TW200540936A - Laser plotting device, laser plotting method, and method of manufacturing photomask - Google Patents

Abstract

The object of the present invention is to provide a laser plotting device, having the advantages that the productivity will not be lowered even when an object to be exposed having a resist film (photosensitive resin film) formed on the surface thereof is a large photomask or the like, the optimal amount of exposure can be set in accordance with the variation in the thickness of resist film in a small area, and the plotted pattern comprising fine patterns will not be influenced by the variation in the thickness of resist film so that the plotting of pattern can be well performed. The laser plotting device of the present invention comprises a plotting head 1 for irradiating the exposure light onto the object to be exposed 101, a scanning means 5 for moving the position irradiated by the exposure light R on the object to be exposed 101, a means for measuring the film thickness 24 for measuring the thickness of the resist film 102 according to the reflected light of the exposure light R from the object to be exposed 101, and a modulating means 4 for modulating the intensity of the exposure light according to the pattern to be plotted as set in advance and the measurement result of the means for measuring the film thickness 24.

Description

200540936 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a semiconductor wafer, a substrate for a liquid crystal display (LCD) or a photomask, a substrate for an optical disk, and the like, for example, with a surface formed with a resist. The exposure object of the agent film (photosensitive resin film) is irradiated with an exposure light beam, and a laser drawing device, a laser drawing method, and a manufacturing method of a photomask for drawing a designated drawing pattern. [Prior art]

A laser drawing device has been previously proposed, and a resist film (photosensitive resin film) is formed on a surface portion of a semiconductor wafer, a substrate for a liquid crystal display device (LCD) or a photomask, and a substrate for an optical disk, for example. The exposure object is drawn with a designated drawing pattern. In addition, Patent Document 1 discloses a laser drawing device in which a specified drawing pattern is drawn on a substrate such as a large mask using the laser drawing device, and information for predicting strain in the drawing pattern is collected in advance, and the strain is predicted based on the information. , Make a correction image to reduce the strain, and perform pattern drawing based on the correction image. In this laser drawing device, information on uneven thickness of the resist film is collected as information for predicting strain in the drawing pattern. The thickness of the resist film is measured using a contact-type film thickness measuring machine. The information on the thickness unevenness of the resist film is collected by applying a resist to a dummy substrate, and measuring the film thickness of the anti-I insecticide film by using a contact-type film thickness measuring machine at a plurality of locations on the dummy substrate. When the uneven thickness of the resist film exceeds a specific range, adjust the resist coating 5 312XP / Invention Specification (Supplement) / 94-07 / 94109733

200540936 Membrane device (resist coating device), changing the coating conditions, and then coating the dummy substrate with a resist again, so that the uneven film thickness converges within a specific range. In addition, the correction image is created based on the information on the uneven thickness of the resist film at each position of the drawing pattern, and the line width of the drawing pattern is corrected to determine the correction amount of the exposure amount (dose) at each position of the drawing pattern. For the substrate actually exposed, a resist film is applied using the same material as the dummy substrate, and the exposure amount (dose) is corrected based on the correction image, and the exposure corresponding to the designated drawing pattern is performed at the same time. [Patent Document 1] Japanese Patent Publication No. 2 0 3-5 0 8 4 7 [Summary of the Invention] (Problems to be Solved by the Invention) However, in the above-mentioned laser drawing device, the basis for actual exposure Separately, since it is necessary to apply a resist to the dummy substrate and measure the film thickness of the resist, the productivity is lowered. Especially for a large-sized photomask having one side of 300 mm or more in a quadrangular substrate, the measurement of the thickness of the resist film on the entire surface of the photomask significantly reduces the productivity. However, when the resist film is measured on only a few positions of the dummy substrate, the accuracy of the exposure amount correction is reduced. In this case, the optimum exposure amount is not set for the film thickness variation of the resist film in the micro area, and the drawing pattern including the fine pattern is affected by the film thickness variation of the resist film, and thus the quality is deteriorated. The present invention has been proposed in view of the above-mentioned facts, and does not reduce productivity even when the object to be exposed with a resist film (photosensitive resin film) on the surface is a large photomask or the like. For the micro area 312XP / Invention Specification (Supplement) / 94-07 / 94109733, the thickness of the strip film to the thickness of the resist film is large. 6 200540936 The film thickness variation of the resist film can also set the optimal exposure. For drawing patterns containing fine patterns, the laser drawing device, laser drawing method, and mask manufacturing method that can perform good drawing pattern drawing will not be affected by the change in film thickness of the resist film. (Means for Solving the Problems) The laser drawing device of the present invention for solving the above problems has the following structure. [Structure 1]

