TW200537101A - Conveying device for an automatic IC testerabstract - Google Patents

Abstract

A conveying device for an automatic IC tester includes a driving and positioning device, a conveying unit and a testing unit. By means of the driving and positioning unit IC chips are positioned stably and then driven to contact pressingly a rail pushing block of the conveying unit so as to let an IC chip placed in the rail pushing block, which may push the IC chip to have its pins contact with the test unit for testing its function. The conveying unit has a simple structure for positioning IC chips quickly and driving them for testing.

Description

200537101 V. Description of the invention (1) [Technical field to which the invention belongs] This creation is related to a push device for automatic IC testing. More specifically, it particularly refers to a type of 1C that can be automatically positioned in a prepared position without adjustment. Can push the speed of I c test and drive the organization simply. [Prior art] Please refer to the attached picture, which is a copy of the Patent Bulletin No. 496530, which is a "I c delivery device of the I c test processor", and please refer to the second picture of the attached one, The conventional creative system is a 1C delivery device of the IC test center. It is mainly composed of a vertical axis unit 2, a horizontal axis unit 3, and a holding unit 4 that can position the 1C wafer 8 nozzles in a predetermined distance. , And can be set (or changed) by the program and control the distance of each axis to move back and forth + Er Wu 2: from a sufficient distance to the IC chip 8 to be transported and the front and rear steps of the main slide bar 21 Into the motor group 22, the second im? 1 is nested with a large tail groove block 23, and the element 3 is fixed on the clamping block 24 of the _slot f η type 2 and the dovetail groove block 23: In the vertical axis unit 2 Door block 30 locked-cantilever

Right; the vertical plate 32 and the flat plate 33, the vertical of the vertical plate 32 of the motor group 321 and the second entry motor group 322 drives the S holding device 41 and the second holding device 42 to move left and right. The first holding unit 4 is provided with a first holding unit. The first holding unit 41 is formed by _ # # „: the first holding unit 4 is 4H, and the sliding seat 4 \ i Λ is provided with a dovetail groove. The 4111 L-shaped 1 vertical part is fixed to the first stepping motor group 3ί

200537101 V. Description of the invention (2) One of the belts "is driven by the belt to drive the entire carriage 4 1 1 to move left and right on the cantilever 31. A stepping motor 414 is fixed to the outer side of the carriage 411, and the carriage 4 1 1 An L-shaped plate 412 and a rack 413 meshing with the stepping motor 414 are fixed on the top. A vacuum suction nozzle 413 is provided at the end of the L-shaped plate 412 to suck the wafer. The first holding device 42 has a bottom opening. The dovetail groove 4211's [type slide 421 'whose slide 421 is vertically fixed on a belt of the second stepping motor group 322, and the leather belt drives the entire slide 421 to move left and right on the cantilever 31. The slide A stepping motor 424 is fixed on the outer side of 421, and an L-shaped angle plate 42 2 and a rack 423 which is in line with the stepping motor 424 are fixed on the sliding seat 421. The vacuum nozzle 425 is sucked to suck the wafer-attached person. According to the above, the stepper motor of the vertical axis is controlled by the program to move back and forth between the A area 5 and the B area 6 where the wafer receiving tray is placed; and the first part on the horizontal axis unit 3 enters the motor 3 21 group and the second part Into the motor group, a computer program ^^ is used to make the distance between the first holding device 41 and the second holding device 42 ^ After the positioning is adjusted, the stepper motors 414 and 424 in the two holding devices Driven by the racks 413 and 423, the wafers in the area A are sucked out by the vacuum suction nozzle 4 ^, and placed in the appropriate position from the vertical axis unit 2 to the area B 6. The aforementioned conventional 1C delivery device has the following disadvantages: 1. The combination component is complicated and the operation is complicated. ^ 2. The device occupies a large area. 3. It is easy to produce positioning errors during long-distance delivery. , 4. The phenomenon of cantilever deflection is prone to occur due to the use of cantilevers. 5 · It is easy to cause the machine to shake due to rapid displacement. Li and poor brothers know that they have long been engaged in the development of push components of chemical testing machines and have a considerable understanding of the advantages and disadvantages of the structure of the above-mentioned analysis. , ... = first appeared, and because of this, this case creates A; can quickly locate and develop a more practical and J + tested I c push mechanism. Quick: Dingchuang: It is to provide a kind of push mechanism with few combined components and machine. Method to early IC test [Content of the invention] The mechanism depends on the pushing of the 1c automatic testing machine described in the present invention; piece d; the outer side of the connecting member constructed by the two-position member is provided with a cymbal; The positioning member is arranged on the elastic element; the side is provided with a corresponding positioning stop. The appearance of the door lintel, and the inner wheel feeds the die seat and slides in front of it and is a * guide rail, and the positioning member corresponds to: a slide rail push block, and the slide rail push block is a package, which is provided with The push plate and the rear push plate are set to =: before and after the return < return to the whole group, 200537101 V. Description of the invention (4) and the inner side corresponding to the front and rear push plates is formed with The same sliding guide on the conveying die seat includes a slider, and an accommodating space is formed on the inner side of the slider, and a spring is arranged in the accommodating space, and a rod is arranged between the slider and the spring. Pieces worn among them. Test section: It is located in front of the push section and consists of a test mold base and a base plate. Among them, the test mold base corresponding to the sliding push block of the push section respectively forms a symmetrical test area. The inner side of the test area is provided with a plurality of test pins, and the substrate is connected with the test mold.

