JP2011171317A - Method for mounting flexible wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting method capable of making thermal expansion of a plurality of flexible wiring boards constant without impairing takt time in mounting the flexible wiring boards to a plate-like body. <P>SOLUTION: The method includes: a step (S6) for measuring the temperature of a stage 15 immediately before compression-bonding; a step (S7) for estimating the thermal expansion of the flexible wiring board 10 immediately after thermocompression-bonding the board 10 to the plate-like body 8 on the basis of the measured temperature; a step (S8) for correcting a control parameter on the basis of the amount of correction of expansion; and a step (S3) for executing next thermocompression bonding. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of mounting a flexible wiring board on a display panel such as a liquid crystal panel or an organic EL (Electro-Luminescence) panel or a plate-like body such as a circuit board.

In recent years, the number of wirings in display panels has increased due to high performance and high definition, and accordingly, the finer pitch of wirings has been advanced.
As shown in FIG. 14B, a plurality of flexible wiring boards 1 each mounted with a driving IC chip are mounted on the outer peripheral portion of the display panel 8. When the flexible wiring board 10 is mounted, an anisotropic conductive film 9 is affixed on the terminals of the display panel 8 as shown in FIG. The anisotropic conductive film 9 is an adhesive in which fine conductive particles are dispersed in a film-like insulating resin material having thermosetting properties.

Then, a plurality of flexible wiring boards 10 are mounted on one display panel 8 by performing a plurality of thermocompression bondings using the crimping apparatus shown in FIG.
As shown in FIG. 15, the ACF 9 is attached to the display panel 8 set on the stage 5, and the flexible wiring board 10 is placed on the ACF 9. Then, the thermocompression bonding tool 4 is lowered with respect to the stage 5, and the thermocompression bonding tool 4 and the stage 5 are thermocompression bonded so that the terminals of the flexible circuit board 10 and the terminals of the display panel 8 are combined. Mounting of the flexible wiring board 10 is completed. Next, the display panel 8 is moved to align the mounting position of the second flexible wiring board 10 directly below the thermocompression bonding tool 4, and then the thermocompression bonding tool 4 is lowered with respect to the stage 5 to perform thermocompression bonding. With the tool 4 and the stage 5, the mounting of the second flexible wiring board 10 is completed by thermocompression bonding so that the terminals of the flexible circuit board 10 and the terminals of the display panel 8 are combined. By repeating this thermocompression bonding cycle for the remaining flexible wiring boards 10 in the same manner, the mounting of the plurality of flexible wiring boards 10 on one display panel 8 is completed.

  At this time, since there is a difference in thermal expansion between the flexible wiring board 10 and the display panel 8, the flexible wiring board 10 side is designed with consideration for elongation correction. In other words, the wiring interval is designed to be short, and is designed to be the same as the wiring interval on the display panel 8 side when thermally expanded.

  However, if the mounting of the flexible wiring board 10 is repeated using the thermocompression bonding tool 4 and the stage 5, the temperature of the stage 5 rises due to the residual heat of the thermocompression bonding tool 4 as the thermocompression bonding is repeated. Since the maximum temperature reached by the flexible wiring board 10 during work increases as the temperature of the stage 5 increases, the amount of thermal expansion of the flexible wiring board 10 changes.

  Specifically, when the terminal width of the display panel 8 is a narrow pitch of less than 40 μm, the amount of thermal expansion of the flexible wiring board 10 changes due to the temperature rise of the stage 5 as described above, and a deviation exceeding an allowable value occurs. It causes poor connection. This is because the allowable deviation between the terminals of the flexible wiring board 10 and the display panel 8 is small.

  In the above description, the case where a flexible wiring board is mounted on a plate-like body of a display panel such as a liquid crystal panel or an organic EL panel has been described as an example, but the flexible wiring board is attached to a plate-like body such as a circuit board. There is a similar problem when implementing.

  Patent Document 1 describes a technique of mounting an integrated circuit chip on a flexible wiring board with a thermocompression bonding tool via an anisotropic conductive film. In this patent document 1, the flexible wiring board and IC chip set on the component mounting stage are used as the display panel 8 and the flexible wiring board 10 in FIG. 10 can be implemented. In this case, as shown in FIG. 16, a heater 6 is installed on the stage 5, and the flexible wiring board 10 is mounted on the display panel 8 while controlling the heater 6 with the temperature adjusting device 7 to keep the temperature of the stage 5 constant. It will be.