The laser drawing device of the present invention is characterized by comprising: a drawing head for irradiating an exposure target with a resist film formed on the surface portion with an exposure light beam; and a scanning means for exposing the exposure target to the exposure target. The irradiation position of the light beam is moved; the modulation means is used to adjust the intensity of the exposure beam; and the film thickness measurement means is used to measure the film thickness of the resist film based on the reflected light beam from the exposure beam of the exposure object; The means adjusts the intensity of the light beam for exposure according to a preset drawing pattern and a measurement result of a film thickness measuring means. [Structure 2] The laser drawing device of the present invention includes a drawing head for irradiating an exposure target with a resist film formed on a surface portion by an exposure light beam, and an optical head for the exposure target. Beam irradiation for measuring the thickness of a film; Scanning means to move the irradiation positions of the exposure beam and the film for measuring the thickness of the beam on the object to be exposed; Modulation means for adjusting the intensity of the beam for exposure; and film thickness measurement Means to measure the film thickness of the resist film based on the reflected light beam from the film thickness measurement light beam of the exposure target; the film thickness measurement light beam irradiates the position of the exposure target by the exposure light beam, which is lighter than the exposure light 7 312XP / Invention Manual (Supplement) / 94-07 / 94109733 200540936 First beam irradiation; the modulation means adjusts the intensity of the exposure beam according to the measurement results of the preset drawing pattern and film thickness measurement means. [Structure 3] The present invention is characterized in that in the laser drawing device of Structure 2, the interval between the irradiation position of the exposure beam on the exposure object and the irradiation position of the film thickness measurement beam on the exposure object is set to 1 〇mm or less. [Structure 4]

The laser drawing method of the present invention is characterized in that the method includes the steps of: irradiating an exposure object with an exposure object having a resist film formed on a surface portion by using a drawing head; and exposing the exposure beam on the exposure object. The irradiation position moves; the thickness of the resist film is measured based on the reflected light beam from the exposure beam of the exposure object; and the exposure light beam is adjusted based on the measurement results of the preset pattern and the thickness of the resist film The intensity. [Structure 5] The laser drawing method of the present invention is characterized in that the method includes the steps of irradiating an exposure object with an exposure beam having a resist film formed on a surface portion by using a drawing head, and irradiating the exposure object. Film thickness measurement beam; on the exposure object, for the position irradiated by the exposure beam, the exposure beam and film thickness are measured on the exposure object in such a way that the film thickness measurement beam is irradiated before the exposure beam. Move with the irradiation position of the light beam; measure the film thickness of the resist film based on the reflected light beam for measuring the film thickness of the exposed object; and adjust the measurement result of the predetermined thickness of the drawing pattern and the film thickness of the resist film. Change the intensity of the exposure beam. [Structure 6] 8 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 The manufacturing method of the photomask of the present invention is characterized in that the steps include: using a drawing head to have a resist on the surface portion The mask blank of the film irradiates the exposure beam; moving the irradiation position of the exposure beam on the mask blank; measuring the film thickness of the resist film based on the reflected beam from the exposure beam of the mask blank; and The intensity of the light beam for exposure is adjusted according to a predetermined measurement result of the drawing pattern and the film thickness of the resist film. [Structure 7]

The manufacturing method of the photomask of the present invention is characterized by comprising the steps of irradiating an exposure light beam to a photomask blank having a resist film on a surface portion with a drawing head, and irradiating the photomask blank with a film thickness. Measurement beam; on the mask blank, for the position irradiated by the exposure beam, the exposure beam and film thickness on the mask blank are measured in such a way that the film thickness measurement beam is irradiated before the exposure beam. Move with the irradiation position of the light beam; measure the film thickness of the resist film based on the reflected light beam of the beam thickness measurement film from the mask blank; and measure the film thickness of the resist film based on the preset pattern and the thickness of the resist film , To adjust the intensity of the exposure beam. (Effects of the Invention) In the laser drawing device of the present invention, the modulation means for adjusting the intensity of the exposure light beam irradiated by the drawing head to the exposure object having the resist film formed on the surface portion is based on: Pre-set drawing pattern; and the result of measuring the thickness of the resist film based on the reflected beam from the exposure beam of the exposure object, and measuring the thickness of the resist film to adjust the intensity of the exposure beam; The substrate can measure the film thickness of the anti-remnant film in real time based on the exposure light beam, and can be drawn using the exposure light beam. 9 3] 2XP / Invention Manual (Supplement) / 94-07 / 94] 09733 200540936 Therefore, in this laser drawing device, no film thickness measurement work is required before drawing, and the time required for drawing work can be shortened. In addition, in this laser mapping device, since the film thickness of the resist film is measured using an exposure light beam, there is no need to mount another laser light source, and the structure can be simplified.