The base is connected, and a signal transmitting end connected to the test system is arranged on one side of the base plate. " For the purpose of this creation to have a more detailed and clear understanding of the purpose, efficacy and structural characteristics of 'the following is a preferred embodiment and illustrated with illustrations as follows: ° [Embodiment] Please refer to the first two The figure is combined with the third and fourth figures, which are respectively a three-dimensional schematic diagram of the present invention, a three-dimensional exploded schematic diagram of the present invention, a partial exploded schematic diagram of the driving and positioning section of the present invention, and a three-dimensional schematic diagram of the pushing section of the present invention. As shown, the pushing mechanism of the IC automatic testing machine according to the present invention is mainly composed of a driving positioning section i, a pushing section 2 and a testing section 3. The dynamic positioning section 1 includes a driving member 10 and a positioning member. Wherein, a set of double-acting pneumatic cylinders is provided on the driving member 10, and one end of the double-acting pneumatic cylinder 100 is connected with a connecting member 101, and the one-acting pneumatic cylinder 100 drives the connecting member 101 to form a green reciprocating motion.

Page 9 200537101 V. Description of the invention (5) A spring element 1 03 is provided, and the positioning member 11 is arranged at one end of the connecting member 1 0 1 and has a slightly door shape, and the positioning member 丨 丨A corresponding positioning stop 11 is provided on the inner side, so as to form a function for blocking the positioning. The pushing part 2 is provided adjacent to the drive positioning part 1. The pushing part 2 is composed of a conveying die base 20 and a slide rail pushing block 21. The inside of the conveying die base 20 is formed with a guide. Slide 200 is provided, and a slide rail pushing block 21 is provided at a position corresponding to the positioning member 丨 丨 and adjacent to the guide slide 2000, and the slide pushing block 21 series includes a pair of symmetrical work The front and rear push plates 21 (), 211, and the reset adjustment group 2 丨 2 arranged in groups are arranged on the rear push plate 2 11 ', and the front and rear push plates 2 1 0, 2 11 The inner side is formed with guide slides 2100 and 2110 which are the same as those on the conveying die base 20. The return adjustment group 212 'includes a slider 21 2 0, and the inside of the slider 21 2 0 is formed with a capacity. A space 2121 is provided, and a spring 2122 is provided in the accommodation space 21 21, and a slider 2120 is inserted between the slider 2120 and the spring 2 122. The slider 2 120 can be guided by the lever 23 It slides on the rod 2 123, and the spring 2 122 can be compressed and relaxed in a timely manner to form a position capable of adjusting the displacement and displacement of the slide rail pushing block 21. The test section 3 is located in front of the push section 2 and includes a test mold 30 and a base plate 31. Among them, the test mold base 31 is provided with a sliding push block 21 corresponding to f. A symmetrical test area 300 is formed respectively. The test area 3000 is provided with a plurality of test pins 301 on the inner side; and the substrate 31 is connected to the test mold base 30, and A signal transmitting terminal 33 connected to the test system 32 is disposed on one side of the substrate 31.

