TW200536449A - System and method having the adhering and positioning technique for use in chip substrate package - Google Patents

Abstract

A kind of system and method having the adhering and positioning technique for use in chip substrate package are disclosed in the present invention, aiming to improve the conventional chip packaging technique, including following elements: the substrate adhering-and-fixing module, which has the function of adhering and the positioning the substrate; and the chip-packaging module. Plural chip substrates are disposed on the carrying plate and are fixed by the thermal glue. Then, the chips and the related electronic components are mounted on the chip substrate through the conventional chip-placing technique of the production line so as to increase the production efficiency and save lots of working-hour cost. The invention contains the followings.

Description

200536449 Five 'invention description (1) [Technical field to which the invention belongs] The present invention relates to a method and system for a chip substrate packaging technology (which can replace VPT, Virtual Panel Toolling) has the advantages of improving traditional chip packaging technology 'Improve the traditional νρτ production line to save production costs, and individual machines of the current chip packaging production line can still be used, can have low-cost improvement and great effect of the invention, can be used in most traditional flip-chip wafer production line locations. [Previous technology] As generally recognized by the relevant industries, chip packaging production lines (such as νρτ) and mass production capacity enhancement are various wafer substrate board packaging and foundry manufacturers in recent years, actively researching and constructing projects. Technical methods such as vacuum fixing _ fixed substrate capability machine reference and shortening of maintenance time and improvement of production processes can be applied to various electronic chip application substrate packaging places, so as to reduce maintenance costs and man-hour cost requirements It can be achieved; if a wafer substrate board assembly with many small parts is used, simple and effective placement of the substrate can avoid the possibility of waste of man-hours; similarly, in terms of improving mechanical properties, a working machine If the maintenance period of the table can be extended, it means that the production capacity is increased, so the production cost is reduced; so far, the improvement of the production process can be said to be a very important improvement item, because the wafer sealing machines are mostly made by precision industries. Mechanical, slightly more ^: often expensive, but can match the characteristics of the chip package machine to make peripherals Improve the process, the relatively low cost and effectiveness significantly, in tradition similar to this: ^, engineering process improvement theory can come in handy. "In terms of 1C substrates (including BGA (ball grid array substrate), csp (

200536449 V. Description of the invention (2) 1 specification package substrate), F1ip Chip (Flip Chip Substrate) three categories, of which 1C substrates have grown significantly in recent years; in recent years, Taiwan, South Korea and the mainland have actively expanded the multilayer substrate Production and continued investment in laser drilling machine equipment, ^ increasing competitiveness in substrate production. In the future, as portable electronic products are lighter 2 = smaller, seeking trends will drive circuit boards toward thinning and microvia technology: the development of mounting technology will also make the demand for high-end IC substrates | The outlook for small-size chip packages is promising. Demand for mobile phone boards, communication products and the automotive industry is expected to continue to develop in the future. It is necessary for Λ to develop and break through the technology. η The clothing making technology BGAj CSm Flip chip structure Although the structure has not changed, the Lead Fram type structure has the largest /, transmission μ;

Polynde, ΒΤ, ερ〇χ7 and other organic materials " A 丄 related process observation, its technical connotation is very rich and extensive Development of sealant formulations, application of structural products (professional electroplating), fluid technology. Regardless of the raw material developer (chemical factory board ^ technology factory), or package design and manufacturer (semiconductor factory, ς = author (substrate materials and their processes, further appropriate seal factory), understand this ultimate BGA, CSP The same as Fllp chip structure, the selection of materials should be improved, which is the expertise of Taiwan's science and technology industry. / Door. Especially the process is shown in the figure-(which is printed into the Zhiyue | known chip packaging production line , There is a device: marked with accuracy), in the Japanese and Japanese film packaging assembly, which has the ability to install electronic parts and wafers on the 6th page 200536449 after the brush installation, description of the invention (3) It seems that the printed circuit board is 'not' and the substrate is usually a small piece with a circuit connection, so the chip packaging production V will generally have a larger wafer with a Ηprinting process) | With (subsequent packaging process), i + + (placement process)-(reflow process:, and the placement process is placed ^ brush / process is similar to s M τ production line solder paste printing ⑷ 客 伯 Η 丨 system for placing electronics Parts, however the substrate is placed on the carrier ice post-production & q uot; Printing process = After entering the production line and before the re-soldering process, it has undergone a two-to-wide crystal process, often requiring a vacuum clamping machine (ν ρ τ) to clamp the substrate. Conditions, such as accuracy requirements, if there is a package production line with a complex ρ'νρτ, but the production line & =: ° In actual operation, the chip is in order to adapt to the characteristics of the product, 2 is, and its order is not often changed. The goal. As shown in the second figure, it is difficult to achieve a high-performance substrate 14. The structure of the positioning column 12 makes the second: the column is used for positioning. Because the traditional printing process uses true first w σ and the process is complicated, the material 14 is higher than the positioning. Column 12, in order to facilitate $ 2 (3T process) jacking base, it is necessary to improve. '@' Complicates the process, so in order to simplify the process and can be equipped with high-efficiency operation, it is necessary to simplify it: production line k process, and can continue to fix multiple substrates at the same time on the carrier board / ,, 10 (cancel the positioning post 1 2), line, 'However, this concept is also limited. The production of tooling board packaging must be resistant to high temperature The conditions are limited; this is because of the vehicle or structure (position column 1 2 Bit vain) required by the reflow process (heating), ㊉, trans ^ positioning mechanism (the force given financial and heat to fix the base plate with the configuration by positioning ^ SA shame enabled the production line, to complete the seal