In addition, in the laser drawing device of the present invention, the adjusting means for adjusting the intensity of the exposure light beam irradiated by the drawing head to the exposure target having the resist film formed on the surface portion is based on: preset Draw the pattern; and adjust the intensity of the light beam for exposure based on the measurement result of the film thickness measurement method for measuring the thickness of the resist film based on the reflected light beam from the light beam for measuring the thickness of the exposure object; The substrate can measure the thickness of the resist film in real time based on the exposure light beam, and can be drawn using the exposure light beam. Therefore, in this laser drawing device, a film thickness measurement operation is not required before the drawing, and the time required for the drawing operation can be shortened. In addition, in this laser drawing device, the interval between the irradiation position of the exposure beam on the exposure target and the irradiation position of the film thickness measurement beam on the exposure target is set to 10 mm or less. The position where the light beam is drawn allows accurate film thickness measurement of the resist film. That is, the present invention can provide a laser drawing device that does not cause production even when a large object such as a large-size mask is used as an exposure target in which a resist film (photosensitive resin film) is formed on a surface portion. The performance is reduced, and the optimal exposure amount can be set for the change in the thickness of the resist film in a small area. The drawing pattern including the fine pattern is not affected by the change in the thickness of the resist film. Draw a picture of the pattern. 10 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 [Embodiment] The embodiment of the present invention will be described below with reference to the drawings. (First Embodiment of Laser Drawing Device) The laser device of the present invention is a device for drawing a desired pattern on a resist when manufacturing a photomask or the like. This laser drawing device is shown in FIG. 1 and has the following components: a drawing head 1; a light source 3 for emitting a light beam to an exit lens 2 of the drawing head 1; and a modulation element 4 as a modulation means. To adjust the intensity of the exposure light beam R emitted from the light source 3; the deflection element 5 is used as a scanning means to deflect the light path of the exposure light beam R; and the moving stage 6 is used as a scanning means to The substrate 1 0 1 which becomes the object of exposure is irradiated with the light beam emitted from the emitting lens 2 which supports the movable operation. The substrate 1 01 is a photomask blank used for the manufacture of a photomask, etc., and a resist (photosensitive resin) is applied on the surface to form a resist film 102, and the resist film is formed by a laser beam or the like. 1 0 2 Draw the desired pattern.

As shown in Fig. 2, the drawing head 1 of the laser drawing device is provided with an exit lens 2 to emit an exposure light beam R downward, and a base portion 7 for supporting the exit lens. This drawing head 1 is supported by a laser drawing device via a slider 8 so as to be able to rise and fall. In the operation of the laser drawing device, the drawing head 1 descends toward the surface of the substrate 101 to be an exposure target, approaches the surface, and relatively moves the substrate 101 in a horizontal direction by scanning means. That is, the drawing head 1 faces the surface of the substrate 1 0 1 through a narrow narrow gap and moves in the horizontal direction. At the same time, the exposure beam R is irradiated from above the surface of the substrate 1 0 1. 11 312XP / Invention Specification (Supplement) / 94-07 / 94109733

200540936 In addition, the horizontal movement of the head 1 and the substrate 101 in the horizontal direction is described by moving the substrate 101 in the horizontal direction using the moving stage 6. However, the movement can also be performed by using the support slider 8. The stage 9 moves the drawing head 1. In addition, the drawing head is provided with a mechanism for maintaining a certain distance between the surface of the substrate 101 and the substrate 101, and when the substrate is directed toward the substrate 101, an air flow is sprayed onto the substrate 101. In this drawing head 1, the pressure of the air flow sprayed toward the plate 101 is balanced with its own weight, and the floating is performed so as to maintain a constant gap with the substrate 100. That is, the drawing head is lowered toward the substrate 1 by its own weight during the operation of the laser drawing device, and floats by the pressure of the air flow sprayed from the lower portion toward the substrate 101. In this drawing head 1, the floating distance from the substrate 101 caused by the pressure of the air flow sprayed toward the substrate 101 is in the range of 1 0 // m to the number 1 0 0 // m in order to improve the image capability or inspection capability. Very short. As the light source 3, for example, He-Ca emission from a light beam with a wavelength of 4 4 2 n m can be used. The exposure light beam R emitted from the light source 3 enters the modulation element 4 as shown in FIG. 1, and the intensity modulation is performed through the modulation element 4. The variable element 4 is driven by a modulation driver 10 for adjusting the intensity of the penetrating exposure beam R. The modulation driver 10 is supplied with data via a data input device 11, a data processing device 12, a memory 13 and a data reading device 14. The data input device 11 inputs data corresponding to a designation drawn on the resist film 102 on the substrate 101. The data entered by the data input device 11 is sent to 312XP / Invention Manual (Supplement) / 94-07 / 94109733, which can be used to lower the base of the material table, and use 1 0 1 laser dimming to adjust the photo data. 12 200540936 Material processing The device 12 processes the position data (XY coordinate data) and intensity data corresponding to the drawn pattern. The data processed in the data processing device 12 is stored in the memory 13 and read out from the memory 13 by the data reading device 14 and sent to the modulation driver 10. In addition, the data reading device 14 and the modulation driver 10 are controlled by the controller 15 and operate according to the clock output from the clock generator 16.