JP 2009-194282 A

  However, when a plurality of flexible wiring boards 10 are mounted on the display panel 8 by repeating a plurality of thermocompression bonding cycles using the technique of Patent Document 1, the shape of the stage 5 is a horizontally long shape of about 150 mm. In this case, it is difficult to adjust the temperature of the stage 5.

  Specifically, after crimping the flexible wiring board 10, the temperature of the stage 5 rises above the set temperature of the temperature adjusting device 7 due to the residual heat of the thermocompression bonding tool 4. If the temperature of the stage 5 changes by about 5 ° C., the flexible wiring board 10 changes by about 6 μm, and the influence on the terminal displacement between the flexible wiring board 10 having a narrow pitch of less than 40 μm and the display panel 8 increases.

  Further, when the temperature of the stage 5 is adjusted as described above, if the heat is radiated so as to reach the set temperature of the temperature adjusting device 7, the display panel 8 of the flexible wiring board 10 is only used for the time required for the heat radiation. Since the production tact required for mounting is increased, productivity is lowered. The same applies when a flexible wiring board is mounted on a plate-like body such as a circuit board.

  An object of this invention is to provide the mounting method of the flexible wiring board which can stabilize the thermal expansion amount of the flexible circuit board at the time of crimping | bonding, without impairing production tact.

  The mounting method of the flexible wiring board of the present invention is obtained by measuring the temperature of the stage before thermocompression bonding when the plate-like body and the flexible circuit board are sandwiched between the thermocompression bonding tool and the stage and thermocompression bonded. Based on the temperature of the stage and the first table obtained in advance, the thermal expansion amount of the flexible circuit board in the case of thermocompression bonding is estimated, and the control parameter for thermocompression bonding is determined based on the estimated thermal expansion amount. It is characterized by correcting and thermocompression bonding.

  According to this configuration, since the control parameter for lowering the crimping tool is changed and mounted, the thermal expansion amount of the flexible wiring board can be stabilized without impairing the production tact.

The flowchart of the control apparatus which performs the mounting method of the flexible wiring board of Embodiment 1 of this invention The perspective view of the 1st process of the pressure bonding apparatus of the embodiment The perspective view of the 2nd process of the crimping | compression-bonding apparatus of the embodiment The perspective view of the 3rd process of the crimping | compression-bonding apparatus of the embodiment The perspective view of the 4th process of the pressure bonding apparatus of the embodiment The perspective view of the 5th process of the crimping | compression-bonding apparatus of the embodiment The perspective view of the 6th process of the pressure bonding apparatus of the embodiment The perspective view showing the sensor position of the embodiment The figure showing the control parameter of the same embodiment and the position of the thermocompression bonding tool The top view of the display panel which crimped | bonded the flexible wiring board of Embodiment 2 of this invention The perspective view showing the camera position of Embodiment 3 of this invention Enlarged plan view of the panel recognition mark attached to the display panel and the flexible recognition mark attached to the flexible wiring board of the same embodiment Explanatory drawing of the pre-crimped state of the same embodiment and the photographed image after the final crimping Schematic diagram of a display panel with a flexible wiring board fully bonded. Schematic diagram of a typical crimping device Schematic diagram of conventional technology

Hereinafter, the mounting method of the flexible wiring board of the present invention will be described based on specific embodiments.
Here, a case where a plurality of flexible circuit boards are mounted on a display panel as a plate-like body will be described as an example.

(Embodiment 1)
1 to 9 show Embodiment 1 of the present invention.
As shown in FIG. 2, a crimping apparatus for thermocompression bonding the flexible wiring board 10 and the display panel 8 as a plate-like body with an anisotropic conductive film 9 interposed as shown in FIG. 8 includes a panel stage 14 on which the display panel 8 is set, a thermocompression bonding tool 12 disposed on the upper side of the display panel 8, and a component mounting stage 11 disposed on the lower side of the display panel 8. The component mounting stage 11 includes a horizontally long quartz glass stage 15 and a stainless steel support base 16 that supports the stage 15. The stage 15 is quartz glass, but a metal stage such as stainless steel may be used.

