五、發明說明（1) 發明所屬之技術領域·· 晶圓有關於一種半導體機台，特別係有關於-種 先前技術·· 麥照第1 a圖其係顯示習知之晶圓測試機台的測試頭 〇，其具有測試頭本體130、第一約束件121、第二約束 件122、印刷電路板11〇、夹持件14〇以及探針座。第— 約束件⑶以及第二約束件122夾住印刷電路板n〇，用以 =制印刷電路板11G的變形程度程度，而連接部i3i與印刷 =，110係透過定位部124(本實施例係採用zif零出力插 結）提供彼此相互固定°測試頭本體130利用連接 口 31^、P刷電路板11〇相接。夹持件14〇 =?:6°設於測試頭100下方。探針座m設於晶二 探針丨口71。亚位於，則试頭100與晶座160之間’其上設有 日*的工：^ 其係顯示習知之測試頭100偵測晶片150 犄的情形。此時晶片1 5 0置於曰ΓΤ ! β n 試頭!。。向下壓下，探針 針痕之中，探針171之另-Λ曰 電路板110的 而插入Ba片150之中。藉此，制 試頭1 0 0對晶片1 5 0進行檢測。 /、 路板itΓ/开2?，卜其士係/貝示晶圓測試機台未啟動時印刷電 „的形狀’此k印刷電路板110並沒有彎曲變形。搭 以及第2b圖’當晶圓測試機台啟動後，晶座 60會對印刷電路板11Q提供熱量，以進行預熱，當預熱初 200541420 五、發明說明（2) __ 期，熱ΐ由晶座1 6 0傳遞至印刷電路板〗1 〇 J110下表面溫度高於上表Φ，因為熱脹冷J吏得印刷電路 電路板1 1 0會向下變形。參照告、但效應，印刷 後，由於熱累積效應，印^刷雷 :Η §頁熱一段時間之 達到-穩定狀態。Μ電路板110反而會向上彎曲而 然而，由於印刷雷敗4 彳 ,Λ., 板 0給要經過相卷ώΑ 本 才能達到第2c圖的穩定狀態，拖長檢測時/的預熱時間 此外，參照第3a圖，印刷電路板11()上。 ，以供探針171插人。第3b、3c圖係顯、數個針 A方向剖面圖。搭配參照第2b圖以及第礼圖，-弟：圖中的 印刷電路板110向下彎曲時，針痕U 3具有—在預^初期 搭配參昭第2 c圄以及笼Q m 上 、’十痕兔> 度d 1 〇 圖 弟3c® ，而當印刷電路板110處於於 疋狀恶而向上彎曲時，針痕113的寬度變成d2，且針' = 度dl大於針痕寬度d2。在正常操下，針痕113的寬度 介於25至35微米之間’探針⑺方能順利插入針痕^而之 中。然而，在習知技術中，由於穩定狀態下的印刷 no向上彎曲’因此其針痕寬度d2可能會小於25微米I路反 而造成探針1 7 1不易插入針痕11 3的問題。 發明内容： 本發明即為了欲解決上述習知技術之問題而提供之一 種半導體機台，包括一印刷電路板、一熱源以及一言周r壯 置。印刷電路板具有一第一表面以及一第二表面。熱:二 印刷電路板周圍的一第一流體穩定提供一熱量，以:/ 刷電路板。調節裝置調節第一表面的溫度，使第一 ^…印 面的V. Description of the invention (1) The technical field to which the invention belongs ... The wafer relates to a semiconductor machine, and in particular relates to a kind of prior art. McMai Photograph 1a shows a conventional wafer test machine The test head 0 includes a test head body 130, a first restraint 121, a second restraint 122, a printed circuit board 11o, a holder 14o, and a probe base. The first-constraining member ⑶ and the second restricting member 122 sandwich the printed circuit board no, for the degree of deformation of the printed circuit board 11G, and the connecting portion i3i and the printing =, 110 are transmitted through the positioning portion 124 (this embodiment The system adopts zif zero-out force plugging) to provide mutual fixation to each other. The test head body 130 is connected with the connection port 31 ^ and the P brush circuit board 110. The clamping member 14〇 = ?: 6 ° is disposed below the test head 100. The probe base m is provided at the crystal second probe 71 port. If it is located in the position between the test head 100 and the crystal base 160, there is a worker with the date * on it: ^ It shows that the conventional test head 100 detects the condition of the chip 150 犄. At this time, the wafer 150 is placed in the ΓΤ! Β n test head! . Pressing downward, the probe pin 171 is inserted into the Ba chip 150 among the probe pin marks. Thereby, the test head 100 checks the wafer 150. / 、 Road board itΓ / Open 2 ?, the shape of the printed circuit board when the Buchi series / Beishi wafer tester is not started. 'This k printed circuit board 110 is not bent and deformed. Figure 2b'Dangjing After the circular test machine is started, the crystal block 60 will provide heat to the printed circuit board 11Q for preheating. When the preheating is started 200541420 V. Description of the invention (2) __ period, the heat transfer from the crystal block 1 60 to the printing Circuit board 1 〇 The temperature of the lower surface of J110 is higher than the above table Φ, because the thermal expansion and cooling will cause the printed circuit board 1 1 0 to deform downward. Refer to the report, but the