200531129 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種接觸式影像感測器的感測基板及其加工方法，且 特別疋關於一種可以避免感測基板切割後產生的污染物污染感光元件 的感測基板排配方式及製造方法。 接觸式影像感測器(CIS，Contact Image Sensor)為掃瞒器(Scanner)等 事務機器内部之影像練取裝置，設置於掃瞄平台執道内，由機器系統 藉由固定軌道的連動裝置操控來回運作，透過軟體控制接觸式影像感 測器讀取待掃瞄的圖文，經由光波將待掃瞄之文件資訊轉換成電子訊 號，再由軟體將這些訊號轉換成電子影像擋。 接觸式影像感測器是由感測基板1〇、感測器本體2〇、柱狀透鏡3〇 及一極體光源40等組件組合而成，如第一圖所示。其中感測基板1〇 疋將感光元件4經由電子定位系統定位焊接於感測用的電路板位置 上。接觸式影像感測器的工作原理，是由二極體光源4〇將光線照射到 掃瞄平台上待掃瞄之文件，由於文件上的圖文色澤之深淺不同，所反 射回來的光之強弱度、波長及品質亦不相同，藉由文件所反射回來的 光，經由柱狀透鏡30將反射回來的光聚集到感光元件電荷耦合元件 (CCD，Charge-C〇upled Device)或互補式金屬氧化物半導體（CM〇s，200531129 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a sensing substrate of a contact image sensor and a processing method thereof, and particularly to a method capable of avoiding pollution caused by cutting of the sensing substrate The arrangement method and manufacturing method of the sensing substrate of the photosensitive element. The contact image sensor (CIS) is an image acquisition device inside the office machine such as a scanner. It is installed in the scanning platform and controlled by the machine system through a fixed track linkage device. Operation: The software controls the contact image sensor to read the pictures and images to be scanned, converts the document information to be scanned into electronic signals through light waves, and then the software converts these signals into electronic image files. The contact image sensor is a combination of components such as a sensing substrate 10, a sensor body 20, a lenticular lens 30, and a polar light source 40, as shown in the first figure. The sensing substrate 10 is used to position and position the photosensitive element 4 on the circuit board for sensing via an electronic positioning system. The working principle of the contact image sensor is that the diode light source 40 irradiates light onto the document to be scanned on the scanning platform. Due to the different color depth of the graphics and text on the document, the intensity of the reflected light is weak. The degree, wavelength, and quality are also different. The light reflected by the document is collected by the lenticular lens 30 to the photosensitive element charge-coupled device (CCD, Charge-Coupled Device) or complementary metal oxidation. Physical semiconductor (CM0s,
Complementary Metal Oxide Semiconductor)，感光元件能檢測待掃瞄文 件上不同圖文反射回來的不同光波，將所得到的光波轉換為電子訊 號，再藉由軟體讀取，並轉換成影像圖樓。 200531129 基於這樣的工作原理，影像感測器的感測品質主要是由兩個方面來決 定的·首先是光學元件組（二極體光源、柱狀透鏡及感光元件）的光 學品質；其次則是感測基板中的電路組件所提供的軟體解析效能。由 於在上述的工作原理中，感光元件是用其晶粒表面去接收來自柱狀透 鏡的光學信號’所以在感光元件的表面必須維持高度的清潔度，任何 非預期的污染或斑點都會對光學品質造成極嚴重的毀傷。 【先前技術】 如第二圖所示，在現有的印刷電路板插件製程中，對於像本發明 所涉及的這種小面積的感測基板11常採用連板作業方式進行插件作 業。所謂「連板作業」意指將多個小面積的感測基板U以至少一部份 相連的方式設於一個大面積的電路基板21上。在插件之前，先在大面 積的電路基板21上按模型裁切掉複數的間隔區25，而使感測基板^ 與電路基板21之間只保留兩側的連接部22而彼此相連。 由於電路基板21是由樹脂材料（例如環氧樹脂）為基材，滲合玻 璃纖維等材料所製成的，所以在裁切間隔區25時無可避免的會產生細 微的粉屬與纖維細絲，由於這些粉屑與細絲可能會污染光學元件，所 以在進行插件及焊接作業之前，必須先對電路基板21及連接於其上的 複數感測基板11作清洗的工作。完成清洗工作後的電路基板21將會被 送入自動插件及焊接機中進行電子元件的插件及焊接，然後再使用上 片機（DieBonder)及打線機（wireB〇nder)進行感光元件的設置及連 線作業；接下來’必須將感測基板U與電路基板21連接處之連接部 22由第二囷中虛線所標示的位置切割開來，以便將個別的感測基板11 200531129 由電路基板21上移下來，再由人工或自動機具移置到第一圖所示的感 測器本體20上的安裝位置。 然而，在如第二圖所示的現有技術中，用以連接個別感測基板u 與電路基板21的連接部22係位於該連接斷面的近中央位置，這種配 置的目的可能主要是考慮到作用力的平衡問題，但是在如本發明所涉 及的感測器基板11的製作過程中，這種配置方式卻可能會帶來嚴重的 不良影響。 如刖所述的，電路基板21係由樹脂材料混合玻璃纖維所製成的， 所以在最後切斷感測基板u與電路基板21之間的連接部22時，不可 避免的還疋會產生脫落的纖維細絲，這些細絲中大部份將附著在連接 部22的靖面±，如果不純碰戦獻外力，通常不會掉落而造成 污染。但不幸的是，由於感測基板11的尺寸很小，而且因為複數的感 測元件31係位於感測基板丨丨的一個長側邊上，為了保護感測元件, 所以工作人員的手或自練g&機的緒機具必須祕於制基板u的 兩個端部111及112。又因域測基板u端部⑴及112的斷面尺寸 很小，通常只在i爿2公分之間，所以卫作人員的手或自動裝配機的 夾持機具極易碰觸到連接部22的切斷面，進而使沾附在該斷面上的纖 維細絲掉落域統件31的表面，最終造成雜_器的光學影像品 質受到不良的影響。 【發明内容】 本發明的主要目的即在於暖現械測基板與電路基板的排配關 係，使感測基板連接部的切屬在後續的製程中不易對感光元件造成污 200531129 染，確保影像感測器的光學品質》 本發明實現上述目的方法為：準備—個大面_電路基板；再按預定 的需求將t路基板上特定的區域切除，使電路基板上含有_定個數的感測 基板，且使制基板㈣-端部及第二畴與電路基㈣㈣具連接部， 用以在結構上連接感測基板與電路基板；且鱗_基板分別具有第一邊 緣及相對的第二邊緣，以及第-端部及第二端部，而域所述的連接部至 感測基板的第-邊緣與第二邊緣的距離不相等，而在第—端部與第二端部 上分別形成夾持部。 