  The component mounting stage 11 itself is not provided with a dedicated heater as in Patent Document 1 for heating the stage, and the stage 15 is heated by the heat generated by the thermocompression bonding tool 12.

The sensor 13 is provided for taking an image of the flexible wiring board 10 and measuring the surface temperature of the stage 15.
The thermocompression bonding tool 12 can be driven up and down with respect to the component mounting stage 11, and the thermocompression bonding tool 12 in FIG. 2 is in a standby position away from the component mounting stage 11. The sensor 13 is supported in the length direction of the stage 15 so as to be movable integrally with the thermocompression bonding tool 12.

The controller of this crimping apparatus is configured as shown in FIG. 1 with a microcomputer (not shown) as a main part. The configuration of this control device will be described together with the work process.
At the start of the operation, as shown in FIG. 2, the display panel 8 on the panel stage 14 is retracted from the component mounting stage 11, and the thermocompression bonding tool 12 is positioned at a standby position above the component mounting stage 11. Yes. Prior to the start of the main pressure bonding, the flexible wiring board 10 is temporarily joined to the corresponding position of the display panel 8.

  In step S <b> 1, as shown in FIG. 3, the thermocompression bonding tool 12 descends from the standby position and directly contacts the stage 15, and the stage 15 is preheated with the heat of the thermocompression bonding tool 12. Specifically, the thermocompression bonding tool 12 heated to 230 ° C. is pressed against the stage 15 for 30 seconds to preheat the stage 15. Thereby, the temperature of the stage 15 rises from about 30 ° C. to about 90 ° C. About 2 seconds after pressing, the maximum temperature is reached, and the temperature of the preheated stage 15 gradually decreases.

Next, as shown in FIG. 4, the thermocompression bonding tool 12 that has been preheated rises to the standby position, and the display panel 8 is returned so that the final crimping position is placed on the stage 15.
In step S <b> 2, it is checked how many sheets of the flexible wiring board 10 are actually bonded to the display panel 8 this time. Since the first is the main pressure bonding of the first flexible wiring board 10, “N = 1” is determined in step S 2, and step S 3 is executed as it is.

In step S3, the thermocompression bonding tool 12 is driven under the conditions shown in FIG.
Initially, the thermocompression tool 12 descends from the standby position 17 to the intermediate position at the first lowering speed 19, and the thermocompression tool 12 stops descending at the intermediate position over the standby time 22. 12 is descending. Here, the first descending speed 19 is faster than the descending speed 20.

  As shown in FIG. 5, the ACF 9 is heated to the curing temperature by sandwiching the display panel 8 on which the flexible wiring board 10 is temporarily bonded between the thermocompression bonding tool 12 and the stage 15, thereby heating the ACF 9 to the curing temperature. The flexible wiring board 10 is finally bonded to the display panel 8. The sandwiching time 24 is a period during which the flexible wiring board 10 and the display panel 8 are sandwiched and heated by the thermocompression bonding tool 12 and the stage 15.

  The stage 15 receives heat from the thermocompression bonding tool 12 by performing the main pressure bonding of the first flexible wiring board 10. Due to this heat, the temperature of the stage 15 is slightly higher than the temperature of the stage 15 at the start of the main press bonding of the first flexible wiring board 10.

  In step S4, it is checked whether the main pressure bonding of all the plurality of flexible wiring boards 10 has been completed. In the first embodiment, at this time, since the main crimping of the first flexible wiring board 10 is completed and there is a thing to be mounted, it is determined as “incomplete” and the process returns to step S2.

  In the case of the main crimping of the second flexible wiring board 10, after “N ≧ 2” is determined in step S2, “N = 2” is determined in step S5, and step S6 is executed.

  In step S <b> 6, as shown in FIG. 6, the thermocompression bonding tool 12 is raised to the standby position 17 and the display panel 8 is retracted from the stage 15. Further, the movement of the thermocompression bonding tool 12 and the sensor 13 in the longitudinal direction of the stage 15 is started and stopped at the position of the second flexible wiring board 10. Further, the temperature Tn of the stage 15 is measured by the sensor 13. Specifically, as shown in FIG. 8, it is preferable to measure the temperature at the center point of the position where the second flexible wiring board 10 enters next.

