CN103547082A - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
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- CN103547082A CN103547082A CN201210238417.2A CN201210238417A CN103547082A CN 103547082 A CN103547082 A CN 103547082A CN 201210238417 A CN201210238417 A CN 201210238417A CN 103547082 A CN103547082 A CN 103547082A
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Abstract
The invention provides a circuit board manufacturing method which includes the steps: providing a circuit substrate comprising a circuit board unit and a waste portion; punching along a first junction portion for the first time to separate part of a first product area from the waste portion; assembling electronic components on the part of the first product area; punching along a second junction portion and the junction line of a second product area and the waste portion for the second time to separate the circuit board unit from the waste portion. The circuit board unit comprises the first product area and the second product area, the junction line of the first product area and the waste portion comprises the first junction portion and the second junction portion, the first junction portion comprises a first product side and a second product side, the second junction portion comprises a third product side and a fourth product side, the included angle between the first product side and the third product side intersected in the first product area ranges from 0 degree to 180 degrees, the included angle between the second product side and the fourth product side intersected in the first product area ranges from 0 degree to 180 degrees, and the distance between each electronic component and the first junction portion is shorter than 5mm.
Description
Technical field
The present invention relates to circuit board technology, relate in particular to a kind of manufacture method with the circuit board that is assembled with electronic devices and components.
Background technology
In information, communication and consumer electronics industry, circuit board is the indispensable basic comprising important documents of all electronic products.Along with electronic product is toward miniaturization, high speed future development, circuit board also from single-sided circuit board toward double-sided PCB, multilayer circuit board future development, the electronic devices and components of assembling on circuit board are also more and more.
Generally speaking, electronic devices and components were assembled on circuit board before stamp, be on the one hand to utilize waste part support, contraposition, and to guarantee the precision of assembling, be also to facilitate Batch assemblage on the other hand, be conducive to improve packaging efficiency.Yet, when the external form of electronic devices and components is during near the external form of circuit board, will cause the problem that is difficult to carry out stamp after assembling, the electronic devices and components that shatter when also may make stamp, cause the inefficacy of circuit board.
Summary of the invention
Therefore, be necessary to provide a kind of manufacture method with the circuit board with electronic devices and components of better product quality.
To a kind of manufacture method of circuit board be described with embodiment below.
A kind of manufacture method of circuit board, comprise step: provide circuit substrate, described circuit substrate comprises at least one circuit board unit and scrap portion around being connected described at least one circuit board unit, described circuit board unit includes the first adjacent product zone and the second product zone, described the first product zone is used for assembling electronic devices and components, described the first product zone and scrap portion have the first boundary line, described the second product zone and scrap portion have the second boundary line, described the first boundary line comprises the first boundary part and the second boundary part, described the first interface is divided and is comprised the first product limit and the second product limit, described the second interface is divided and is comprised three products limit and four-product limit, described three products limit, four-product limit is all connected with described the second boundary line, intersect on described the first product limit and three products limit, and the first product limit and three products limit angle in the first product zone is greater than 0 degree and is less than 180 degree, intersect on described the second product limit and four-product limit, and the second product limit and four-product limit angle in the first product zone is greater than 0 degree and is less than 180 degree, along first of the first product zone and the scrap portion part of having a common boundary, described circuit substrate is carried out to stamp for the first time so that part the first product zone and waste part from, this part and waste part from the first product zone on assemble electronic devices and components, the external form of described electronic devices and components and the first spacing of having a common boundary part are less than 5mm, and along have a common boundary part and described circuit substrate is carried out to stamp for the second time along the second boundary line of described the second product zone and scrap portion of second of the first product zone and scrap portion, so that circuit board unit and waste part from, thereby obtain the circuit board unit assembled electronic devices and components.
In the technical program, by stamp for the first time make partial circuit plate unit and waste part from, then with waste part from this partial circuit plate unit on assemble electronic devices and components, again by stamp for the second time make whole circuit board units all with waste part from, so, the external form of the electronic devices and components of assembling can be near the border of circuit board unit, , the external form of electronic devices and components or can with the external form interference of circuit board unit, the external form of having avoided electronic devices and components is difficult to the problem of separate circuit boards unit during near the border of circuit board unit or with the external form interference of circuit board unit, and for the second time during stamp away from this partial circuit plate unit, also, just away from electronic devices and components, substantially can not affect the product structure of electronic devices and components, can not shake, the electronic devices and components that shatter, so can guarantee the yield of assembling.
Accompanying drawing explanation
The schematic diagram of the circuit substrate that Fig. 1 provides for the technical program the first embodiment.
Fig. 2 for carrying out forming after stamp for the first time the schematic diagram of the first stamp opening on the circuit substrate of Fig. 1.
Fig. 3 is for assembling the schematic diagram after electronic devices and components on the circuit substrate after the stamp for the first time of Fig. 2.
Fig. 4 for forming the schematic diagram that the second stamp opening does not illustrate the first stamp opening after stamp for the second time on the circuit substrate of Fig. 3.
Fig. 5 for forming the second stamp opening after stamp for the second time and illustrating the schematic diagram of the first stamp opening on the circuit substrate of Fig. 3.
Fig. 6 is the schematic diagram of the circuit board product of the technical program the first embodiment acquisition.
The schematic diagram of the circuit substrate that Fig. 7 provides for the technical program the second embodiment.
Fig. 8 for carrying out forming after stamp for the first time the schematic diagram of a plurality of the first stamp openings on the circuit substrate of Fig. 7.
Fig. 9 is for assembling the schematic diagram after a plurality of electronic devices and components on the circuit substrate after the stamp for the first time of Fig. 8.