In addition, the exposure light beam R subjected to the intensity modulation by the modulation element 4 is incident on the deflection element 5 and passes through the deflection element 5 to deflect the emission direction. The deflection element 5 can use, for example, an acoustic-optical conversion element and is driven by the scanning circuit 17 to deflect the optical path of the penetrating exposure light beam R at a certain period. The scanning circuit 17 is controlled by the X Y controller 18 controlled by the controller 15 and operates according to the clock output from the clock generator 16. The exposure light beam R deflected by the deflection element 5 in the emission direction is incident on the emission lens 2 and is condensed and irradiated on the substrate 1 101 with a resist film 102. In this way, the exposure light beam R irradiated on the substrate 101 is deflected at a certain period, and the intensity is adjusted in accordance with the pattern drawn on the substrate 101. In addition, the XY controller 18 drives the moving stage 6 through the servo mechanisms 19, 20, 21, and 22, as shown by the arrow X and the arrow Y in FIG. 1, and makes the substrate 1 0 1 at a specified cycle. A moving operation is performed in the horizontal direction to move the substrate 101 and the drawing head 1 relatively. The drawing method used in this embodiment is generally called a raster scan method. The raster scan method is shown in Fig. 3. The exposure beam R scans the entire drawing area on the substrate 1 01. When it reaches the pattern portion, the exposure is used. 13 312XP / Invention Manual (Supplement) / 9107/94109733

200540936 The intensity of the beam R rises to the specified value (becomes 0 N), and reaches the specified value (becomes OFF) in the non-patterned part. In order to scan the entire drawing area, the scanning of the exposure beam R is performed in a period (scanning unit in the Y direction of the exposure beam R). When scanning in the Y direction is completed, the exposure beam R is transmitted in the direction of The distance (the transmission unit in the X direction of the exposure light beam R) is separated from the adjacent area where the exposure light beam R is scanned, and becomes the area scanned by the lower exposure light beam R. This operation is repeated. When this drawing is completed, the exposure light beam R is transmitted to the next line, and the same drawing is repeated to scan the entire drawing area. When transmitting the exposure beam R to the next line, the method used is to set a slight overlap between the scanning units in the Y direction, and the path is drawn next to the transmitting side). Or to perform multiple exposures, overlap the specified direction in the Y direction. Scanning unit method (multi-path drawing method). In addition, the scanning of the exposure beam R in the Y direction is generally performed by using the deflection of the exposure beam R, and the movement of the exposure beam R in the X direction is performed by the movement of the stage. In this way, the scanning of the intensity-modulated light beam R of the modulated element 4 on the substrate 101 and the movement of the moving stage substrate 101 are performed repeatedly on the substrate 101. Carrying out the import: the drawing of the specified pattern entered. In addition, the speed performed by this method is, for example, about 300 mm2 to 1500 mm2 per minute. In addition, the laser drawing device is provided with a film thickness measuring means, based on the reflected light beam of the exposure light beam R of the substrate 101 to be exposed, 312XP / Invention Manual (Supplements) / 94-〇7, / 94109733, a falling fixed area, There is a sweep of 1 line at 1 in C (single configuration light with the use of exposure 6 of [11 pictured from measurement 14 200540936