  In step S7, the temperature difference between the set temperature and the measurement result in step S6 is input to the first table, and the extension amount of the flexible wiring board 10 when the second flexible wiring board 10 is finally crimped is estimated. To do. The set temperature is set in advance according to the time during which the thermocompression bonding tool 12 is directly pressed against the stage 15 in step S1. The first table has N-1 and Nth sheets (here, one sheet) in the case of the main pressure bonding for each surface temperature of the stage 15 during the final pressure bonding of the Nth sheet (here, the second sheet). It is the table | surface which measured the relationship between the surface temperature difference of the stage 15 of the 2nd sheet | seat 15 and the elongation amount of the N-th flexible wiring board 10 by experiment.

  In step S8, the estimated value of the extension amount of the flexible wiring board 10 obtained in step S7 is input to the second table, and a control parameter that reduces the fluctuation of the estimated value of the extension amount obtained in step S7 is determined. Here, the fluctuation is small means that the amount of elongation at the time of the final press bonding of the Nth sheet approaches the amount of elongation at the time of the main press bonding of the (N−1) th sheet (the difference in the amount of expansion becomes small). The second table is a table obtained by experimentally measuring a change in the estimated value of the elongation amount with respect to a change in the second descending speed 20.

  Next, in step S3, the thermocompression bonding tool 12 is lowered to the contact position 21 by the second lowering speed 20 obtained in step S8, and is sandwiched between the thermocompression bonding tool 12 and the stage 15 and heated as shown in FIG. Then, the ACF 9 is warmed to the curing temperature, and the second flexible wiring board 10 is finally bonded to the display panel 8. In the first embodiment, the extension amount of the second flexible wiring board 10 is smaller than that of the first flexible wiring board 10. Therefore, the second flexible wiring board 10 is further warmed by the radiant heat received from the thermocompression bonding tool 12 by making the second lowering speed 20 in the main press bonding slower than the second lowering speed 20 of the initial setting value. . By being warmed by radiant heat, the amount of elongation of the second flexible wiring substrate 10 can be increased, and the amount of elongation of the first flexible wiring substrate 10 is close to that of the first flexible wiring substrate 10 and mounted on the display panel 8 in this state.

  Here, the descending speed of the thermocompression bonding tool 12 is based on the predicted value of the extension amount of the flexible wiring board to be subjected to the final crimping. Next, when it is expected that the amount of extension of the flexible wiring board to be subjected to the final pressure bonding will be smaller than the reference, the lowering speed is slowed and warmed by radiant heat so that the flexible wiring board is further extended. On the other hand, when it is expected that the amount of extension of the flexible wiring board to be subjected to the final press-bonding will be larger than the reference, the descending speed is increased to reduce the influence of radiant heat and suppress the extension of the flexible wiring board. By doing in this way, the difference of the amount of expansions with the flexible wiring board used as a standard can be made small.

  Thus, by using the heat transfer from the thermocompression bonding tool 12 by pressure bonding (only the first pressure bonding preheats the stage 15 with the thermocompression bonding tool 12), the heater and the temperature control device attached to the stage 15 itself are used. The temperature of the stage 15 does not need to be controlled, and even if the main pressure bonding is repeated, the production tact is not deteriorated by using the heater and the temperature control device. Further, in step S8, the flexible wiring board 10 is actively warmed by the radiant heat from the thermocompression bonding tool 12 by making it slower than the descending speed 20 at the time of the main crimping of the second flexible wiring board 10. The elongation amount of the flexible wiring board 10 can be brought close to the elongation amount of the first flexible wiring board 10.

  For the third and subsequent flexible wiring substrates 10, the production accuracy is further improved by updating the correction as follows based on the result of the last main bonding.

  When the final crimping of the second flexible wiring board 10 is completed and the thermocompression bonding tool 12 is raised to the standby position, it is checked in step S4 whether the final crimping of all the plurality of flexible wiring boards 10 has been completed. When the third flexible wiring board 10 is mounted, it is determined as “incomplete” and the process returns to step S2.

  After step S2, it is determined that “N ≧ 3” in step S5, and after performing steps S11 to S14, the main pressure bonding of the Nth (third) flexible wiring board 10 is performed in step S3. Here, step S11 to step S14 will be described for the third flexible wiring board, but this is the same for the fourth and subsequent sheets.