由於夾持部佔有的尺寸比例大於連接部所佔有的尺寸比例，所以當切 斷感測基板的連接部以分離電路基板與感測基板後，可以讓工作人員的手 或自動裝配機具的夾持器由感測基板的夾持部夾持該等感測基板而不會 碰觸到連接部的切斷口，從而避免使沾附在切斷口上的纖維細絲脫落而對 感光元件造成污染。 【實施方式】 如第三圖所示為本發明影像感測器的感測基板及其加工方法的較 佳實施例。本發明所涉及的複數感測基板50也是採用連板作業方式進 行插件的，在插件之前，先在大面積的電路基板40上按模型裁切掉複 數的間隔區41，而使複數感測基板50與電路基板40之間只保留兩側 的連接部60而彼此相連。 要特別強調的是，在本發明中感測基板50與電路基板40之間的 連接部60並不是位在感測基板50端部53、54的中間位置，而是偏離 到一側的第一及第二角隅53丨、541的位置；亦即，該連接部60至感 200531129 不一樣長的，因此可 測基板50的第一邊緣51及第二邊緣％的距離是 以在感測基板50的兩端分別產生—個完整的夾持區532及⑷ 由於電路基板4G奴續蹄料絲材，渗合義纖維等材料所 製成的，所以在裁切_區41 _是無可避免的會產生細微的纖維細 絲，所以在進行插件及焊接健之前，必須先對基板4g及連接於 其上的複數制基板5G作清洗的卫作。完成清紅作後的電路基板明 將會被送人自動插件及焊接機中進行電子元件（未圖示）的插件及焊 接；而感光元件70則是利用上片機（DieB〇nder)將感光元件7〇設置 在預定的位置，翻打線機（Wil，e BGndeT)在感光元件與感測 基板50的接點間建立連接線路；接下來，必須將感測基板％與電路 基板40連接處之連接部60由第三圖中虛線所標示的位置切割開來， 以便將個別的感測基板50由電路基板4〇上移下來，再由人工或自動 機具移置到如第一圖所示的感測器本體2〇上的安裝位置。 在本發明中，由於用以連接個別感測基板5〇與電路基板4〇的連 接部60係位於該連接端部53及54的一側，且最後切斷連接部6〇所 產生的纖維細絲將大部分的附著在此切斷的切口上，如果不加以碰觸 或施以外力，通常不會掉落而造成污染。如前所述，由於本發明中感 測基板50的連接部60係位於連接端部53及54的一側靠近第一邊緣 51的位置，而分別於感測基板50的兩端保留一個完整的夾持部532及 542。因此，雖然感測基板50的尺寸很小，工作人員的手或自動裝配 機的夾持機具也不會碰觸到連接部60的切斷面，所以沾附在該斷面上 200531129 的纖維細絲將不會掉落至感光元件70的表面，而影像感測器的光學影 像品質即可得到進一步的保障。 【圖式簡單說明】 第一圖為接觸式影像感測器的分解組合圖，用以顯示其中個別元件之 間的關係。 第二圖習知之感測基板與電路基板的排列方式圖。 第三圖為本發明之感測基板與電路基板的排列方式圖。Complementary Metal Oxide Semiconductor), the photosensitive element can detect different light waves reflected from different graphics and text on the file to be scanned, convert the obtained light waves into electronic signals, read them by software, and convert them into image maps. 200531129 Based on such a working principle, the sensing quality of an image sensor is mainly determined by two aspects: first, the optical quality of the optical element group (diode light source, lenticular lens, and photosensitive element); second, Software analysis performance provided by circuit components in the sensing substrate. In the above-mentioned working principle, the photosensitive element uses its crystal grain surface to receive the optical signal from the lenticular lens. Therefore, the surface of the photosensitive element must maintain a high degree of cleanliness. Any unintended pollution or spots will affect the optical quality. Causes extremely serious injuries. [Prior Art] As shown in the second figure, in the existing printed circuit board plug-in manufacturing process, the board-on-board operation method is often used for the small-area sensing substrate 11 according to the present invention. The so-called "connected board operation" means that a plurality of small-area sensing substrates U are arranged on a large-area circuit substrate 21 in such a manner that at least a portion is connected. Before the plug-in, the plurality of spaced areas 25 are cut out according to the model on the large-area circuit substrate 21, so that only the connection portions 22 on both sides are left between the sensing substrate ^ and the circuit substrate 21 and connected to each other. Since the circuit board 21 is made of a resin material (such as epoxy resin) as a base material and impregnated with glass fiber and the like, it is inevitable to produce fine powder and fiber fineness when cutting the space 25. Because these powders and filaments may contaminate the optical element, the circuit substrate 21 and the plurality of sensing substrates 11 connected thereto must be cleaned before the plug-in and soldering operations. After the cleaning work is completed, the circuit board 21 will be sent to an automatic plug-in and welding machine for plug-in and soldering of electronic components, and then use a die bonder and a wire bonder to set and photo sensor components. Wiring work; next, 'the connecting portion 22 where the sensing substrate U and the circuit substrate 21 are connected must be cut from the position indicated by the dotted line in the