Figure 10 for forming for the second time the schematic diagram of the second stamp opening after stamp on the circuit substrate of Fig. 9.
The schematic diagram of the circuit substrate that Figure 11 provides for the technical program the 3rd embodiment.
Figure 12 for carrying out forming after stamp for the first time the schematic diagram of the first stamp opening on the circuit substrate of Figure 11.
Figure 13 forms the second stamp opening after stamp for the second time and does not illustrate the schematic diagram of the first stamp opening on the circuit substrate of Figure 12.
Figure 14 for forming the second stamp opening after stamp for the second time and illustrating the schematic diagram of the first stamp opening on the circuit substrate of Figure 12.
The schematic diagram of the circuit substrate that Figure 15 provides for the technical program the 4th embodiment.
Figure 16 for carrying out forming after stamp for the first time the schematic diagram of the first stamp opening on the circuit substrate of Figure 15.
Figure 17 forms the second stamp opening after stamp for the second time and does not illustrate the schematic diagram of the first stamp opening on the circuit substrate of Figure 16.
Figure 18 for forming the second stamp opening after stamp for the second time and illustrating the schematic diagram of the first stamp opening on the circuit substrate of Figure 16.
Main element symbol description
| |
10、20、30、40 |
| |
11、21、31、41 |
| |
14、24、34 |
| The |
12、22、32 |
| The |
13、23、33 |
| The first boundary line | 120 |
| The second boundary line | 130、330 |
| The first boundary part | 121 |
| The second boundary part | 122、322 |
| The first product limit | 1201、3201 |
| The second product limit | 1202、3202、4202 |
| The 5th product limit | 1205 |
| Three |
1203、3203 |
| Four- |
1204、3204、4204 |
| The 6th product limit | 1301 |
| The 7th product limit | 1302 |
| The 8th product limit | 1303 |
| The first stamp opening | 15、25、35、45 |
| The |
151 |
| The |
152 |
| The |
153 |
| The |
154 |
| The |
1511 |
| The |
1512、4512 |
| The |
1515 |
| The |
1501 |
| The |
1502、4502 |
| The |
1505 |
| Electronic devices and components | 19、29、39、49 |
| The second stamp opening | 16、26、36、46 |
| The stamp edge of a |
17、27、37、47 |
| Circuit board product | 11a |
| The |
161 |
| The |
162 |
| The |
163 |
| The |
164 |
| The |
1613、3613 |
| The |
1614、3614 |
| The |
1616 |
| The |
1617 |
| The |
1618 |
| The |
1603、3603 |
| The 4th stamp groove | 1604、3604 |
| The |
1606 |
| The |
1607 |
| The |
1608 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with accompanying drawing and a plurality of embodiment, the manufacture method of the circuit board that the technical program is provided is described in further detail.
The manufacture method of the circuit board that the technical program the first embodiment provides, comprises step:
The first step, refers to Fig. 1, and circuit substrate 10 is provided, and described circuit substrate 10 comprises circuit board unit 11 and scrap portion 14 around being connected described circuit board unit 11.Circuit board unit 11 for completed the steps such as boring, plating, circuit making, welding resistance printing, electronic devices and components to be assembled and treat to become article unit by the stamp circuit board separated with scrap portion 14.It will be understood by those skilled in the art that circuit board unit 11 surfaces have solder mask and the connection gasket that exposes from solder mask etc., Fig. 1 only schematically draws circuit substrate 10, and does not show those solder masks, connection gasket etc.The shape and size of circuit substrate 10 are not limit, and according to real needs, determine, and in the present embodiment, circuit substrate 10 is rectangle.
Described the first product zone 12 and the second product zone 13 all and between scrap portion 14 have boundary line.Wherein, between the first product zone 12 and scrap portion 14, have between the first boundary line 120, the second product zone 13 and scrap portion 14 and there is the second boundary line 130.
The first product zone 12 comprises with the first boundary line 120 between scrap portion 14 the first boundary part 121 and the second boundary part 122 being connected.Described the first boundary part 121 comprises the first product limit 1201, the second product limit 1202 and the 5th product limit 1205, described the second product limit 1202 is parallel with the first product limit 1201, described the 5th vertical the first product limit 1201 and the second product limit 1202 of connecting, product limit 1205.Described the second boundary part 122 comprises three products limit 1203 and four-product limit 1204, described three products limit 1203 and four-product limit 1204 are located along the same line, in other words, the side of the side of first product zone 12 at 1203 places, three products limit and first product zone 12 at 1204 places, four-product limit is coplanar.Described the second boundary part 122 and the first boundary part 121 intersect, and are connected with described the second boundary line 130.Concrete, intersect on described the first product limit 1201 and three products limit 1203, and the first product limit 1201 and three products limit 1203 angle in the first product zone 12 is greater than 0 degree and is less than 180 degree.Intersect on described the second product limit 1202 and four-product limit 1204, and the second product limit 1202 and four-product limit 1204 angle in the first product zone 12 is greater than 0 degree and is less than 180 degree.In the present embodiment, the first product limit 1201 and three products limit 1203 intersect vertically, and the second product limit 1202 and four-product limit 1204 intersect vertically.
The second product zone 13 and the second boundary line 130 between scrap portion 14 comprise the 6th product limit 1301, seven product limit 1302 and the vertical eight product limit 1303 that be connected six product limit 1301 and seven product limit 1302 parallel with the 6th product limit 1301.Described the 6th product limit 1301 and three products limit 1203 intersect vertically, and described the 7th product limit 1302 and four-product limit 1204 intersect vertically.