  In step S <b> 9, with the display panel 8 entering on the stage 15, an image of the second flexible wiring board 10 after the main press bonding is taken by the sensor 13, and the extension of the second flexible wiring board 10 is performed. Calculate the amount.

  In step S10, the data on the flexible wiring board 10 of the N-2nd sheet and the N-1th sheet (here, the first sheet and the second sheet) are processed, and the second sheet that has already been subjected to the main crimping. The actual elongation amount of the flexible wiring board 10 is calculated. Based on the actual extension amount of the second flexible wiring board 10 thus obtained, a third table obtained by correcting the first table used for estimating the extension amount in step S7 is calculated.

  In step S <b> 11, the thermocompression bonding tool 12 is raised to the standby position 17 and the display panel 8 is retracted from the stage 15. Further, the movement of the thermocompression bonding tool 12 and the sensor 13 in the longitudinal direction of the stage 15 is started and stopped at the position of the third flexible wiring board 10. Then, the surface temperature of the stage 15 at the position where the third flexible wiring board 10 enters next is measured by the sensor 13 in the same manner as in FIG.

  In step S12, the temperature difference between the surface temperature of the stage 15 measured in step S6 and the surface temperature of the stage 15 measured in step S12 is input to the third table, and the main crimping of the third flexible wiring board 10 is performed. The amount of elongation of the flexible wiring board 10 when performing the above is estimated.

  In step S13, the estimated value of the extension amount of the flexible wiring board 10 obtained in step S12 is input to the second table, and a control parameter that can reduce the fluctuation of the estimated value of elongation obtained in step S7 is determined.

  Next, in step S3, the thermocompression bonding tool 12 is lowered to the contact position 21 by the second descending speed 20 obtained in step S14, and is sandwiched and heated between the thermocompression bonding tool 12 and the stage 15, and the ACF 9 is cured. Then, the third flexible wiring board 10 is finally press-bonded to the display panel 8.

  In the case of the main pressure bonding of the fourth and subsequent flexible wiring boards 10, the routines of Step S9 to Step S13 and Step S3 are repeated. At the time of the N-th press bonding, the control parameter for the main press-bonding is determined in Step S13 while the table used for the main press-bonding control is corrected every time in Step S10 based on the error of the N-1th main press-bonding. Therefore, the variation in the elongation of the plurality of flexible wiring boards 10 mounted on the display panel 8 can be further reduced.

  As described above, the thermal expansion amount of the flexible wiring board can be stabilized without impairing the production tact, and can be applied to the use of mounting a flexible wiring board such as a liquid crystal, an organic EL panel, or a printed wiring board.

  In the above description, the case where the lowering speed 20 is used as an example of the control parameter to be changed has been described. However, the standby time 22 when switching from the lowering speed 19 to the lowering speed 20 is corrected, or the lowering speed 20 is changed from the lowering speed 19 to the lowering speed 20. It can also be realized by correcting the descending distance 23 from the switching point to the contact position 21. A combination of the descending speed 20, the waiting time 22, and the descending speed 23 may be used.

  In the above description, an example in which the sensor 13 performs both the imaging of the flexible wiring board 10 and the surface temperature measurement has been described. However, the surface temperature of the stage 15 and the imaging of the flexible wiring board 10 are separately performed. You may measure with a sensor. Specifically, as will be described later in Embodiment 3, the camera 28 indicated by the phantom line in FIG. 6 is placed on the side opposite to the sensor 13 with the display panel 8 interposed therebetween so as to photograph the display panel 8 retracted from the stage 15 To place. The camera 28 is set so as to photograph the flexible wiring board 10 through the display panel 8 at a position retracted from the stage 15. The camera 28 is driven in the longitudinal direction of the stage 15 together with the sensor 13.

  In the first embodiment, by performing thermocompression bonding to a plurality of flexible wiring boards as described above, it is possible to perform stabilized thermocompression bonding even if the stage 15 does not include a heater. .

(Embodiment 2)
FIG. 10 shows a second embodiment of the present invention.
In the first embodiment, the case where the same flexible wiring board 10 is mounted on the four sides of the display panel 8 has been described. However, in this second embodiment, as shown in FIG. A case where the flexible wiring board 10a on which the chip 26 is mounted is mounted and the flexible wiring board 10b on which the driver chip 26 is not mounted is mounted on another side 27 of the display panel 8 will be described.