200536449 V. Description of Invention (4) Equipment. Although the heat-resistant mechanism can be designed, it has considerable complexity and difficult to automate processing procedures, which is not conducive to mass production. However, as the demand for electronic products is large, it is also necessary to find a way to make Larger production capacity process to replace the existing chip packaging process. However, the newly developed heat-resistant adhesive has positioning ability and heat resistance. It is heat-resistant and non-curing at local temperature during the reflow process. It can be adhered to the carrier board to pass the entire chip packaging production line, and the base can be placed and removed. The Substrate process is time-saving and easy. When using heat-resistant adhesive, the design of the substrate's automatic pick-and-place auxiliary equipment is easy to be a desirable advantage. The newly created chip packaging production system needs this capability. The peripheral equipment is further structured and conforms to the principle of flow arrangement of industrial engineering. Therefore, a more convenient technique is found to enable the present invention to have the ability to deal with various conditions in various aspects. Therefore, the present invention was developed to meet the above-mentioned needs. [Summary of the Invention] The main object of the present invention is to provide a structure of a chip packaging production system and a method of manufacturing a chip packaging process, and the structure can be implemented at a low cost and in cooperation with related dedicated peripheral automata, and can be used for the same series of production. It can provide low cost and high quality effects in application places such as mouth, different series of products, etc. In order to achieve the above-mentioned object, the present invention improves the conventional vacuum panel (νρτ, Virtual Panel Tooling) type chip package production system invention to directly adhere to a carrier board, and cooperate with a fixed carrier using heat-resistant adhesive

Page 8 200536449 V. Description of the invention (5) With a plate structure and auxiliary equipment on the periphery of the force mouth, a wafer packaging production system that is beneficial to the actual library is economically defined. I feather + # 4% I will not be used ^ It is more valuable to learn the technology. " The present invention Ϊ = ㈣ the substrate is positioned with a positioning module, which has a substrate adhesion positioning function; and: a sheet seal; wherein the substrate adhesion positioning module is located at the end of the chip package branch group, the substrate During assembly, the substrate adhesive positioning module is first passed through the assembly and then the assembly production module; wherein the substrate adhesive positioning module is composed of a machine and equipment, and has a visual positioning camera and a clamping device, so that a plurality of The substrate is positioned on a carrier board in a high-precision manner; wherein the chip packaging module is composed of a plurality of machines and equipment, and has a tin-laying machine port electronic order or a wafer placement machine, a heating machine, and a package. Machine to assemble electronic parts or wafers on the substrate. The method of the invention comprises the following steps: (1) setting a heat-resistant structure at a predetermined position f 'of the carrier plate; (2) setting a plurality of substrates at a predetermined position of the carrier plate; (3) transferring the machine material through tin A paste machine, an electronic part or wafer placement machine, a heating machine, and a packaging machine are used to package the electronic components on the substrate. In order to allow your reviewers to further understand the features and technical valleys of the present invention, please refer to the following detailed description of the present invention. However, the contents are provided for reference and explanation only, and are not intended to limit the present invention. [Embodiment] The operating principle of the present invention is described with reference to the following in May, in which the present invention is based on the principle of fixing multiple substrates on a carrier board by using heat-resistant adhesive to pass assembly