The thickness of the resist film. That is, the reflected light beam from the exposure light beam R from the substrate 1 ο 1 passes through the exit lens 2 and the deflection element 5 and reaches the light beam branching element 2 3. The beam splitting element 2 3 is, for example, a beam splitter. The exposure beam R from the modulation element 4 to the deflection element 5 passes through the beam branching element 23. In addition, the exposure light beam R from the deflection element 5 to the modulation element 4 is branched from the optical path to the modulation element 4 through the beam branching element 23, and is incident on a film thickness measurement circuit as a film thickness measurement means. twenty four. This film thickness measuring circuit 24 detects the amount of incident reflected light, and calculates the film thickness of the resist film 102 based on the detection result. The amount of reflected light from the exposure light beam R from the substrate 101 is due to the reflected light from the surface of the resist film 102 and the reflected light from the back surface of the resist film 102 (that is, the surface of the substrate 101). Interference changes. That is, the reflected light amount of the exposure light beam R from the substrate 101 becomes a function of the film thickness of the resist film 102. Therefore, if the relationship between the reflected light amount and the film thickness is specified in advance, the reflected light amount can be used. As a result of the inspection, the film thickness of the resist film 102 was found. In addition, in order to measure the thickness of a resist using the exposure light beam R, it is necessary to generate reflected light (even slightly) from the exposure light beam R of the substrate 101. However, on the other hand, when the laser drawing device is operated, it is generally desirable to suppress the reflected light of the exposure light beam R to be low for reasons of drawing accuracy. Therefore, in this embodiment, to obtain reflected light that can be detected in a range that does not adversely affect the drawing accuracy, it is also possible to adjust the slave substrate 1 0 1 in advance by using a method such as controlling the film thickness of the resist. Reflectivity. 15 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 In addition, the film thickness value of the resist film 10 2 calculated in the film thickness measurement circuit 24 is sent to the modulation driver 10. The modulation driver 10 corrects the adjustment variable of the modulation element 4 based on the film thickness value of the resist film 102. That is, the modulation element 4 adjusts the intensity of the exposure light beam R based on a preset drawing pattern and a measurement result of the film thickness measurement circuit 24.

However, since the intensity of the exposure light beam R is adjusted in accordance with the drawing pattern in the section where the drawing pattern is designated on the substrate 101, the reflected light beam also changes in proportion to the intensity adjustment. Therefore, in this case, the thickness of the resist film is determined based on the relationship between the intensity of the reflected light and the film thickness calculated in advance corresponding to the modulation intensity of the emitted exposure light beam R. That is, in the laser drawing device, as shown in the flowchart of FIG. 4, firstly, in step s11, the light amount of the reflected light beam of the exposure light beam R is detected in a specified film thickness measurement interval of the substrate 101. The film thickness measurement interval is, for example, an interval of about 1 0 0 // Hi. Then, in step s12, the film thickness of the resist film 102 at the drawing points in the film thickness measurement interval is calculated based on the light amount of the detected reflected beam, and the average value is calculated, and the calculation result is memorized. In step st 3, it is judged whether the film thickness of the resist film 102 calculated in step st 2 is included in the specified range. When there is a value included in the specified range, the process proceeds to step s 14. If it is not included in the specified range, the process proceeds to step st 6. The specified range of the film thickness of the resist film 102 here is, for example, a range of approximately 2.5% to ± 5% of the specified film thickness. At step s6, it is judged that the resist film 102 of the substrate 101 is defective, and a warning indicating that there is a defect is issued. The warning is performed by, for example, sounding a warning sound or 16 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 for designated display. In step st4, a correction value of the light amount of the exposure light beam R is determined based on the film thickness of the resist film 1102 calculated in step st2. In step s 5, the exposure amount (dose: D 0 s e) is corrected based on the correction value determined in step s 14, and at the same time as the adjacent film thickness measurement interval is plotted, step s 11 is performed.

In this way, in the laser drawing device, repeating the film thickness measurement of the anti money film 1 2 in the film thickness measurement interval that is not drawn, and drawing the correction of the exposure amount based on the film thickness measurement result, In this way, the drawing of the designated drawing pattern is sequentially performed. In the raster scanning method, according to the above method, when the scanning in the Y-direction scanning unit and the X-direction transmission unit of the exposure light beam R are repeatedly performed, it is practically preferable to set the scanning unit in the Y direction to include an integer number. Film thickness measurement interval. In the single path method, it is more preferable to set the interval except the overlapping portion in the Y-direction scanning unit to include an integer number of film thickness measurement intervals. In this case, in the first Y-direction scanning unit of each line, only the film thickness is measured, and exposure correction is not performed, but exposure correction is performed from the next interval. In addition, when scanning the unit in the Y direction, or an interval other than its overlapping portion, when it is set to include two or more film thickness measurement intervals, the initial interval of each Y-direction scanning unit uses the previous Y The film thickness measurement result of the directional scanning unit is subjected to exposure correction. In addition, the X-direction length of the film thickness measurement interval is preferably practically equal to the X-direction transmission unit equivalent to the beam diameter of the exposure beam R. 17 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 with. In addition, when the scanning unit in the Y direction or an area other than the overlapping portion is set to include one film thickness measurement interval, two or more X-direction transmission units may be used as the film thickness measurement interval. The above method reflects the thickness measurement results of adjacent sections and performs exposure correction. However, the resist film usually does not change the thickness of the film with a microscopic thickness, but changes with a large tendency in the plane, so a sufficient effect can be obtained. . (Second Embodiment of Laser Drawing Device)