  In this way, when the types of flexible wiring boards mounted on the display panel 8 are different depending on the sides, the flexible wiring board 10a on which the driver chip 26 is mounted and the flexible wiring board 10b on which the driver chip 26 is not mounted In the case of the flexible wiring board 10a on which the driver chip 26 is mounted even if the set temperature and control parameters of the thermocompression bonding tool 12 and the temperature on the surface of the stage 15 are the same, the thermocompression bonding to the driver chip 26 is performed. The heat from the tool 12 is likely to be stored, the thermal elongation rate is increased, and the thermal elongation amount is larger than that of the flexible wiring board 10b on which the driver chip 26 is not mounted.

  Therefore, it is desirable to prepare first and second tables for the flexible wiring board 10a on which the driver chip 26 is mounted and the flexible wiring board 10b on which the driver chip 26 is not mounted. When the flexible wiring board 10a on which the driver chip 26 is mounted is mounted on the side 25 of the display panel 8, control is performed based on the first and second tables dedicated to the flexible wiring board 10a on which the driver chip 26 is mounted. When the flexible wiring board 10b on which the driver chip 26 is not mounted is mounted on the side 27 of the display panel 8, the first and second tables dedicated to the flexible wiring board 10b on which the driver chip 26 is not mounted. By controlling based on the above, the flexible wiring boards 10a and 10b can be finally crimped quickly and with good mounting accuracy.

  Here, for the flexible wiring board 10a on which the driver chip 26 is mounted and the flexible wiring board 10b on which the driver chip 26 is not mounted, a first table and a second table are prepared and tables used for the main pressure bonding are prepared. In the case where only the first and second tables dedicated to the flexible wiring board 10a on which the driver chip 26 is mounted is prepared and the flexible wiring board 10b on which the driver chip 26 is not mounted is finally crimped. Is controlled while correcting the dedicated first and second tables of the flexible wiring board 10a on which the driver chip 26 is mounted, based on the correlation between the flexible wiring board 10a and the flexible wiring board 10b previously examined by experiment. You can also

  On the contrary, when only the first and second tables dedicated to the flexible wiring board 10b on which the driver chip 26 is not mounted are prepared and the flexible wiring board 10a on which the driver chip 26 is mounted is finally press-bonded. The operation is performed while correcting the first and second tables dedicated to the flexible wiring board 10b on which the driver chip 26 is not mounted based on the correlation between the flexible wiring board 10a and the flexible wiring board 10b that have been examined in advance. You can also.

  In the above description, the first and second tables are switched between the sides 25 and 27 of the display panel 8 or the first and second tables are corrected and controlled according to the correlation. However, when the flexible wiring board 10a on which the driver chip 26 is mounted and the flexible wiring board 10b on which the driver chip 26 is not mounted are mixedly mounted on a single side of the sides 25 and 27 of the display panel 8. In addition, by switching the first and second tables according to the type of flexible wiring board to be crimped, or by correcting and controlling the first and second tables according to the correlation, quickly, This can be crimped with good mounting accuracy.

  In this way, the type of flexible wiring board is confirmed for each flexible wiring board, the amount of thermal expansion is predicted using the correlation data for each type, and the flexible wiring board is mounted on the display panel 8 while changing the control parameters. .

(Embodiment 3)
11 to 13 show a third embodiment of the present invention.
In the first embodiment, the actual stretch amount of the flexible wiring board 10 is measured by processing the images before and after the main press-bonding imaged by the sensor 13. In the third embodiment, the sensor 13 is a dedicated radiation thermometer that measures the surface temperature of the stage 15, and a camera 28 that captures an image of the flexible wiring board 10 as shown in FIG. It is arranged on the opposite side. The camera 28 is set so as to photograph the flexible wiring board 10 through the display panel 8 at a position retracted from the stage 15. The camera 28 is driven in the longitudinal direction of the stage 15 together with the sensor 13.