second frame in order to separate the individual sensing substrate 11 200531129 from the circuit substrate 21 Move it down and move it to the installation position on the sensor body 20 shown in the first figure by manual or automatic tools. However, in the prior art as shown in the second figure, the connection portion 22 for connecting the individual sensing substrate u and the circuit substrate 21 is located near the center of the connection section. The purpose of this configuration may be mainly considered To the problem of force balance, but in the manufacturing process of the sensor substrate 11 according to the present invention, this arrangement may bring serious adverse effects. As described above, the circuit substrate 21 is made of a resin material mixed with glass fiber, so when the connection portion 22 between the sensing substrate u and the circuit substrate 21 is finally cut off, it will inevitably fall off. Fiber filaments, most of these filaments will be attached to the surface of the connecting portion 22, if the impure contact with external force, usually will not fall and cause pollution. Unfortunately, because the size of the sensing substrate 11 is small, and because the plurality of sensing elements 31 are located on one of the long sides of the sensing substrate, in order to protect the sensing elements, workers ’hands or The threading machine of the g & machine must be secreted at the two end portions 111 and 112 of the substrate u. And because the cross-sectional dimensions of the end of the field measurement substrate u and 112 are very small, usually only between i 爿 2 cm, the hand of the guardian or the clamping tool of the automatic assembly machine can easily touch the connecting portion 22 The cut surface of the device further causes the fiber filaments adhered to the cut surface to fall to the surface of the domain unit 31, and finally the optical image quality of the device is adversely affected. [Summary of the invention] The main purpose of the present invention is to arrange the arrangement relationship between the thermal detection substrate and the circuit substrate, so that the cut of the connection portion of the sensor substrate is not easy to stain the photosensitive element in the subsequent process, ensuring the image feeling. The optical quality of the measuring device "The method for achieving the above purpose of the present invention is: preparing a large surface _ circuit substrate; and then cutting out a specific area on the t-channel substrate according to a predetermined demand, so that the circuit substrate contains a predetermined number of sensing The substrate, and the substrate-end portion and the second domain and the circuit base fixture connection portion are used to structurally connect the sensing substrate and the circuit substrate; and the scale substrate has a first edge and an opposite second edge, respectively. , And the first and second ends, and the distance from the connection portion described in the field to the first and second edges of the sensing substrate is not equal, and is formed on the first and second ends, respectively. Clamping section. Since the proportion of the size occupied by the clamping portion is larger than the proportion of the size occupied by the connection portion, when the connection portion of the sensing substrate is cut to separate the circuit substrate and the sensing substrate, a worker's hand or an automatic assembly tool can be clamped. The device clamps the sensing substrates by the clamping portions of the sensing substrates without touching the cutouts of the connection portions, thereby avoiding the fiber filaments attached to the cutouts from falling off and contaminating the photosensitive elements. [Embodiment] As shown in the third figure, a preferred embodiment