The length of circuit board unit 11 equal the length of the first product zone 12, the length of the second product zone 13 add and.The length of described the first product zone 12 equals the length on the first product limit 1201, also equal the length on the second product limit 1202, also be equivalent to the distance between the 5th product limit 1205 and three products limit 1203 or four-product limit 1204, the width of described the first product zone 12 equals the length on the 5th product limit 1205, is also equivalent to the distance between the first product limit 1201 and the second product limit 1202.The length of the second product zone 13 equals the length on the 6th product limit 1301 or the 7th product limit 1302, and the width of the second product zone 13 equals the length on the 7th product limit 1302, is also equivalent to the spacing on the 6th product limit 1301 and the 7th product limit 1302.In the present embodiment, the length of circuit board unit 11 is more than or equal to the length of first product zone 12 of three times, and the length of the second product zone 13 is more than or equal to the length of the first product zone 12 of twice.Preferably, the length of circuit board unit 11 is more than or equal to the length of first product zone 12 of five times, and the length of the second product zone 13 is more than or equal to the length of first product zone 12 of four times.
Shape, the size of described the first product zone 12 and the second product zone 13 are not limit, only need the second boundary part 122 to be connected with the second boundary line 130, the first boundary part 121 and the second boundary part 122 intersect, and the angle in the first product zone 12 is greater than 0 degree and is less than 180 degree.That is to say, only need in the first boundary line 120, the first product limit 1201 and three products limit 1203 angle in the first product zone 12 is greater than 0 degree and is less than 180 degree, and the second product limit 1202 and four-product limit 1204 angle in the first product zone 12 is greater than 0 degree and is less than 180 degree.Preferably, the first product limit 1201 and three products limit 1203 angle in the first product zone 12 is more than or equal to 90 degree and is less than 180 degree, the second product limit 1202 and four-product limit 1204 angle in the first product zone 12 is more than or equal to 90 degree and is less than 180 degree, and described three products limit 1203, four-product limit 1204 are greater than 180 degree with the angle of described the second boundary line 130 in circuit board unit 11.
Second step, refer to Fig. 2, along the first product zone 12 and 121 pairs of described circuit substrates 10 of the first boundary part of scrap portion 14, carry out stamp for the first time, on circuit substrate 10, form the first stamp opening 15, part the first product zone 12 is separated with scrap portion 14 by described the first stamp opening 15.It will be understood by those skilled in the art that stamp refers to the process with the border of circuit board unit in punching mould stamping-out circuit substrate.
Described the first stamp opening 15 has the first stamp border 151, the second stamp border 152, the 3rd stamp border 153 and the 4th stamp border 154.Described the first stamp border 151 is near circuit board unit 11, and be total to border with the first boundary part 121, described the second stamp border 152 is parallel and relative with the first stamp border 151, described the 3rd stamp border 153, the 4th stamp border 154 connect described the first stamp border 151 and the second stamp border 152, thereby first to fourth stamp border 151 to 154 is enclosed, form described the first stamp opening 15.Concrete, described the first stamp border 151 comprise with the first product limit 1201 altogether limit the first stamp limit 1511, with the second product limit 1202 altogether limit the second stamp limit 1512 and with the 5th stamp limit 1515 on limit altogether, the 5th product limit 1205.The length on the first stamp limit 1511 is greater than the length on the first product limit 1201, and the part that the first product limit 1201 is longer than on the first stamp limit 1511 is to the direction extension near the second product zone 13.That is to say, align with the one end on the first product limit 1201 in 1511 one end, the first stamp limit, and the other end on the first stamp limit 1511 protrudes from the other end on the first product limit 1201.The length on the second stamp limit 1512 is greater than the length on the second product limit 1202, and the part that the second product limit 1202 is longer than on the second stamp limit 1512 is also to the direction extension near the second product zone 13.That is to say, align with the one end on the second product limit 1202 in 1512 one end, the second stamp limit, and the other end on the second stamp limit 1512 protrudes from the other end on the second product limit 1202.The length on the 5th stamp limit 1515 equals the length on the 5th product limit 1205.
Also can say, the first stamp opening 15 comprise with the first product limit 1201 altogether limit the first stamp groove 1501, with the second product limit 1202 altogether limit the second stamp groove 1502 and the 5th stamp groove 1505, the first stamp grooves 1501, the 5th stamp groove 1505 on limit are communicated with described the first stamp opening 15 of formation successively with the second stamp groove 1502 altogether with the 5th product limit 1205.The length of described the first stamp groove 1501 is greater than the length on the first product limit 1201, the first stamp groove 1501 protrudes from the intersection point on the first product limit 1201 and three products limit 1203, that is to say, the first stamp groove 1501 is longer than the part on the first product limit 1201 and is extended to the direction near the second product zone 13.The length of the second stamp groove 1502 is greater than the length on the second product limit 1202, the second stamp groove 1502 protrudes from the intersection point on the second product limit 1202 and four-product limit 1204, that is to say, the second stamp groove 1502 is longer than the part on the second product limit 1202 and also to the direction near the second product zone 13, is extended.
The length of remembering the first stamp limit 1511 is L1, and the length on the first product limit 1201 is L2, Δ L1=L1-L2, and Δ L1 is 1mm to 1.5mm.The length of remembering the second stamp limit 1512 is L3, and the length on the second product limit 1202 is L4, Δ L2=L3-L4, and Δ L2 is 1mm to 1.5mm.The width of remembering the first stamp opening 15 is B1, and B1 is 1mm to 1.5mm.The width of the first stamp opening 15 equals the spacing on the first stamp border 151 and the second stamp border 152, is also equivalent to the length on the 3rd stamp border 153, the 4th stamp border 154.