In addition, as shown in FIG. 5, the laser drawing device of the present invention may be configured as an optical head 2 provided separately from the drawing head 1 to irradiate the film thickness measurement beam M on the substrate 1 0 1 which is the object of exposure 5. In this case, as shown in FIG. 6, the laser drawing device has a drawing head 1 and an optical head 25 for irradiating a film thickness measurement beam M, and a deflection element 5 and a moving stage for scanning means. 6 is to move the irradiation positions of the exposure light beam R and the film thickness measurement light beam M on the substrate 101. That is, the exposure light beam R emitted from the light source 3 is incident on the modulation element 4, and the intensity modulation is performed by the modulation element 4. The modulation element 4 is driven by a modulation driver 10 to adjust the intensity of the light beam R for penetration exposure. The modulation driver 10 is supplied with data via a data input device 11, a data processing device 12, a memory 13 and a data reading device 14. In addition, the exposure beam R whose intensity is modulated by the modulation element 4 is incident on a deflection element (not shown) for the exposure beam R for the deflection element 5 and transmitted through the deflection element for the exposure beam R. Directional deflection. The deflection element for the exposure light beam R is driven by the scanning circuit 17 to deflect the optical path of the penetrating exposure light beam R at a constant period. 18 312XP / Invention Specification (Supplement) / 94-07 / 94109733

200540936 In addition, the film thickness measurement light beam M emitted from the optical head 25 is incident on a deflection element (not shown) for the film thickness measurement light beam M of the rotating element 5 and passes through the film thickness measurement light beam M for a deflection element. Deflect the shooting direction. The deflection element for the thickness measurement beam M is deflected while maintaining a certain distance between the film thickness measurement beam M and the exposure beam R while the deflection element for the exposure beam R is maintained. The exposure light beam R and the film thickness measurement light beam M, which are deflected by the deflection element 5 in the emission direction, are incident on the emission lens 2 to condense and irradiate the resist film 102 on the substrate 1. In this way, the exposure beam R is irradiated on the substrate 101 and is deflected at a certain period, and the intensity is adjusted in accordance with the pattern drawn on the substrate 1. In addition, the X Υ controller 18 drives the stage 6 through the servo mechanisms 19, 20, 21, 2 and 2, as shown by the arrow X and the arrow 6 in FIG. 0 1 moves in the horizontal direction to move the substrate 1 relative to the drawing head 1 and the optical head 25. In this laser drawing device, the same raster drawing method as in the first embodiment is used. On the substrate 1 01, for example, a data input device 11 is performed at a speed of about 300 mm2 per minute at 5000 m2. The description of the specified designation entered. In addition, this laser drawing device is provided with a film thickness measuring means for measuring the film thickness of the resist film based on the reflected light beam from the film thickness measurement light beam M from the substrate 1 to be exposed. That is, the reflected light beam from the film thickness amount light beam M from the substrate 101 is incident on the film thickness measurement circuit 24 which is a film thickness measurement means through the exit lens 2 and the deflection element 5. The film thickness measurement 312XP / Invention Specification (Supplement) / 94-07 / 94109733 Partially penetrated film piece distance 0 1 of 0 1 Dynamic setting 0 1

200540936 Circuit 24 detects the amount of incident reflected light, and calculates the film thickness of the resist film 102 based on the detection result. The amount of reflected light from the beam M for measuring the film thickness from the substrate 101 is due to the amount of reflected light from the surface of the resist film 102 and from the back surface of the resist film 102 (ie, the surface of the substrate 101). The interference of reflected light changes. That is, because the reflected light amount value of the light beam M for measuring the film thickness from the substrate 101 is a function of the film thickness of the resist film 102, if the relationship between the reflected light amount value and the film thickness is specified in advance, it can be used As a result of measuring the amount of reflected light, the thickness of the resist film 102 was known. In addition, the film value of the resist film 102 calculated by the film thickness measuring circuit 24 is sent to the modulation driver 10. The modulation driver 10 corrects the modulation variable of the modulation element 4 based on the film thickness value of the resist film 102. That is, the variable element 4 adjusts the intensity of the exposure light beam R based on a preset measurement pattern and a measurement result of the film thickness measurement circuit 24. In this laser drawing device, the film thickness measurement light beam M is scanned on the substrate 1 0 1 ″ before the exposure light beam R. That is, the substrate 101 is irradiated with the light beam M for measurement of the film, and then irradiated with the light beam R for exposure. Here, the exposure beam R is irradiated to the position of the etchant film 102 which has been irradiated with the film thickness measurement beam M after the measurement of the film thickness, and the degree is corrected based on the measurement result. In addition, the film thickness measurement beam M is not irradiated with laser light at a wavelength (for example, a wavelength of 500 nm or more) using a resist. In addition, the interval between the irradiation position of the exposure beam R on the substrate 101 and the irradiation position of the film thickness measurement beam M on the substrate 101 is preferably 10312XP / Invention Specification (Supplement) / 94 -07/94109733 Lai Yi, commissioning for thick erosion test j thickness due to high strength plate 20 20 040 936 or less. That is, the film thickness of the resist film 102 (or the correction value of the exposure light beam R based on the film thickness) measured by the irradiation of the film thickness measurement beam M is exposed at the measured position. The period before irradiation with the light beam R must be memorized. However, by narrowing the interval between the exposure positions of the exposure light beam R and the film thickness measurement beam M, the amount of data that must be stored before the exposure light beam R can be reduced.