effect, after printing, due to the heat accumulation effect, the printing ^ Lightning brush: Η § The page heat has reached a stable state for a period of time. The M circuit board 110 will bend upwards. However, due to the printing lightning failure 4 彳, Λ., The board 0 must go through the photo book. This can only reach Figure 2c. Stable state, prolong the detection time / warm-up time. In addition, refer to Figure 3a, on the printed circuit board 11 (), for the probe 171 to insert. Figures 3b, 3c show the direction of several pins A A cross-sectional view. Refer to FIG. 2b and the figure for reference,-Brother: When the printed circuit board 110 in the figure is bent downward, The mark U 3 has-in the early stage of the match with the 2nd c 昭 and the cage Q m, the 'ten mark rabbit> degree d 1 〇 Figure 3c®, and when the printed circuit board 110 is in the shape of a wicked up When bending, the width of the needle mark 113 becomes d2, and the needle '= degree dl is greater than the width of the needle mark d2. Under normal operation, the width of the needle mark 113 is between 25 and 35 microns. However, in the conventional technology, the width of the needle mark d2 may be less than 25 micrometers because the printing no bends in the steady state, so the probe 1 7 1 is not easy to insert into the needle mark 11 3 SUMMARY OF THE INVENTION The present invention is to provide a semiconductor machine in order to solve the problems of the conventional technology. The semiconductor machine includes a printed circuit board, a heat source, and a stand-alone device. The printed circuit board has a first surface. And a second surface. Heat: A first fluid around the two printed circuit boards provides a stable amount of heat to: / Brush the circuit board. The adjusting device adjusts the temperature of the first surface so that the first surface of the printed surface
五、發明說明（3) 溫度低於第二表面的溫声 到穩定狀態。“使印刷電路板的變形快逮達 本發明藉由控制印刷電路板之第一表面以 的表面溫度，而使印刷電路板快二、面 短預熱時間。此外，由於太恭日日：f H 疋狀悲、，縮 狀態控制在-向下彎曲的印刷電路板的變形穩定 兑π ο也 弓曲的狀恶之下，因此可確保針痕罝右 足夠的兔度，能供探針順利插入。 >、 實施方式： f 第4圖’其係顯示本發明之半導體发 1:第頭晶座160。測試頭100具㈣^ 13。、第-約束件121、第二約束件122、印刷 體 夾持件14。、㈣座170以及調節裝置18〇。第； 第二約束件122夾住印刷電路板110，用以限制印刷電 :板uo的變形程度，…妾部131與印刷電路透電 互24固系採用ZIF零出力插座方式連結)提 疋 忒碩本體13 〇利用連接部131與印刷電 :板U0相接。調節裝置180伸入測試頭本體130，透過散 熱部1 2 3將氣流導入第一約走件^ 2 1虛，# 11 η芬笙一从土丄 4采件1 21處以调即印刷電路板 弟一、、々束件121的表面溫度。夾持件140夾持印刷電 路板110。晶座160 (熱源）設於測試頭1〇〇下方，可 電路板11 ◦提供一熱量，以加熱印刷電路板11 0。g❹ 170設於半導體機台之上，並位於測試頭1〇〇與晶座“ο之 間，其上設有探針1 71。 格配參第5 a圖以及第5 b圖，印刷電路板1丨〇具有一 200541420 五、發明說明（4) 第一表面1 1 1以及一第二表面丨丨2。第二表面〗丨2設有複數 個針痕（未圖示）。調節裝置1 8 0利用吹氣的方式調節第一 表面11 1的溫度，使第一表面11 i的溫度低於第二表面^2 ，溫度，以使印刷電路板1 1 〇的變形快速達到穩定狀態。 第5a圖係顯示本發明之印刷電路板丨丨〇未變形時的狀況。 第5b圖係顯示本發明之印刷電路板丨1〇處於穩定狀態時的 情形，與習知技術正好相反，此時本發明之印刷 1 1 0係向下彎曲。 攸 "I ^ I 藉由對印刷電路板UG吹送—氣體而調節 印刷電路板11G的表面溫度，其由以及調節㈣2所 組成。调郎閥182調控該氣體的流量，使該氣體以 〇乂〜◦甘2MPa的壓力吹拂印刷電路如。。該氣體 * 氣或其他氣體，其溫度可相瘂 ^ 佳的溫度範圍可在。。c〜9。視广作，的不同而調整’其較 參照第6圖，其C ’特別可以為25°C。 之中心點位置變化比較。不本” 印刷電路板11G在㈣過Λ 知技術中的 曲線的數值為正值時、，其中心點的位置變化，當 曲，·當曲線的數值為4Γ ΓΜ,]電路板11G向上彎 下彎曲。由曲線2H可心Y表示此時印刷電路板110向 路板11 0的中心點與初始=# ’在習知技術中’印刷電 即，習知技術中的印刷°電置，距離從負值轉向正值，意 向上彎曲，因此會有針^板110先向下彎曲然後在逐漸 曲線22㈣顯示在本發明展：小以及預熱時間過長的問題。 