The 3rd step, refers to Fig. 3, on this part first product zone 12 separated with scrap portion 14, assembles electronic devices and components 19, and the spacing of the external form of described electronic devices and components 19 and the first boundary part 121 is less than 5mm.Described electronic devices and components 19 can be chip, resistance, electric capacity etc., and described electronic devices and components 19 can be assembled on this part first product zone 12 separated with scrap portion 14 by modes such as plug-in mounting, surface mount, chip packages.For example, these electronic devices and components 19 can be the integrated circuit (IC) chip being substantially rectangle, and by surface mounting technology, are assembled on the first product zone 12.
After electronic devices and components 19 are assembled on the first product zone 12, can be close, concordant or exceed the first boundary part 121 of the first product zone 12 in the border of electronic devices and components 19.That is to say, the border of electronic devices and components 19 can be within the first boundary line 120, outside or concordant with the first boundary line 120, only need the external form of electronic devices and components 19 and the spacing of the first boundary part 121 to be less than 5mm.In precision assembling, the spacing of the external form of electronic devices and components 19 and the first boundary part 121 may be less than or equal to 0.5mm.In the present embodiment, the two ends of electronic devices and components 19 are substantially concordant with the first product limit 1201, the second product limit 1202, and protrude from a little the first product limit 1201, the second product limit 1202.
The 4th step, see also Fig. 4 to Fig. 6, along the first product zone 12, with the second boundary part 122 of scrap portion 14 and carry out stamp for the second time along described the second product zone 13 with 130 pairs of described circuit substrates 10 of the second boundary line of scrap portion 14, on circuit substrate 10, form the second stamp opening 16.Described the first stamp opening 15 and the second stamp opening 16 are connected, and form the stamp edge of a knife 17.The stamp edge of a knife 17 that described circuit board unit 11 consists of described the first stamp opening 15 and the second stamp opening 16 is separated with scrap portion 14, thereby obtains the circuit board unit 11 of having assembled electronic devices and components 19, that is, and and circuit board product 11a as shown in Figure 6.It should be noted that, profile interference due to the first stamp opening 15 and the second stamp opening 16, structure for clearer expression the second stamp opening 16, in Fig. 4, schematically drawn the structure of the second stamp opening 16, and do not illustrate the structure of the first stamp opening 15, in Fig. 5, schematically drawn the structure of the stamp edge of a knife 17 that the first stamp opening 15 and the second stamp opening 16 form.
Described the second stamp opening 16 has the 5th stamp border 161, the 6th stamp border 162, the 7th stamp border 163 and the 8th stamp border 164.Described the 5th stamp border 161 is near circuit board unit 11, and be total to border with the second boundary part 122, the second boundary line 130, described the 6th stamp border 162 is parallel and relative with the 5th stamp border 161, described the 7th stamp border 163, the 8th stamp border 164 connect described the 5th stamp border 161 and the 6th stamp border 162, thereby the 5th to the 8th stamp border 161 to 164 is enclosed, form described the second stamp opening 16.Concrete, described the 5th stamp border 161 comprise with three products limit 1203 altogether limit the 3rd stamp limit 1613, with four-product limit 1204 altogether limit the 4th stamp limit 1614, with the 6th product limit 1301 altogether limit the 6th stamp limit 1616, with the 7th product limit 1302 altogether limit the 7th stamp limit 1617 and with the 8th stamp limit 1618 on limit altogether, the 8th product limit 1303.The length on the 3rd stamp limit 1613 is greater than the length on three products limit 1203, and the part that three products limit 1203 is longer than on the 3rd stamp limit 1613 is to the direction extension away from the second product zone 13.That is to say, align with the one end on three products limit 1203 in 1613 one end, the 3rd stamp limit, and the other end on the 3rd stamp limit 1613 protrudes from the other end on three products limit 1203.The length on the 4th stamp limit 1614 is greater than the length on four-product limit 1204, and the part that four-product limit 1204 is longer than on the 4th stamp limit 1614 is also to the direction extension away from the second product zone 13.That is to say, align with the one end on four-product limit 1204 in 1614 one end, the 4th stamp limit, and the other end on the 4th stamp limit 1614 protrudes from the other end on four-product limit 1204.The length on the 6th stamp limit 1616 equals the length on the 6th product limit 1301.The length on the 7th stamp limit 1617 equals the length on the 7th product limit 1302, and the length on the 8th stamp limit 1618 equals the length on the 8th product limit 1303.
Also can say, the second stamp opening 16 comprise with three products limit 1203 altogether limit the 3rd stamp groove 1603, with four-product limit 1204 altogether limit the 4th stamp groove 1604, with the 6th product limit 1301 altogether limit the 6th stamp groove 1606, with the 7th product limit 1302 altogether limit the 7th stamp groove 1607 and the 8th stamp groove 1608, the three stamp grooves 1603, the 6th stamp groove 1606, the 8th stamp groove 1608, the 7th stamp groove 1607 and the 4th stamp groove 1604 on limit are communicated with described the second stamp opening 16 of formation successively altogether with the 8th product limit 1303.The length of described the 3rd stamp groove 1603 is greater than the length on three products limit 1203, the 3rd stamp groove 1603 protrudes from the intersection point on the first product limit 1201 and three products limit 1203, that is to say, the 3rd stamp groove 1603 is longer than the part on three products limit 1203 and is extended to the direction away from the second product zone 13.The length of the 4th stamp groove 1604 is greater than the length on four-product limit 1204, the 4th stamp groove 1604 protrudes from the intersection point on the second product limit 1202 and four-product limit 1204, that is to say, the 4th stamp groove 1604 is longer than the part on four-product limit 1204 and also to the direction away from the second product zone 13, is extended.