In addition, the laser drawing device can also be constructed as shown in FIG. 5 so that the film thickness measurement light beam M is irradiated to the substrate 101 at an incidence angle of approximately 45 °, and the film thickness measurement light beam M The reflected light beam emitted from the substrate 110 at an exit angle of approximately 45 ° is directly incident on the film thickness measurement circuit 24. In addition, the film thickness measurement of the resist film 102 by the film thickness measurement circuit 24 may be performed only in the film thickness measurement section of the substrate 101 where the designated drawing pattern is not drawn. In this case, in the laser drawing device, as shown in the flowchart of FIG. 7, first, in step s 11 1, in the film thickness measurement interval of the substrate 101, the reflected beam of the film thickness measurement beam M is detected. Amount of light. The film thickness measurement interval is, for example, an interval of about 10 // πm. Then, in step s 11 2, the film thickness of the resist film 102 is calculated based on the detected light quantity of the reflected beam, and the average value is calculated, and the calculation result is memorized. In step s 11 3, it is determined whether the film thickness of the resist film 1 0 2 calculated in step st 12 is included in the specified range. If it is included in the specified range, the process proceeds to step s 11 4 If it is not included in the specified range, proceed to step st 1 6. The specified range of the film thickness of the resist film 102 here is, for example, a specified film thickness range of about ± 2.5% to ± 5%. 21 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 In step s16, it is judged that the resist film 10 of the substrate 101 is defective, and a warning is issued to indicate that it is defective. This warning is performed, for example, by sounding a warning sound or performing a specified display. In step s 11 4, a correction value of the light amount of the exposure light beam R is determined based on the film thickness of the resist film 10 2 calculated in step s t 1 2. In step s 11 5, the exposure amount (dose: D 0 s e) is corrected based on the correction value determined in step s t 1 4. At the same time as drawing, step s t 1 1 is performed in this interval.

In this way, in the laser drawing device, the film thickness measurement of the resist film 102 in the film thickness measurement interval that is not drawn is repeated, and the exposure amount correction drawing is performed according to the film measurement result, so that In order to draw a designated drawing pattern in sequence. In addition, in the raster scanning method, as described above, when the scanning in the Y-direction scanning unit and the X-direction transmission unit of the exposure light beam R are repeatedly performed, it is preferable to set the scanning unit in the Y-direction practically. Contains an integer number of film thickness measurement intervals. In the case of the single-path method, it is better to set the interval of the scanning unit in the Y direction except for the overlapping portion, which includes an integer number of film thickness measurement intervals. The X-direction length of the film thickness measurement interval is preferably the same as the X-direction transmission unit corresponding to the beam diameter of the exposure beam R. In addition, when the scanning unit is set in the Y direction, or when the interval other than the overlapping portion includes one film thickness measurement interval, two or more X-direction transmission units may be used as the film thickness measurement interval. In this method, the deflection element 5 is set so that the exposure beams R and 22 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 beam thickness measurement beam M are scanned at least in the Y-direction scanning unit, respectively. [Brief Description of the Drawings] FIG. 1 is a block diagram showing the structure of the first embodiment of the laser drawing device of the present invention. Fig. 2 is a perspective view showing the structure of a drawing head according to the first embodiment of the laser drawing device. Fig. 3 is a plan view illustrating a raster scan method of the drawing method of the laser drawing device.