of a sensing substrate of an image sensor of the present invention and a processing method thereof are shown. The plurality of sensing substrates 50 according to the present invention are also inserted using a continuous board operation method. Before the insertion, the plurality of spaced areas 41 are cut out according to a model on a large-area circuit substrate 40 to make the plurality of sensing substrates. Only the connection portions 60 on both sides remain between the 50 and the circuit substrate 40 and are connected to each other. It is particularly emphasized that in the present invention, the connection portion 60 between the sensing substrate 50 and the circuit substrate 40 is not located in the middle position of the ends 53 and 54 of the sensing substrate 50, but is first offset from one side. And the positions of the second corners 53 丨, 541; that is, the connecting portion 60 to the sense 200531129 is not the same length, so the distance between the first edge 51 and the second edge of the measurable substrate 50 is between the sense substrate The two ends of 50 produce a complete clamping area 532 and ⑷ respectively. Because the circuit board 4G is made of materials such as wire material and infiltrated fiber, it is unavoidable in the cutting _ area 41 _ It will produce fine fiber filaments, so it is necessary to clean the substrate 4g and the multiple substrates 5G connected to it before performing the plug-in and soldering. After the circuit board is finished, the circuit board will be sent to the automatic plug-in and soldering machine for electronic component (not shown) plug-in and soldering; and the photosensitive element 70 is photosensitive using a die mounter. The component 70 is set at a predetermined position, and a rewinder (Wil, e BGndeT) establishes a connection line between the contact point of the photosensitive element and the sensing substrate 50; next, the sensing substrate must be connected to the circuit substrate 40. The connecting portion 60 is cut away from the position indicated by the dotted line in the third figure, so that the individual sensing substrate 50 is removed from the circuit substrate 40, and then manually or automatically moved to the position shown in the first figure. Mounting position on the sensor body 20. In the present invention, since the connection portion 60 for connecting the individual sensing substrate 50 and the circuit substrate 40 is located at one side of the connection end portions 53 and 54, the fiber fines generated by the connection portion 60 are finally cut off. Most of the wires are attached to the cut incision, and if they are not touched or applied with external force, they will not fall and cause pollution. As mentioned above, in the present invention, since the connecting portion 60 of the sensing substrate 50 is located on the side of the connecting ends 53 and 54 near the first edge 51, a complete one is retained at each end of the sensing substrate 50. Clamping sections 532 and 542. Therefore, although the size of the sensing substrate 50 is small, a worker's hand or a holding tool of the automatic assembly machine will not touch the cut surface of the connecting portion 60, so the fibers adhered to the cut surface 200531129 are fine. The filament will not fall to the surface of the photosensitive element 70, and the optical image quality of the image sensor can be further guaranteed. [Brief description of the diagram] The first diagram is an exploded combination diagram of the contact image sensor, which is used to show the relationship between individual components therein. The second diagram is a conventional arrangement of a sensing substrate and a circuit substrate. The third figure is an arrangement diagram of the sensing substrate and the circuit substrate of the present invention.