The length of remembering the 3rd stamp limit 1613 is L5, and the length on three products limit 1203 is L6, Δ L3=L5-L6, and Δ L3≤B1, Δ L3 can be also 1mm to 1.5mm.The length of remembering the 4th stamp limit 1614 is L7, and the length on four-product limit 1204 is L8, Δ L4=L7-L8, and Δ L4≤B1, Δ L4 can be also 1mm to 1.5mm.The width of remembering the second stamp opening 16 is B2, B2≤Δ L1, and B2≤Δ L2, B2 can be also 1mm to 1.5mm.The width of the second stamp opening 16 equals the spacing on the 5th stamp border 161 and the 6th stamp border 162, is also equivalent to the length on the 7th stamp border 163, the 8th stamp border 164.
By size Selection as above, can be so that do not have scrappy waste material to drop after stamp for the second time, thus the trouble of having removed cleaning punching mould from.
In the technical program, by stamp for the first time, make partial circuit plate unit 11 separated with scrap portion 14, then on this partial circuit plate unit 11 separated with scrap portion 14, assemble electronic devices and components 19, then by stamp for the second time, make whole circuit board units 11 all separated with scrap portion 14, so, the external form of the electronic devices and components 19 of assembling can near the external form of circuit board unit 11 or can with the external form interference of circuit board unit 11, the external form of having avoided electronic devices and components 19 is difficult to the problem of separate circuit boards unit 11 during near the external form of circuit board unit 11 or with the external form interference of circuit board unit 11, and also substantially can not affect the product structure of electronic devices and components 19 during stamp for the second time, electronic devices and components 19 can not shake, shatter.Further, because stamp is for the first time for part the first product zone 12, stamp is for the second product zone 13 for the second time, and the length of the first product zone 12 is less than the length of the second product zone 13, the intensity of this part first product zone 12 separated with scrap portion 14 in circuit board unit 11 in the time of so can guaranteeing to assemble, make this part first product zone 12 with respect to whole circuit board unit 11 can there is not obvious flexural deformation, the distortion of destroying or force to yield, guaranteed the precision of assembling.
The manufacture method of the circuit board that the technical program the second embodiment provides, comprises step:
The first step, refers to Fig. 7, and circuit substrate 20 is provided, and described circuit substrate 20 comprises a plurality of circuit board units 21 and scrap portion 24 around being connected described a plurality of circuit board unit 21.Each circuit board unit 21 is all identical with the structure of the circuit board unit 11 of the first embodiment.Described a plurality of circuit board unit 21 is arranged side by side, in two adjacent circuit board units 21, the first product zone 22 of a circuit board unit 21 is near the second product zone 23 of another circuit board unit 21, and the second product zone 23 of this circuit board unit 21 is near the first product zone 22 of another circuit board unit 21.
Second step, refer to Fig. 8, along the first product zone 22 in each circuit board unit 21 and first of scrap portion 24 part of having a common boundary, described circuit substrate 20 is carried out to stamp for the first time, on circuit substrate 20, form a plurality of the first stamp openings 25, part first product zone 22 of each circuit board unit 21 is separated with scrap portion 24 by a first corresponding stamp opening 25.Described in each, the structure of the first stamp opening 25 is identical with the structure of the first stamp opening 15 in the first embodiment.
The 3rd step, refers to Fig. 9, on every part first product zone 22 separated with scrap portion 24, assembles electronic devices and components 29.
The 4th step, refer to Figure 10, along each first product zone 22 and second of scrap portion 24, have a common boundary partly and with the second boundary line of scrap portion 24, described circuit substrate 20 carried out to stamp for the second time along the second product zone 23 described in each, on circuit substrate 20, forming a plurality of the second stamp openings 26.Described in each, the structure of the second stamp opening 26 is identical with the structure of the second stamp opening 16 in the first embodiment.Described in each, the first stamp opening 25 and a second corresponding stamp opening 26 are connected, and form a plurality of stamp edges of a knife 27.Described in each, circuit board unit 21 is separated by a corresponding described stamp edge of a knife 27 and scrap portion 24, thereby obtains a plurality of circuit board units 21 of assembling electronic devices and components 29, that is, and and a plurality of circuit board product 11a as shown in Figure 6.
In the technical program, by a plurality of circuit board units 21 of arranging in circuit substrate 20, so, disposable can a plurality of circuit board units 21 of processing, thereby obtain a plurality of circuit board products, improved make efficiency.
The manufacture method of the circuit board that the technical program the 3rd embodiment provides, comprises step:
The first step, refers to Figure 11, and circuit substrate 30 is provided.The circuit substrate 10 of described circuit substrate 30 and the first embodiment is basic identical, also comprises circuit board unit 31 and scrap portion around 34 thereof, and its difference is the shape of the first product zone 32 in circuit board unit 31.Particularly, in circuit board unit 31, the second product zone 33 is identical with the second boundary line 130 in the first embodiment with the second boundary line 330 between scrap portion 34, the first product zone 32 is identical with the first boundary part 121 in the first embodiment with the first boundary part between scrap portion 34, and the second boundary part 322 is not identical with the second boundary part 122 in the first embodiment.The first product limit 3201 and three products limit 3203 angle in the first product zone 32 is greater than 90 degree and is less than 180 degree, is about 150 degree.The second product limit 3202 and four-product limit 3204 angle in the first product zone 32 is greater than 90 degree and is less than 180 degree, is about 150 degree.
Second step, refer to Figure 12, along the first product zone 32, have a common boundary and partly described circuit substrate 30 is carried out to stamp for the first time with first of scrap portion 34, form the first stamp opening 35 on circuit substrate 30, part the first product zone 32 is separated with scrap portion 34 by described the first stamp opening 35.The structure of described the first stamp opening 35 is identical with the structure of the first stamp opening 15 in the first embodiment.
