowing error-free solder to enter a place where people are not allowed to enter, and only when operating, the molten solder phase nozzle is tilted, so that the generation of oxides can be reduced. The method for ore soldering of the printed circuit board of a rod tin bath used in the present invention, except in the case of melt contact, can not be easily inserted, but only when it is in operation. The first embodiment of the invention is a tin plating method that 'enters the flash solder bath when transferring printed circuit boards. Before, the fusion welding in the primary nozzle = when the printed circuit board approaches the secondary nozzle. Fusion soldering-the human nozzle sprays to a height that will not contact the printed circuit board. With 200541427 continuing to transport the printed circuit board, the jet height of the molten solder continues to increase. When it reaches the position where the original molten solder cannot reach the printed circuit board At this time, as the jet height of the molten solder becomes higher, the molten solder can enter the place where it is not easy to enter. Before the printed circuit board leaves from the molten solder, the jet height of the molten solder drops to a point where it cannot reach the printed circuit board. Height, so when the printed circuit board leaves the molten solder, the molten solder drops to the level of the solder bath. The second embodiment of the present invention is a key soldering method that enters a molten solder bath when transferring a printed circuit board. The method is characterized in that the molten solder in the primary nozzle is maintained at Where it will flow from a nozzle, when the printed circuit board approaches the nozzle, the molten solder sprayed by the nozzle is maintained at a height that will not contact the printed circuit board. As the printed circuit board continues to transfer, the jet of molten solder The height becomes higher and reaches the position where the printed circuit board is contacted. As the height of the molten solder jet flow becomes higher, the molten solder can enter a place where it is not easy to enter. Before the printed circuit board leaves the molten solder, the height of the molten solder jet φ decreases. When the printed circuit board is not in contact with the printed circuit board, when the printed circuit board leaves the molten solder, the molten solder is lowered to a position where the molten solder does not flow from the nozzle. According to the present invention, when the printed circuit board is plated with solder in a solder bath, the standby time when the printed circuit board does not reach the solder bath can reduce the oxidation caused by the molten solder falling from a height because the molten solder stops jetting from the nozzle. Therefore, in addition to reducing the waste of solder caused by the oxide, the present invention can also prevent the oxide from adhering to the printed circuit board with the molten solder. According to the present invention, after the printed circuit board is in contact with the bright solder 200541427, when the soldering portion of the printed circuit board is at the ejection position of the primary nozzle, the jet flow height will be higher, so that the jet flow speed will be stronger, so that the molten solder can Access hard-to-reach areas and reduce problems with no solder plating. Furthermore, in the second embodiment of the present invention, the molten solder does not flow from the nozzle and stay on the upper portion of the nozzle during standby. Therefore, the molten solder in the nozzle always heats the nozzle and prevents the nozzle from cooling. Therefore, in the second embodiment, the molten solder sprayed from the nozzle is maintained at a predetermined temperature during the operation, and adheres to the printed circuit board, thereby reducing the problem of defective solder due to the excessively low molten solder temperature. In the present invention, the jet of molten solder is stopped during standby. When the printed circuit board reaches the nozzle, an intermediate jet that does not contact the printed circuit board is performed. As the printed circuit board continues to be transported, the intensity of the molten solder jet is increased to Reach the position where the printed circuit board is contacted, and let the molten solder reach a height of the jet which can not enter the place easily. After the soldered part of the electronic part passes, the spray height of the molten solder drops to a position where it cannot reach the printed circuit board, and then, after the printed circuit board passes, the position of the molten solder is lowered. In the first embodiment of the present invention, the position of the molten solder in the nozzle is lowered to the same position as the liquid level of the solder bath during standby. In the second embodiment of the present invention, the position of the molten solder in the nozzle is lowered to a position where it will not flow down from the nozzle during standby. According to the second embodiment, since the molten solder remains on the upper portion of the nozzle during standby and the nozzle is heated by the molten solder, the molten solder sprayed from the nozzle during operation can be prevented from being cooled and the solder can be plated at a predetermined temperature. To adjust the height of molten tin, you can use a motor control pump to achieve 11 200541427%. The present invention can use a servo motor or a reverse motor. [Embodiment] First, a method for soldering a printed circuit board will be described briefly. Before the circuit board is soldered, the electronic parts must be placed on the circuit board first. The printed circuit on which the electronic component is mounted completes the transfer device of the ore soldering device. The automatic solder plating device includes processing devices such as a solvent assister, a preheater, an itching tin tank, and a cooler. These processing devices have a transfer device. When the printed circuit board is conveyed on the conveying device, a flux is coated with a flux, preheated by a preheater, solder is adhered in a solder bath, and solder plating is performed by a cooler such as cooling. As shown in Fig. 1, the solder bath 1 includes a primary nozzle 2 and a secondary nozzle 3, and a molten solder 4 is provided in the solder bath. The molten solder sprayed by the primary nozzle and the secondary nozzle is controlled by a pump (not shown) for each individual jet flow state. The primary nozzle 2 has a plurality of nozzle outlets 5 for jetting molten solder. The violent fluctuations caused by a spray nozzle allow molten solder to enter places that are not easily accessible, but only violent fluctuations cannot completely allow molten solder to enter places that are not easily accessible. In particular, lead-free solders with poor fluidity, where soldering is performed only once with a nozzle, can cause unsoldering. Due to the intense jet flow from a nozzle, the solder cannot be uniformly adhered, and it is easy to form burrs or bridge shorts. These burrs or bridges are short-circuited and can be corrected using a steady stream of secondary nozzles. The secondary nozzle 2 has a large nozzle outlet, and there is no obstacle at the nozzle outlet, and a stable jet of molten solder is formed. The printed circuit board is conveyed from the primary nozzle to the secondary nozzle as indicated by the dashed arrow. 