X乃中的印刷電路板110在預熱過程V. Description of the invention (3) The temperature is lower than that of the second surface to a stable state. "Make the deformation of the printed circuit board faster. By controlling the surface temperature of the first surface of the printed circuit board, the present invention makes the printed circuit board faster by two and the surface is shorter in warm-up time. In addition, due to the obedient day: H The shape of the pinch is controlled by the deformation of the printed circuit board that is bent downwards, and the shape of the bow is also curved, so that the needle marks can be ensured to a sufficient degree, and the probe can be smoothly used. ≫, Embodiment: f FIG. 4 ′ shows the semiconductor device of the present invention: the first crystal holder 160. The test head 100 has a ㈣ ^ 13., The first constraint member 121, the second constraint member 122, The printed body clamping member 14., the pedestal 170, and the adjusting device 18. The second restraining member 122 clamps the printed circuit board 110 to limit the degree of deformation of the printed circuit board: the 妾 portion 131 and the printed circuit board. Reuters Telecom 24 is connected by ZIF zero-output socket method) Raising the main body 13 〇Using the connection portion 131 and the printed circuit board U0. The adjusting device 180 extends into the test head body 130 and passes through the heat dissipation section 1 2 3 Introduce the airflow to the first approx. ^ 2 1 virtual, # 11 η The surface temperature of the printed circuit board 1st, 21st, and 21st pieces 121 can be adjusted at pieces 1 to 21. The holding member 140 holds the printed circuit board 110. The wafer 160 (heat source) is located below the test head 100, and can be used for circuit boards. 11 ◦ Provide a heat to heat the printed circuit board 110. The g 170 is located on the semiconductor machine and is located between the test head 100 and the wafer base "ο. A probe 1 71 is provided thereon. Figure 5a and 5b of the grid reference. The printed circuit board 1 has a 200541420 V. Description of the invention (4) The first surface 1 1 1 and a second surface 丨 2. The second surface 2 is provided with a plurality of needle marks (not shown). The adjusting device 1 80 adjusts the temperature of the first surface 11 1 by blowing air, so that the temperature of the first surface 11 i is lower than the temperature of the second surface ^ 2, so that the deformation of the printed circuit board 1 1 〇 is quickly stabilized. status. Fig. 5a shows the state when the printed circuit board of the present invention is not deformed. Fig. 5b shows the situation when the printed circuit board of the present invention is in a stable state, which is the opposite of the conventional technique. At this time, the printed 1 10 of the present invention is bent downward. You " I ^ I adjusts the surface temperature of the printed circuit board 11G by blowing gas to the printed circuit board UG, which consists of and adjusts ㈣2. The regulating valve 182 regulates the flow rate of the gas so that the gas blows the printed circuit at a pressure of 0 MPa to 2 MPa. . The temperature of the gas * or other gas can be relatively good. . c ~ 9. It can be adjusted according to the difference of the production process. It is compared with FIG. 6 and its C 'can be 25 ° C. Compare the change of the position of the center point. If the value of the curve of the printed circuit board 11G in the known technology is positive, the position of its center point changes. When the curve is curved, when the value of the curve is 4Γ ΓΜ, the circuit board 11G bends down Bend. The center point Y of the printed circuit board 110 toward the circuit board 110 at this time is indicated by the curve 2H. The initial value of the printed circuit board is 110 ° in the conventional technology. Negative values turn to positive values, meaning to bend upwards, so there will be a problem that the pin 110 is bent downward and then displayed at a gradual curve 22㈣ at the exhibition of the invention: small and preheating time is too long. X 乃 中 's printed circuit board 110 During the warm-up process