The 3rd step, refers to Figure 13, on this part first product zone 32 separated with scrap portion 34, assembles electronic devices and components 39.
The 4th step, refer to Figure 13 and Figure 14, along the first product zone 32, with the second boundary part 322 of scrap portion 34 and carry out stamp for the second time along described the second product zone 33 with 330 pairs of described circuit substrates 30 of the second boundary line of scrap portion 34, on circuit substrate 30, form the second stamp opening 36.Described the first stamp opening 35 and the second stamp opening 36 are connected, and form the stamp edge of a knife 37.Described circuit board unit 31 is separated with scrap portion 34 by the described stamp edge of a knife 37, thereby obtains the circuit board unit 31 of having assembled electronic devices and components 39, the circuit board product being surrounded wherein by the stamp edge of a knife 37 in Figure 14.It should be noted that, profile interference due to the first stamp opening 35 and the second stamp opening 36, structure for clearer expression the second stamp opening 36, in Figure 13, schematically drawn the structure of the second stamp opening 36, and do not illustrate the first stamp opening 35, in Figure 14, schematically drawn the structure of the stamp edge of a knife 17 of the first stamp opening 35 and the second stamp opening 36 formations.
Due to different from the first embodiment of the second boundary part 322 in the present embodiment, therefore except the 3rd stamp groove 3603 of the second stamp opening 36, the 4th stamp groove 3604 are different from the 3rd stamp groove 1603, the 4th stamp groove 1604 in the first embodiment, the second stamp opening 16 in other structures of the second stamp opening 36 and the first embodiment is basic identical.The 3rd stamp groove 3603 and three products limit 3203 be border altogether, and the length of the 3rd stamp groove 3603 is greater than the length on three products limit 3203, and the 3rd stamp groove 3603 is longer than the part on three products limit 3203 and is extended to the direction near the first product zone 32.The 4th stamp groove 3604 and four-product limit 3204 be border altogether, and the length of the 4th stamp groove 3604 is greater than the length on four-product limit 3204, and the 4th stamp groove 3604 is longer than the part on four-product limit 3204 and is extended to the direction near the first product zone 32.
Also can say, with three products limit 3203 altogether the length on the 3rd stamp limit 3613 on limits be greater than the length on three products limit 3203, and the part that three products limit 3203 is longer than on the 3rd stamp limit 3613 is extended to the direction away from the second product zone 33.That is to say, align with the one end on three products limit 3203 in 3613 one end, the 3rd stamp limit, and the other end on the 3rd stamp limit 3613 protrudes from the other end on three products limit 3203.With four-product limit 3204 altogether the length on the 4th stamp limit 3614 on limits be greater than the length on four-product limit 3204, and the part that four-product limit 3204 is longer than on the 4th stamp limit 3614 is also extended to the direction away from the second product zone 33.That is to say, align with the one end on four-product limit 3204 in 3614 one end, the 4th stamp limit, and the other end on the 4th stamp limit 3614 protrudes from the other end on four-product limit 3204.In the second stamp opening 36, the length on all the other stamp limits is identical with the length on all the other product limits respectively.
See also Figure 15 to Figure 18, the manufacture method of the circuit board that the technical program the 4th embodiment provides and the circuit board manufacturing method that the first embodiment provides are basic identical, its difference is: in the circuit board unit 41 of the circuit substrate 40 that the first step provides, the second product limit 4202 and four-product limit 4204 angle in the first product zone 42 is greater than 90 degree and is less than 180 degree, be approximately 110 degree, as shown in figure 15; In the first stamp opening 45 forming on circuit substrate 40 in second step, the second stamp groove 4502 and the second product limit 4202 are total to limit and are longer than the second product limit 4202, the second stamp limit 4512 and the second product limit 4202 are total to limit and are longer than the second product limit 4202, and the part on the second product limit 4202 is longer than to the direction extension near the second product zone 43, as shown in figure 16 in the second stamp groove 4502, the second stamp limit 4512.So, refer to Figure 17 and Figure 18, after the 3rd step assembling electronic devices and components 49, the 4th step form the second stamp opening 46 being communicated with the first stamp opening 45, can be so that circuit board unit 41 be separated with scrap portion 44, thereby obtain the circuit board unit 41 of having assembled electronic devices and components 49, the circuit board product being surrounded wherein by the stamp edge of a knife 47 in Figure 18.It should be noted that, profile interference due to the first stamp opening 45 and the second stamp opening 46, structure for clearer expression the second stamp opening 46, in Figure 17, schematically drawn the structure of the second stamp opening 46, and do not illustrate the structure of the first stamp opening 45, in Figure 18, schematically drawn the structure of the stamp edge of a knife 47 that the first stamp opening 45 and the second stamp opening 46 form.
It will be appreciated by those skilled in the art that, the shape of circuit board unit is not limit, except the shape as shown in above each embodiment, it can also be other shape, such as the 5th product limit 1205 in the first embodiment, can also be the various shapes such as curve, broken line, the second boundary line 130 intersecting with the second boundary part 122 in the first embodiment can be also various other shapes, for example, be triangle, trapezoidal, L shaped etc.The shape of the circuit board unit in other embodiment also can have other various distortion.That is to say, in the technical program, only need the second boundary part to be connected with the second boundary line, the first have a common boundary part and the second interface divided crossingly, and the angle in the first product zone is greater than 0 degree and is less than 180 degree.That is to say, only need in the first boundary line, the first product limit and three products limit angle in the first product zone is greater than 0 degree and is less than 180 degree, and the second product limit and four-product limit angle in the first product zone is greater than 0 degree and is less than 180 degree.