A method for measuring the thermal elongation amount of the flexible wiring board 10 will be described.
As shown in FIG. 12, panel recognition marks 29 and 30 are formed on the display panel 8 at all positions where the flexible wiring boards 10 are mounted. Flexible recognition marks 31 and 32 are formed on the flexible wiring board 10. The panel recognition mark size is larger than the flex recognition mark size so that the panel recognition mark and the flex recognition mark can be distinguished. The panel recognition marks 29 and 30 may have different shapes at positions that do not overlap with the flex recognition marks 31 and 32. The flex recognition marks 31 and 32 are located at the same distance from the center P of the flexible wiring board 10, and the interval between the panel recognition marks 29 and 30 is the same as the interval between the flex recognition marks 31 and 32.

  FIG. 13A shows an image taken by the camera 28 when the flexible wiring board 10 is temporarily pressure-bonded to the display panel 8. In this temporary press-bonded state, the center P of the panel recognition mark 29 and the center of the flexible recognition mark 31 coincide with each other, and the center of the panel recognition mark 30 and the flexible recognition mark 32 coincide with each other.

  From the image of the camera 28 immediately after the main press bonding, as shown in FIG. 13B, the shift amount 33 between the panel recognition mark 29 and the flex recognition mark 31 and the shift amount 34 between the panel recognition mark 30 and the flex recognition mark 32. Then, “deviation amount 33 + deviation amount 34” is defined as the extension amount of the flexible wiring board 10.

  By feeding back the difference between the actual amount of elongation of the flexible wiring board 10 thus obtained and the estimated amount of elongation in step S7 or step S13 in FIG. The mounting accuracy can be further improved by changing the control parameter and mounting the next new flexible wiring board 10.

  INDUSTRIAL APPLICABILITY The present invention can improve the mounting accuracy of a flexible wiring board on a plate-like body such as a display panel or a circuit board, and thus can be used for productivity of a display device and the like that are enlarged.

8 Display panel 9 ACF
10, 10a, 10b Flexible wiring board 11 Component mounting stage 12 Thermocompression bonding tool 13 Sensor 14 Panel stage 15 Stage 16 Support base 17 Standby position 18 Lowering position 19, 20 Lowering speed 21 Contact position 22 Standby time 23 Lowering distance 24 Holding time 25 Driver chip 26, 27 Side 28 of display panel 8 Camera 29, 30 Panel recognition mark 31, 32 Flexible recognition mark

Claims (7)

When sandwiching the plate and flexible circuit board between the thermocompression bonding tool and the stage and thermocompression bonding,
Measure the temperature of the stage before thermocompression bonding,
Based on the obtained temperature of the stage and the first table obtained in advance, the amount of thermal elongation of the flexible circuit board when thermocompression bonding is estimated,
A method of mounting a flexible wiring board, wherein a thermocompression control parameter is corrected based on the estimated thermal elongation amount, and thermocompression bonding is performed. When the plate and the plurality of flexible circuit boards are repeatedly sandwiched between the thermocompression tool and the stage and thermocompression bonded,
The method for mounting a flexible wiring board according to claim 1, wherein the thermocompression bonding is performed by correcting the control parameter of thermocompression bonding so as to approach the thermal expansion amount at the time of the previous thermocompression bonding based on the estimated thermal expansion amount. The method for mounting a flexible wiring board according to claim 2, wherein the thermocompression bonding of the flexible wiring board is started after the stage is preheated by bringing the thermocompression bonding tool into contact with the stage before thermocompression bonding. The control parameter to be corrected is
At least one of a descending speed at which the thermocompression bonding tool approaches the stage, or a position before the contact and a standby time when the thermocompression bonding tool is made to wait for a standby time at a position before the contact with the stage. The mounting method of the flexible wiring board in any one of Claims 1-3. The first table obtained in advance is
5. The flexible wiring board according to claim 1, which is a database of a thermal elongation amount obtained in advance from a relationship between a temperature of the stage and a temperature difference between the stage and a thermocompression bonding one time before the stage. Implementation method. 6. The flexible wiring board mounting method according to claim 1, wherein the second table is referred to in order to determine a control parameter for thermocompression bonding from the estimated thermal elongation. Calculate the actual amount of thermal expansion of the flexible wiring board after the previous thermocompression bonding,
Based on the relationship between the temperature of the previous stage, the temperature difference between the previous thermocompression bonding and the second thermocompression bonding of the stage, and the calculated actual thermal expansion amount, The method for mounting a flexible wiring board according to claim 5, wherein the first table is subjected to thermocompression bonding after being corrected.

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