Page 10 200537101 V. Description of the invention (6) Please refer to the fifth figure and cooperate with the sixth figure, the sixth figure A, and the seventh and eighth figures, which are schematic diagrams of the operation of the present invention and the first embodiment of the present invention, respectively. A schematic plan view, a partially enlarged schematic diagram of Part B of the sixth diagram of the present invention, a sectional diagram of A-A of the sixth diagram of the present invention, and a three-dimensional exploded diagram of the track pushing block of the present invention. As shown in the figure, the pushing mechanism according to the present invention, The guide rail 200 on the pushing part 2 of the c chip 4 is introduced into the 1C chip 4 from top to bottom by its own weight, and at this time, the double-acting pneumatic cylinder 100 on the positioning part 1 is driven to extend. The drive positioning section 1 is stopped on the receiving position where the slide rail push block 21 of the push section 2 stops, and the guide slide rail 2 on the push section 2 and the slide block 21 are pushed forward and backward by the slide block 21. The upper guide rails 21, 2 and 2110 are in the same plane shape, so that the IC can be quickly introduced into the front and rear push plates 21, 211. The guide slides 2100, 211 inside the slide block 21 It is possible to form the IC for sliding, and at this time, the positioning member 11 of the driving positioning section 1 is used. The positioning stop 110 is provided so that the IC chip 4 can be accurately positioned in the slide rail pushing block 21, so that the 1 to be tested (chip 4 can be quickly and accurately introduced and positioned in an appropriate position to prepare for testing Please refer to the ninth figure and cooperate with the tenth figure, the tenth figure, and the eleventh one are a schematic plan view of the second embodiment of the present invention, the present invention ^, a schematic plan view of a CC scraped surface, and a tenth view of the present invention D x is intended, the ninth figure of the present invention is a schematic diagram of the CC side section, such as the double positioning of the j positioning part! 0 push one forward this == piece 11 is pushed to form a conformation with the slide block 21 .. Continue to push the slide rail pushing block 21 forward, resulting in a double slide rail gas cylinder

200537101 V. Description of the invention (7) The pin 40 on the 1C chip 4 in 21 and the pin 3 0 1 in the test area 300 on the test section 3 are in contact with each other. At this time, the test area 3 00 and a signal loop are formed. The signal transmission end 33 provided on the substrate 3 1 connected to the test mold base 32 is used to judge and test the signal transmission of the test 1C chip 4 in the test system 33. After the test is completed, the drive positioning section The double-acting pneumatic cylinder 1 on 1 will pull the positioning member 1 1 in the opposite direction of the slide block 2 1 set. The action of the double-acting pneumatic cylinder 1 00 is used for sliding rail pushing. The thrust on block 2 J is gradually reduced, and due to the slimmable and relaxing ball dance 2 1 2 2 set on the reset adjustment group 2 1 2, at this time the reset adjustment group 2 on the slide push block 2 1 1 2 will push the slide block 2 1 back to the original bearing position, and use the spring force of the impulse 2122 member on the reset adjustment group 212 to form the function that can automatically position and adjust and return, and position the member丨 丨 The positioning stop 11 0 will continue to pull back due to the double-acting pneumatic cylinder until it is fixed. The position stop block 11 0 completely left the slide rail pushing block 2 1 before the push plate 2 1 0. At this time, the 1C chip under test was blocked by the positioning stop block 11 10, so the IC chip immediately matched its own weight and cooperated. The guide slide is held at 2100 and is discharged out of the automatic pushing mechanism or the next operation program is introduced. At this time, the double-acting pneumatic cylinder 100 pushes out the positioning member 11 and fits with the slide push block 21 to make the positioning block. It is ready to accept another 1C chip to be tested to complete the cyclic action of the pushing mechanism, and by the action of the above components, the IC chip 4 can be automatically positioned at the preliminary position without adjustment and correction, and the IC chip 4 can be accelerated The speed and driving method of the test is simple to push the organization.

Page 12 200537101 V. Description of the invention (8) Dynamic testing machine With the above-mentioned structure design, the IC of the present invention has the following advantages: 1. The combined component is simple and the operation is simple. 2. Automatic positioning is not required to adjust the correct positioning position. 3.Using simple double-acting pneumatic cylinder drive. 4. It is not necessary to use a large area for installation. 5 · In the use of simple reciprocating motion delivery, and can produce rapid positioning effect. 6 · Use double-acting pneumatic cylinders for short-distance reciprocating motion without the phenomenon of changing the curve. 7. It can be quickly moved and positioned without shaking the machine. Based on the above, it can be seen that the present invention has excellent progress and practicality among similar products. At the same time, it has traversed domestic and foreign technical data on such structures. 'No similar structure has been found to exist first. "Properties", "suitable for industrial use" and "progressive" patent requirements, apply according to law.