0532-A40248TWF(nl);pt.ap-286;i tshen.ptd 第8頁 200541420 發明說明（5) _ :明ί中；：：位置變化。由曲線210可以觀察到，在本 ^寺在負值，意即，本發明中的印、;一直 曲’而且持續到穩定狀態，因此針痕匕=堇：下彎 解決針痕縮小的問題並縮短預= 本么明猎由控制印刷電路板之第—表面以及第二 狀態控制在—向下彎曲：：：：：印：電路板的變形穩定 足夠的寬度，讀針順=、：：’因此可確保針痕具有 雖然本發明已於車父佳實祐彳丨^ 限定本發明，㈣熟習此；；Γ:路然其並非用以 神和範圍β，仍可作些許的更；：潤：不：離本發明之精 護範圍當視後附之申請專利範圍所界定者：J本發明之保0532-A40248TWF (nl); pt.ap-286; i tshen.ptd page 8 200541420 Invention description (5) _: Mingzhong; :: Position change. It can be observed from the curve 210 that the negative value is present in the temple, that is, the seal in the present invention has been curved and continues to a stable state, so the needle mark dagger = cordier: down bend solves the problem of pin mark reduction and Shorten the pre == control the first surface and the second state of the printed circuit board to control the downward bend ::::: print: the deformation of the circuit board is stable and sufficient width, the reading pin order =, :: ' Therefore, the needle marks can be ensured. Although the present invention has been limited by the driver, Jia Shiyou, you should be familiar with this; Γ: Lu Ran is not used for god and range β, but can still be slightly modified; : No: Depart from the scope of the present invention as defined by the scope of the attached patent: J
200541420 圖式簡單說明 第1 a圖係顯示習知之晶圓測試機台的測試頭； 第1 b圖係顯示習知之測試頭偵測晶片的情形； 第2a圖係顯示印刷電路板的初始情況； 第2b圖係顯示習知之測試頭在預熱時，印刷電路板的 變形情況； 第2 c圖係顯不習知之印刷電路板處於穩定狀怨的情 況； 第3 a圖係顯示印刷電路板表面的針痕；200541420 Brief description of the diagram. Figure 1a shows the test head of a conventional wafer testing machine; Figure 1b shows the situation of a conventional test head detecting a wafer; Figure 2a shows the initial situation of a printed circuit board; Figure 2b shows the deformation of the printed circuit board during the preheating of the conventional test head; Figure 2c shows the situation where the unused printed circuit board is in a stable state; Figure 3a shows the surface of the printed circuit board Pin mark
第3b圖係顯示第3a圖中的印刷電路板向下彎曲時的A 方向剖面圖； 第3c圖係顯示第3a圖中的印刷電路板向上彎曲時的A 方向剖面圖； 第4圖係顯示本發明之半導體機台； 第5a〜5b圖係顯示本發明之測試頭預熱時，印刷電路 板的變形情況； 第6圖係顯示習知與本發明的印刷電路板之中心點位 置變化比較。Fig. 3b is a cross-sectional view of the A direction when the printed circuit board in Fig. 3a is bent downward; Fig. 3c is a cross-sectional view of the A direction when the printed circuit board in Fig. 3a is upwardly bent; The semiconductor machine of the present invention; FIGS. 5a to 5b show the deformation of the printed circuit board when the test head of the present invention is preheated; and FIG. 6 shows the comparison of the change in the position of the center point between the conventional and the printed circuit board of the present invention. .
符號說明： 1 0 0〜測試頭 I 1 0〜印刷電路板 111〜第一表面 112〜第二表面 II 3〜針痕Explanation of symbols: 1 0 0 to test head I 1 0 to printed circuit board 111 to first surface 112 to second surface II 3 to pin mark
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