In the technical program, by stamp for the first time make partial circuit plate unit and waste part from, then with waste part from this partial circuit plate unit on assemble electronic devices and components, again by stamp for the second time make whole circuit board units all with waste part from, so, the external form of the electronic devices and components of assembling can be near the external form of circuit board unit, concordant with the border of circuit board unit or can protrude from the border of circuit board unit, the external form of having avoided electronic devices and components is difficult to the problem of separate circuit boards unit during with the external form interference of circuit board unit near the external form of circuit board unit, and also substantially can not affect the product structure of electronic devices and components during stamp for the second time, and can not shake, the electronic devices and components that shatter, so can guarantee the yield of assembling.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (12)
1. a manufacture method for circuit board, comprises step:
Circuit substrate is provided, described circuit substrate comprises at least one circuit board unit and scrap portion around being connected described at least one circuit board unit, described circuit board unit comprises the first adjacent product zone and the second product zone, described the first product zone is used for assembling electronic devices and components, described the first product zone and scrap portion have the first boundary line, described the second product zone and scrap portion have the second boundary line, described the first boundary line comprises the first boundary part and the second boundary part, described the first interface is divided and is comprised the first product limit and the second product limit, described the second interface is divided and is comprised three products limit and four-product limit, described three products limit, four-product limit is all connected with described the second boundary line, intersect on described the first product limit and three products limit, and the first product limit and three products limit angle in the first product zone is greater than 0 degree and is less than 180 degree, intersect on described the second product limit and four-product limit, and the second product limit and four-product limit angle in the first product zone is greater than 0 degree and is less than 180 degree,
Along first of the first product zone and the scrap portion part of having a common boundary, described circuit substrate is carried out to stamp for the first time so that part the first product zone and waste part from;
This part and waste part from the first product zone on assemble electronic devices and components, the external form of described electronic devices and components and the first spacing of having a common boundary part are less than 5mm; And
Along have a common boundary part and described circuit substrate is carried out to stamp for the second time along the second boundary line of described the second product zone and scrap portion of second of the first product zone and scrap portion, so that circuit board unit and waste part from, thereby obtain the circuit board unit assembled electronic devices and components.
2. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, when being carried out for the first time to stamp, described circuit substrate forms the first stamp opening on circuit substrate, described part the first product zone is separated by described the first stamp opening and scrap portion, described the first stamp opening comprises the first stamp groove and the second stamp groove, described the first product limit and the first stamp groove be limit altogether, described the second product limit and the second stamp groove be limit altogether, the length of described the first stamp groove is greater than the length on the first product limit, and the first stamp flute length extends to close the second product zone direction in the part on the first product limit, the length of described the second stamp groove is greater than the length on the second product limit, and the second stamp flute length extends to the direction near the second product zone in the part on the second product limit, when being carried out for the second time to stamp, described circuit substrate forms the second stamp opening on circuit substrate, described the first stamp opening and the second stamp opening intersect the formation stamping-out edge of a knife, described circuit board unit is separated by the described stamping-out edge of a knife and scrap portion, described the second stamp opening comprises the 3rd stamp groove and the 4th stamp groove, described three products limit and the 3rd stamp groove be limit altogether, described four-product limit and the 4th stamp groove be limit altogether, the length of described the 3rd stamp groove is greater than the length on three products limit, and the 3rd stamp flute length extends to the direction away from the second product zone in the part on three products limit, the length of described the 4th stamp groove is greater than the length on four-product limit, and the 4th stamp flute length extends to the direction away from the second product zone in the part on four-product limit.
3. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, when being carried out for the first time to stamp, described circuit substrate forms the first stamp opening on circuit substrate, described part the first product zone is separated by described the first stamp opening and scrap portion, described the first stamp opening have the first stamp border and with first parallel the second relative stamp border, stamp border, described the first stamp border comprises with the first product the first stamp limit while being total to and the second stamp limit while being total to the second product, the length on described the first stamp limit is greater than the length on the first product limit, and the first stamp length of side is extended to the direction near the second product zone in the part on the first product limit, the length on described the second stamp limit is greater than the length on the second product limit, and the second stamp length of side is also extended to the direction near the second product zone in the part on the second product limit, when being carried out for the second time to stamp, described circuit substrate forms the second stamp opening on circuit substrate, described the first stamp opening and the second stamp opening intersect the formation stamping-out edge of a knife, described circuit board unit is separated by the described stamping-out edge of a knife and scrap portion, described the second stamp opening have the 5th stamp border and with the 5th parallel the 6th relative stamp border, stamp border, described the 5th stamp border comprises with three products the 3rd stamp limit while being total to and the 4th stamp limit while being total to four-product, the length on described the 3rd stamp limit is greater than the length on three products limit, and the 3rd stamp length of side is extended to the direction away from the second product zone in the part on three products limit, the length on described the 4th stamp limit is greater than the length on four-product limit, and the 4th stamp length of side is also extended to the direction away from the second product zone in the part on four-product limit.
4. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, described first has a common boundary partly also comprises the 5th product limit that connects the first product limit and the second product limit, described the 5th product limit is straight line, broken line or curve, along the first product limit, stamp is for the first time carried out to described circuit substrate in the second product limit and the 5th product limit, on circuit substrate, form the first stamp opening, the first stamp opening and first has a common boundary and is partly total to limit, and the two ends of the first stamp opening protrude from respectively in the first product limit and the second product limit, the first stamp opening is longer than the part on the first product limit and is extended to the direction near the second product zone, the first stamp opening is longer than the part on the second product limit and also to the direction near the second product zone, is extended, the first product limit, the second product limit and the 5th product limit around this part first product zone by the first stamp opening and scrap portion, be separated, when being carried out for the second time to stamp, described circuit substrate forms the second stamp opening on circuit substrate, described the first stamp opening and the second stamp opening intersect the formation stamping-out edge of a knife, described circuit board unit is separated by the described stamping-out edge of a knife and scrap portion, the two ends of described the second stamp opening protrude from respectively in three products limit and four-product limit, the second stamp opening is longer than the part on three products limit and is extended to the direction away from the second product zone, and the second stamp opening is longer than the part on four-product limit and also to the direction away from the second product zone, is extended.