200537101

Brief Description of the Drawings The first drawing is a schematic diagram of the present invention. The second figure is a schematic diagram of the decomposition of the present invention. The second figure is a partially exploded schematic diagram of the driving positioning part of the present invention

The fourth figure is a three-dimensional schematic diagram of the pusher of the present invention. V The fifth diagram is a schematic diagram of the operation of the present invention. The sixth figure is a schematic plan view of the first / embodiment of the present invention. Figure / A is a partially enlarged schematic diagram of Part 6_2B of the present invention. The seventh figure is a schematic cross-sectional view of the A-A of the present invention. Figure 8 is a three-dimensional exploded view of the orbital pusher of the present invention. The ninth figure is a schematic plan view of a second embodiment of the present invention. The tenth figure is a schematic plan view of the ninth figure c-c of the present invention. The tenth figure A is a partially enlarged schematic diagram of the tenth figure D of the present invention. The eleventh figure is a sound diagram of the ninth figure C-C side section of the present invention. (Knowledge) ^ IC wafer delivery device 1 Main slide lever 21 Dovetail groove block 23 Horizontal axis unit 3 Cantilever 31 First stepping motor group 321 Holding unit 4 Slide 4 1 1 L-shaped plate 412 Stepping motor 414 Longitudinal axis unit 2 Stepping motor group 2 2 Clamping block 24 Door block 30 Standing plate 32 First stepping motor group 3 21 First holding device 41 Dovetail groove 4111 Rack 4 1 3 Vacuum suction nozzle 415 200537101 Figure Brief description of the formula The second holding device 42 Dovetail groove 4211 Rack 4 2 3 Vacuum suction nozzle 425 B zone 6 IC chip 8 乂 The present invention) Drive positioning unit 1 Double-acting pneumatic cylinder 100 Guide rod 102 Positioning member 11 Pushing unit 2 Guide slide 200 Front push plate 2 10 Return adjustment group 2 12 Guide slide 21 10 Storage space 21 2 1 Member 2123 Test mold base 3 0 Test area 3 0 0 Test system 32 IC chip 4 Slide 421 L-shaped plate 422 Stepping motor 424 A area 5 1C wafer receiving disc 7 Driving member 1 0 Connecting member 1 0 1 Spring element 1 0 3 Positioning stopper 110 Conveying mold base 20 Slider pushing block 21 Rear pushing plate 211 Guide slide 2100 Sliding Block 2120 Spring 2122 Test section 3 Substrate 31 Pin 301 Signal transmitting end 3 3 Pin 40

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Claims (1)

200537101 Sixth, the scope of patent application 1. An IC automatic measurement drive positioning unit: It includes' where structural members are structural side members; the door-shaped positioning push mechanism is composed of a driving member driving member system, and the double A guide rod is placed in a reciprocating motion, and the position member is set, and the inner block is mainly special; a certain set of double-acting air pressure, the guide rod is provided with a wind on the connecting side. The dynamic pressure red and the cylinder are connected by a drive and the connecting member is provided with a spring element on one end of the connecting member. A symmetrical pushing part is arranged slightly on the end: it is arranged in front of the drive positioning part, and is connected by the conveying die seat and A slide rail pushing block is formed. A guide slide rail is formed on the inner side of the conveying mold base system, and a slide rail pushing block is provided at a position corresponding to the positioning member and adjacent to the guide slide clamping system, and the slide rail pushing block includes There are a pair of symmetric front and rear push plates and a reset adjustment group arranged in groups on the rear push plates. The inner sides corresponding to the regular and rear push plates form the same appearance as on the conveying die seat. For the guide rail, the reset adjustment system includes a slider, and an accommodation space is formed on the inner side of the slider, and a spring is arranged in the accommodation space, and a rod is inserted between the slider and the spring. Among them, the test section is arranged in front of the push section, and includes a test mold base and a substrate. Among them, the test mold base corresponding to the slide rail push block of the push section is formed as a symmetrical Test area, a plurality of tests are set inside the test area Page 16 200537101 VI. Pins for patent application scope; at one signal transmission end of the substrate and the substrate is connected with the test mold base, and the side is provided with 1C as described in the first item of the area connected with the test system. The wafer is introduced from the top to the bottom on the sliding push block. Pushing machine of dynamic test machine 2 · According to the patent application structure, where the 1C positioning member locates the IC 3 · ^ According to the first item in the scope of the patent application (1): the pushing mechanism of the automatic test machine, wherein the slide rail pushes the block forward and backward The plate system can take the form of work. 4. According to the pushing mechanism of the 1C automatic test machine described in the first item of the scope of patent application, the guide rail system inside the slide rail pushing block can be formed for I c guide slide. Appearance. Page 17