Page 9 200536449 Description of the invention (6) ____ A packaging production line for electronic parts, the ^-will not be cured, so the substrate is loaded and ^ ",-the side of the rubber encounters the back of the Tan process and cooperate with the auxiliary machine, Energy saving ^ Anti 1 & easy to place and pick up, plus the chip package production system. For the practical application, please refer to the fifth figure after the heat-resistant adhesive of the present invention. In the situation, the configuration of the production line can be implemented by (adhesive substrate on the carrier board " ") (placement process)-(reflow process) _ (back itching ,,)-(placement Piece process)-; is to adapt to multiple pieces of substrate-lifting "production: this arrangement and save the person who needs to place the substrate, without the need for positioning columns in the middle of the spring can be completed at low cost. Cost makes the surface of the substrate Part placement is divided into main features. The present invention is based on the order in which its characteristics can be installed and configured, and the cymbals are:-the entire wafer sealing material is lit; :: Γ The substrate passes through the production line first. The base module uses ί :: through the chip package module and the substrate is adhesively positioned, The system enables a plurality of substrates to be positioned on a carrier to pass through a wafer packaging production line; and the substrate is adhered to a positioning module +, δ is prepared, and has a vision positioning camera, a moving arm, and a plurality of wafers. Each substrate is positioned on a carrier board; and for a machine production line, the chip package system can be composed of plural a = sigh, similar to the traditional SMT production line, with tin Plaster " Also, a mouth (may be a solder paste printer), an electronic part or a wafer surface placement machine and a teaching machine, a_t ...., σ to assemble the electronic part on the substrate. And this invention

200536449 V. Description of the invention (7) The superior effect is that the labor saving without the use of positioning columns results in the simplification of the surrounding institutions and the reduction of production costs, and the mass production will make the economic effect obvious. The OEM or manufacturer of the Pianfeng Pei production line often operates continuously for 24 hours until a batch of workpieces is completed before stopping the production line. Therefore, the productivity improvement effect is significant. Please note that the substrate 2 of the present invention is recorded on the carrier board 20 as shown in the third figure. The predetermined position of the heat-resistant adhesive can be set at four corners or edges to apply glue to facilitate the fixing of the substrate.

Please refer to the fourth figure again. After the substrate 2 of the present invention is mastered on the carrier board 20, the solder paste setting machine applies the solder paste (with the steel plate 34) on the substrate 24 with a scraper 32. The process of the invention does not require a vacuum clamping tool (such as νρτ), which is a process that can be completed by simple low-cost equipment.

The system of the present invention has the following changes, wherein the carrier board has heat-resistant adhesive provided at a predetermined position to position the substrate thereon; and wherein the vision positioning camera may be a charge-coupled device (CCD, Charge Coupled Device) or contact image sensor (CIS); and the heat-resistant adhesive composition is composed of at least slllcon, toluene and resin; And in order to prevent thermal expansion and contraction from affecting accuracy, the carrier board is made of glass or ceramic magnetic or metal or composite materials; and it is convenient to design fixtures for ready-made industrial specifications. 'Among them, 3 clamping devices can have a suction cup structure; and For a general wafer packaging production line, B 'wherein the electronic part or wafer placement machine includes an electronic part placement machine, a wafer placement machine; and for automation of wafer placement, the 4-substrate adhesive placement module further includes a moving arm to The substrate

200536449 V. Description of the invention (8) Adhered to the carrier board; i 7 pu 丨 ^ ^ 丄 而 for the precise positioning of each machine in the manufacturing process to match & product requirements: Μι 中 中 蕾 目/, Q load, and the accuracy of dispensing on the board can be 10-35 μm, in order to cooperate smoothly with the machine without any accidents, the present invention can further include a carrier board with full coating resistance and very resistant μ α Α _ ^ J ..., the system makes the heat-resistant adhesive point set at a pre-position, and the carrier plate is fully coated with heat-resistant adhesive, which can include a carrier plate carrier, heat-resistant adhesive coating machine, heat-resistant adhesive Glue initial curing heater and carrier plate collection rack.

A printed circuit board surface adhesion technology method of the present invention uses the system described above, which includes the following steps: (丨) setting a heat-resistant structure at a predetermined position on a carrier board; (2) setting a plurality of substrates on The predetermined position of the carrier board; (3) transferring the machine material through the solder paste deployment machine, the electronic component or wafer placement machine, the heating machine, and the packaging machine to encapsulate the electronic component on the substrate. The heat-resistant structure may be formed of a heat-resistant adhesive. It should be noted that the present invention has the following advantages: 1. Reduced man-hours and increased production value: This point is eliminated by the positioning post. The traditional VPT method of clamping and printing solder paste is not used, so that economic effects are achieved. 2 · Simplified machine: Generally, VPT is equipped with vacuum fixture. The present invention saves at least a more complicated mechanism.