12 200541427 In the present invention, the molten solder jet when the printed circuit board reaches the nozzle is melted from the nozzle. The time is controlled by an inductor and a control device provided in the automatic soldering device. After the printed circuit board is transferred by the pre-processed device through the transfer device of the automatic solder plating device, the sensor on the automatic solder plating device transmits the signal detected to the printed circuit board to the control device. The control device calculates the time from the detection of the printed circuit board signal to the transmission to the nozzle. When the printed circuit board arrival time is detected, the pump sends a signal to the running motor to spray the molten solder from the nozzle. Next, a first embodiment will be described with reference to FIG. 2. (A) The printed circuit board 6 is conveyed in a direction of a dotted line by a conveying device not shown in the circle. At this time, since the printed circuit board 6 has not reached the primary nozzle 2, the liquid level of the molten solder 4 in the primary nozzle is the same as that of the solder bath.印刷 When the printed circuit board 6 reaches the primary nozzle 2, a signal from a control device (not shown) controls the motor (not shown) to run the pump, and the melting solder 4 is sprayed from the primary nozzle 2. At this time, the jet height of the molten solder (h0 is the height at which the molten solder in front of the printed circuit board does not contact the surface. (C) As the printed circuit board continues to transfer, the height of the molten tin solder increases, and the molten solder reaches the printed circuit board. Where the surface cannot be touched, the motor runs in advance, so that the height of the molten solder from the primary nozzle becomes higher. At this time, the height of the molten solder (h2) is the height measured as a dotted line when there is no printed circuit board. When the nozzle iteration of molten tin is increased, the flow rate of the molten solder increases, so it can enter places that are not easy to enter. 13 200541427 (D) As the printed circuit board continues to transport, the molten floating tin enters at a high-speed odor stream. Where it is not easy to enter, when the molten solder reaches the contact position on the surface of the printed circuit board, the motor operation speed becomes slower and the molten solder jet stream decreases. The jet stream height at this time is approximately the same as the aforementioned jet stream height (hi), which is Can not reach the height of the surface of the printed circuit board. (E) When the printed circuit board leaves the nozzle once, according to the signal from the control device, melt tin 4 Lowered to the same level as the level of the solder bath. Next, a second embodiment will be described with reference to FIG. 3. (A) The printed circuit board 6 is transported by a transfer device (not shown) in the direction of the dotted line. When the primary nozzle 2 is not reached, the molten solder 4 is located in the primary nozzle so that it will not flow from the nozzle. (B) When the printed circuit board 6 reaches the primary nozzle 2, the signal from the control device (not shown) is not shown. The motor runs the pump, and the molten solder 4 is sprayed from the primary nozzle 2. At this time, the height of the molten solder jet (h) is the height at which the molten solder in front of the printed circuit board does not touch the surface. (C) As the printed circuit board continues to be transported The height of the molten solder is increased. The molten solder reaches the place where the surface of the printed circuit board cannot be contacted. The motor runs in advance to make the height of the molten solder melted by the nozzle once. At this time, the height of the molten solder (1¾) is no. The height as indicated by the dotted line is measured when printed on a printed circuit board. As the south of the molten solder is increased by a single nozzle jet, the flow rate of the molten solder is increased, so it can enter Easy access. (D) As the printed circuit board continues to transfer, through high-speed jets, molten solder can enter places that are not easily accessible. When it comes into contact with the surface position on the rear of the printed circuit board, the motor runs slower. 14 200541427 The jet of solder. This Wei height is approximately the same as the aforementioned jet height, which is the height that cannot reach the surface of the printed circuit board. (E) When the printed circuit board leaves the nozzle once, according to the control device Signal, the molten solder 4 is lowered to a position where it will not flow down by the primary nozzle 2. According to the present invention, the state of the spray flow of the molten solder in the primary nozzle is explained, and the secondary spray nozzle does not need to be controlled. The purpose of the secondary nozzle,疋 Correction of burrs and bridging shorts caused by the primary nozzle, and let the solder enter the place where the primary nozzle plating solder is not easy to enter, so the secondary nozzle is not needed. The molten solder jet reaches a predetermined height of the secondary nozzle during operation, and drops to a predetermined jet position during standby. Generally, the error-free solder containing tin (Sn) as the main component has a high melting point. Therefore, the solder temperature in the solder bath must be high, and therefore, the solder bath is also susceptible to oxidation. The invention has the effect of suppressing the oxidation in the solder bath, so it is suitable to use lead-free solder for the soldering of printed circuit boards. Of course, it is also suitable for tin-lead (Sn-Pb) solder with a lower flash point than lead-free solder. ⑻
200541427 【圖式簡單説明】 第1圖是焊錫槽作動時的狀態説明圖。 第2圖是第1實施方式印刷電路板的鍍焊錫方法説明圖。 第3圖是第2實施方式印刷電路板的鍍焊錫方法説明圖。 【圖式中元件名稱與符號對照】 1 :焊錫槽 2 : —次喷嘴 3 :二次喷嘴 4 :熔融焊錫 5:喷嘴出口 6 :印刷電路板 16 (g200541427 [Brief description of the drawing] Figure 1 is an explanatory diagram of the state when the solder bath is operating. FIG. 2 is an explanatory diagram of a solder plating method of the printed wiring board according to the first embodiment. FIG. 3 is an explanatory diagram of a solder plating method for a printed circuit board according to the second embodiment. [Comparison of component names and symbols in the figure] 1: solder tank 2: secondary nozzle 3: secondary nozzle 4: molten solder 5: nozzle outlet 6: printed circuit board 16 (g