Fig. 4 is a flowchart showing the operation of the first embodiment of the laser drawing device. Fig. 5 is a side view showing the structure of a drawing head according to a second embodiment of the laser drawing device of the present invention. Fig. 6 is a block diagram showing the structure of the second embodiment of the laser drawing device. Fig. 7 is a flowchart showing the operation of the second embodiment of the laser drawing device. [Description of main component symbols] 1 Drawing head 2 Ejection lens 3 Light source 4 Modulation element 5 Deflection element 6 Moving stage 7 Base 23 23312 × P / Invention Manual (Supplement) m-07 / 94109733 200540936 8 Slider 9 Move Load 10 Modulation drive 11 Data rod 12 Data office 13 6 Memory device 14 Data reading 15 Controller 16 Clock production 17 Scanning power 18 ▶ Control 19, 20, 2 1 22 23 Beam split 24 Film thickness measurement 25 Optical head 10 1 Substrate 1 02 Resist M Film thickness measurement R For exposure

Stage actuator Input device Processing device Output device Biomechanical device Servo mechanism Supporting element Measuring circuit Film Measuring light beam 3] 2XP / Invention Manual (Supplement) / 94-07 / 94109733 24

Claims (1)

200540936 10. Scope of patent application: 1. A laser drawing device, comprising: a drawing head for irradiating an exposure light beam with an exposure target on which a resist film is formed on a surface portion; and a scanning method to make the above The irradiation position of the exposure light beam on the exposure object moves; A modulation means for adjusting the intensity of the exposure light beam; and a film thickness measuring means for measuring the film thickness of the resist film based on the reflected light beam from the exposure light beam from the exposure object; the modulation means The intensity of the exposure light beam is adjusted according to a preset drawing pattern and a measurement result of the film thickness measuring means. 2. A laser drawing device, comprising: a drawing head for irradiating an exposure target with a resist film formed on a surface thereof by an exposure light beam; and an optical head for irradiating the exposure target Film thickness measurement beam; Scanning means to move the irradiation positions of the exposure beam and the film thickness measurement beam on the exposure object; Modulation means to adjust the intensity of the exposure beam; and film thickness The measuring means measures the film thickness of the resist film based on the reflected light beam from the light beam for measuring the thickness of the exposure object; the light beam for measuring the thickness is a beam from the object to be irradiated with the light beam for exposure by the exposure object. The position is irradiated before the exposure beam; the modulation means adjusts the intensity of the exposure beam according to a preset drawing pattern and a measurement result of the film thickness measurement means. 25 3] 2XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 3. The laser drawing device according to item 2 of the patent application scope, wherein the irradiation position of the exposure beam on the exposure object and the above The interval between the irradiation positions of the film thickness measurement beam on the object to be exposed is 10 mm or less. 4. A laser drawing method, comprising the steps of: using a drawing head to irradiate an exposure beam with an exposure target having a resist film formed on a surface portion thereof; Moving the irradiation position of the exposure light beam on the exposure object; measuring the film thickness of the resist film based on the reflected light beam of the exposure light beam from the exposure object; and according to a preset drawing pattern and the As a result of measuring the film thickness of the resist film, the intensity of the above-mentioned exposure light beam was adjusted. 5. —A laser drawing method, comprising the steps of: irradiating an exposure object with a resist film having a resist film formed on a surface portion by using a drawing head, and irradiating the exposure object with a film thickness Measuring beam; on the exposure object, for the position irradiated by the exposure beam, the exposure beam and the exposure beam are irradiated with the film thickness measurement beam before the exposure beam; The irradiation position of the film thickness measurement light beam moves; the film thickness of the resist film is measured based on the reflected light beam from the film thickness measurement light beam from the exposure target; and the preset pattern and the resist are measured Measurement of film thickness of film 26 312XP / Invention Specification (Supplement) / 94-07 / 94109733 200540936 As a result, the intensity of the above-mentioned exposure light beam is adjusted. 6. A method for manufacturing a photomask, characterized in that the method includes the steps of: irradiating an exposure light beam to a photomask blank having a resist film on a surface portion by using a drawing head; The irradiation position of the exposure light beam is moved; the film thickness of the resist film is measured based on the reflected light beam of the exposure light beam from the mask blank; and The intensity of the exposure light beam is adjusted based on a preset drawing pattern and a measurement result of the film thickness of the resist film. 7. A method for manufacturing a photomask, characterized in that the method includes the steps of: irradiating the photomask blank having a resist film on a surface portion with an exposure light beam by using a drawing head, and simultaneously irradiating the photomask blank Film thickness measurement beam; on the mask blank, for the position irradiated by the exposure beam, the film thickness measurement beam is irradiated before the exposure beam, so that the above The irradiation positions of the exposure beam and the film thickness measurement beam are moved; the film thickness of the resist film is measured based on the reflected beam of the film thickness measurement beam from the photomask blank; and the preset pattern is drawn. And the measurement result of the thickness of the resist film, the intensity of the exposure light beam is adjusted. 27 312XP / Invention Manual (Supplement) / 94-07 / 94109733