3. Reduced manpower: Simplified manufacturing process reduces manpower naturally. Traditionally placed substrates are performed by manpower, but this method is an automated production method. 4 · Reduce maintenance costs and simplify incidental effects of machine equipment. However, the above descriptions are only the preferred and feasible embodiments of the present invention, and therefore do not limit the scope of the patent of the present invention. Therefore, any equivalent chemical structure changes made by applying the description or the schematic content of the present invention are included in the same way. In the present invention

Page 12 200536449 5. In the scope of the description of invention (9), in order to protect the rights of the inventors, hereby Chen Ming liiii Page 13 200536449 Schematic illustration of the first picture: the conventional flow chart of the chip packaging production line; the second diagram : Is a schematic diagram of a conventional carrier substrate carrying a substrate; the third diagram is a schematic diagram of a substrate sticking method according to a preferred embodiment of the present invention; the fourth diagram is a schematic diagram of a printing solder paste sub-system of the present invention; and the fifth diagram is: The embodiment of the invention is a flowchart of a packaging production line. [Description of component symbols] Carrier board 10 Positioning column 12 Substrate 14 Carrier board 20 Substrate 24 Scraper 32 Steel plate 34

Claims (1)

200536449 Scope of patent application 1. A type used for wafer substrate sealing and mounting; j—A _L It includes: a system with adhesive positioning technology and a substrate adhesion positioning module, which has a substrate adhesion positioning function Chip package module; ^ 'end where the substrate self-locating mold stage is located on the wafer #rapidly, after the substrate is assembled, the substrate is first adhered to the substrate and then the assembly production module is assembled; warranty, and Furthermore, the substrate adhesive positioning module is all the visual positioning cameras and clamping devices of a machine and equipment, so as to position the plurality of substrates on a carrier board in the second way, and the chip package is slightly returned. The module is constructed by a plurality of machines and equipment, and has a tin-laying machine, an electronic part or wafer placement machine, and a heating machine A ^ packaging machine to assemble the electronic parts or wafers on the substrate. '2. The system with adhesive positioning technology for chip substrate packaging as described in the first item of the scope of the patent application, wherein the carrier board has a heat-resistant dispensing device ^ a predetermined position to position the substrate thereon . 3. The system with adhesive positioning technology for chip substrate package as described in item 1 of the scope of the patent application, wherein the vision positioning camera is a Charge Coupled Device (CCD) or a contact image sensing field (CIS , Contract Image Sensor). 4. The system with adhesive positioning technology for wafer substrate sealing as described in item 2 of the scope of the patent application, wherein the heat-resistant adhesive is composed of silicon (s 丨 丨 eQn toluene and resin). 5. For the morning of chip substrate packaging as described in the first patent application Page 15 200536449 VI. Scope of patent application Adhesive positioning technology system’where the material of the carrier board is glass or ceramic magnet or metal or composite material. 6. The system with adhesive positioning technology for wafer substrate packaging as described in the first item of the patent application scope, wherein the clamping device has a sucker-type structure. 7. The system with adhesive positioning technology for wafer substrate packaging as described in item 1 of the scope of the patent application, wherein the electronic part or wafer placement machine includes an electronic part placement machine and a wafer placement machine. 8. The system with adhesive positioning technology for chip substrate packaging as described in item 1 of the scope of the patent application, wherein the substrate adhesive positioning module further includes a moving arm to adhere the substrate to the carrier board . 9. The system with adhesive positioning technology for chip substrate packaging described in item 1 of the scope of the patent application, wherein the accuracy of the dispensing on the carrier board can be 1 0-3 5 // m 〇1 0, if applied The system with adhesive positioning technology for chip substrate package described in item 2 of the patent scope further includes a carrier board full-coating thermal adhesive system, so that the heat-resistant adhesive point is set at a predetermined position. 1 1. The system with adhesive positioning technology for wafer substrate packaging as described in item 10 of the scope of the patent application, wherein the carrier board is fully coated with heat-resistant adhesive, including a carrier board carrier, a heat-resistant glue coating glue machine, Heat-resistant viscose initial curing heater and carrier plate collection rack. 1 2. A method with adhesive positioning technology for chip substrate packaging, which uses the system described in item 1 of the scope of patent application, which includes the following steps: (1) setting the heat-resistant structure at a predetermined position on the carrier board ; Page 16 200536449 Page 17