5. the manufacture method of the circuit board as described in claim 2 to 4 any one, is characterized in that, the width of described the first stamp opening is 1mm to 1.5mm, and the width of described the second stamp opening is 1mm to 1.5mm.
6. the manufacture method of circuit board as claimed in claim 1, it is characterized in that, described the first product limit and three products limit angle in the first product zone is more than or equal to 90 degree and is less than 180 degree, described the second product limit and four-product limit angle in the first product zone is more than or equal to 90 degree and is less than 180 degree, all intersect with described the second boundary line on described three products limit, four-product limit, and described three products limit, four-product limit and the angle of described the second boundary line in circuit board unit are greater than 180 degree.
7. the manufacture method of circuit board as claimed in claim 6, it is characterized in that, described the first product limit and three products limit angle in the first product zone equals 90 degree, described the second product limit and four-product limit angle in the first product zone equals 90 degree, and described three products limit, four-product limit and the angle of described the second boundary line in circuit board unit are 270 degree.
8. the manufacture method of circuit board as claimed in claim 7, it is characterized in that, the length on the first stamp limit is L1, the length on the first product limit is L2, Δ L1=L1-L2, the length on the second stamp limit is L3, the length on the second product limit is L4, Δ L2=L3-L4, the width of the first stamp opening is B1, the length on the 3rd stamp limit is L5, the length on three products limit is L6, Δ L3=L5-L6, Δ L3≤B1, the length on the 4th stamp limit is L7, the length on four-product limit is L8, Δ L4=L7-L8, Δ L4≤B1, the width of the second stamp opening is B2, B2≤Δ L1, B2≤Δ L2.
9. the manufacture method of circuit board as claimed in claim 8, is characterized in that, Δ L1=Δ L2, and Δ L1 is 1mm to 1.5mm, Δ L3=Δ L4, Δ L3 is 1mm to 1.5mm, and B1 is 1mm to 1.5mm, and B2 is 1mm to 1.5mm.
10. the manufacture method of circuit board as claimed in claim 6, it is characterized in that, described first has a common boundary partly also comprises the 5th product limit that connects the first product limit and the second product limit, described the second boundary line comprises the 6th product limit, the 7th product limit and connects the 6th product limit and the 8th product limit on the 7th product limit, intersect on described the 6th product limit and three products limit, intersect on described the 7th product limit and four-product limit, described the 5th product limit is straight line, broken line or curve, and described the 7th product limit is straight line, broken line or curve.
The manufacture method of 11. circuit boards as claimed in claim 1, is characterized in that, the length of described circuit board unit is more than or equal to the length of first product zone of 5 times.
The manufacture method of 12. circuit boards as claimed in claim 1, it is characterized in that, described circuit substrate comprises a plurality of circuit board units and a scrap portion around being connected each circuit board unit, described a plurality of circuit board unit is arranged side by side, in two adjacent circuit board units, the first product zone of a circuit board unit is near the second product zone of another circuit board unit, and the second product zone of this circuit board unit is near the first product zone of this another circuit board unit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210238417.2A CN103547082B (en) | 2012-07-11 | 2012-07-11 | The preparation method of circuit board |
| TW101125693A TW201404265A (en) | 2012-07-11 | 2012-07-17 | Method for manufacturing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210238417.2A CN103547082B (en) | 2012-07-11 | 2012-07-11 | The preparation method of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103547082A true CN103547082A (en) | 2014-01-29 |
| CN103547082B CN103547082B (en) | 2016-05-04 |
Family
ID=49970017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210238417.2A Expired - Fee Related CN103547082B (en) | 2012-07-11 | 2012-07-11 | The preparation method of circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103547082B (en) |
| TW (1) | TW201404265A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110381667A (en) * | 2019-07-04 | 2019-10-25 | 山本光电(龙川)有限公司 | A kind of FPC production method and structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04180243A (en) * | 1990-11-14 | 1992-06-26 | Ibiden Co Ltd | Film carrier |
| TW200531129A (en) * | 2004-03-11 | 2005-09-16 | Asia Tech Image Inc | Sensing substrate of image sensor and its processing method |
| CN100392806C (en) * | 2004-11-24 | 2008-06-04 | 精工爱普生株式会社 | Electronic part and method for manufacturing the same |
-
2012
- 2012-07-11 CN CN201210238417.2A patent/CN103547082B/en not_active Expired - Fee Related
- 2012-07-17 TW TW101125693A patent/TW201404265A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04180243A (en) * | 1990-11-14 | 1992-06-26 | Ibiden Co Ltd | Film carrier |
| TW200531129A (en) * | 2004-03-11 | 2005-09-16 | Asia Tech Image Inc | Sensing substrate of image sensor and its processing method |
| CN100392806C (en) * | 2004-11-24 | 2008-06-04 | 精工爱普生株式会社 | Electronic part and method for manufacturing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110381667A (en) * | 2019-07-04 | 2019-10-25 | 山本光电(龙川)有限公司 | A kind of FPC production method and structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201404265A (en) | 2014-01-16 |
| CN103547082B (en) | 2016-05-04 |
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