200530434 九、發明說明： 【發明所屬之技術領域】 本發明，係有關於使用捲筒狀基材連續製造印刷配線 板^之 步驟、即連續銅電艘步驟的鍛銅方法。 【先前技術】 於具有兩面或多層構造的印刷配線基板的製造中，需 要σ層間的導通，於鑽孔加工後，在製品正面施以銅電鐘 處理。習知錢銅雖是使用長方體的分批加工處理，不過基 :成本而改採連續處理。相較於分批加工處理，連續處 勺Μ層厚度分布佳’品質亦優越。然、而’在如同連續鐘 鋼的平行電極情形Τ，電流會集中於製品端部，而發生端 部的鍍層厚度較中央部為厚的問題。 %匕狀悲的捲筒，則會累積端部的鍍層厚度增加 2。t捲繞㈣下端部會鼓起，若將其倒捲，則製品端 :曰因…J塑性變形而發生波狀起伏。捲筒端部呈波狀 起伏的材料會於次-步驟的曝光、顯影中發生解析度的惡 化或製品曾曲所造成的位置精度問題 圖安卜主π π a h 符別疋在形成微細 Η木h形下，須避免捲筒端部的波狀起伏。 為解決此種問題，於遠墻供 連續鑛時使用遮蔽板。於此，@ 知使用的遮蔽板，不管遮蔽陽極 、此白 錄槽的全長設置。這是習知遮蔽板的主要二：均是擴及 中央部的鐘層厚度均-化’至於捲筒端部，因41 吏Γ 保證範圍^故鑛層厚度較捲筒中央部薄亦可:、=: 200530434 不施以鍍層亦可，基於此種想法而被忽略。的確，若使用 習知遮蔽板，因端部的鍍層厚度較甲央部薄，當捲筒端部 在捲繞狀態下仍不致於塑性變形，故能達到期望的目的。 然而’隨著鑛層厚度因遮蔽效果而變薄，鍍層密合力 亦有降低的傾向，鏟銅電解槽内的鍍層會因製品的搬送或 液體供應的撞擊而剝離。由於在使用習知遮蔽板情形下， 捲筒端部的鍍層厚度較薄，故會從此部分發生剝離、脫落。 亦有脫落的銅箔浮游於鍍液體内，一部分再附著於掣。的 情形發生。銅具有導電性，再附著的銅箱上當然會產Z銅 的析出反應，而發生異常電鍍。由於異常電鍍部=的鋼厚 較其他部分為厚，故於次一步驟的圖案化的蝕刻會發生= 門差亦即’異常析出部分因銅殘留而發生圖案不声、皮 成製品良率惡化。 在使用習知遮蔽板情形下，並無防止鍍層自 ㈡3^邵剝離 勺方法’異常電鍍對策僅止於除去剝離、脫落的鋼荡的方 法。此方法考慮鍍液的過濾。不過，由於銅箔的制離、、 落發生於製品附近，故無法藉由過濾完全防止 J V曰丹附著 於製品。因此，即便採用過濾方法，仍因銅殘留 白 J圖案不 艮而無法充分提高製品良率。 專利文獻1日本特開2002 — 155 3 95號公報 專利文獻2日本特開2002 — 371399號公報 專利文獻3日本特開平1 1 — 68293號公報 專利文獻4曰本特開平5 — 44084號公報 專利文獻5日本特開平9一 256194號公報 200530434 專利文獻6 專利文獻7 專利文獻8 專利文獻9 專利文獻10 專利文獻11 專利文獻12 專利文獻13 專利文獻14 曰本特開2002— 54000號公報 曰本特開2003 — 25 3 496號公報 曰本特開平10 — 60686號公報 θ本特開平1 1 — 106989號公報 日本特開平8 — 283984號公報 曰本特開平10 — 140392號公報 曰本特開平11 一 124700號公報 a本特開2000 — 195 823號公報 曰本特開2003 - 1292 80號公報 容 内 明發 [ 由於如IT述’習知遮蔽板的製品端部的鍍層厚度變 薄，故銅鍍層會因密合力降低而剝離，並因發生銅箔而污 染鍍槽，其會造成製品良率惡化的問題。本發明係供解決 此種習知遮蔽板所造成問題而為者。 因此’本發明之連續鍍鋼方法，係於使用捲筒狀基材 連續製造印刷配線基板之際，在銅鍍步驟中，藉沿搬送方 向分割成至少2個遮蔽板來遮蔽捲筒端面。 方；此，較佳係以經分割的上述遮蔽板在捲筒搬送方向 的長度合計為鍍槽有效長度的2〇〜8〇%，又，上述遮蔽板所 遮蔽的兔度自製的端部算起為2〜i ，進而，此遮蔽板 與製品的間隙以1〜10mm較佳。 依本發明，可於印刷配線基板製程的連續鍍銅中，在 無製品端面鼓起壯能I4 屹狀怨下加工。因此，可進行長形物的捲繞， 200530434 提高連續鐘步驟的生產效率。 又由於可在亦無鍍層脫落狀態下加工，不會發生鑛浴 中的導電性異物混入，故可防止異物附著於銅箔所造成的 異常析出，有助於提高良率。 本發明雖以基板端面的厚度控制為主，不過，藉由本 發明的遮蔽板的應用’亦容易進行單面鍍或兩面不同厚之 電鍍。 【實施方式】 第1圖係本發明之銅鍍槽内的遮蔽板配置的示意圖。 於弟1圖中’ 1係作為捲茼狀基材的被錄材的陰極，2係除 液輥，3係遮蔽板，4係陽極。 如第1圖所示，遮蔽板3並未擴及鍍槽的全長設置， 而疋成分割的各遮蔽板3分散的狀態配置。當然，亦可使 各迫蔽板3獨立而個別設置。於本實施例中，雖然避開陽 極4配置遮蔽板3 ’不過，當然可設置遮蔽板3於陽極4的 位置下部，可根據電鍍條件或製品之規格來任意選擇。 進而’藉由連結端部排成一列的遮蔽板3使其一體化， 則谷易進行遮蔽間隔的調整。檢查使用此遮蔽板3的情形 及撤去遮蔽板3情形的電鍍附著狀況，結果，在不使用此 遮蔽板3情形下，隨著捲繞進行，端部鼓起，另一方面， 在使用此遮蔽板3情形下，無端部鼓起，捲繞正常。若如 此使用遮蔽板3，對製品端部的電鍍亦正常，確認不會發生 銅箔的剝離、脫落。 200530434 部产Π用！知方法擴及鍍槽全長的遮蔽3遮蔽製品端 月/ s然根據遮蔽板3或電極配置其態樣各式各樣，200530434 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a step of continuously manufacturing a printed wiring board using a roll-shaped substrate, that is, a copper forging method for a continuous copper electric boat. [Prior art] In the manufacture of a printed wiring board having a two-sided or multi-layered structure, conduction between σ layers is required. After the drilling process, a copper electric clock is applied to the front surface of the product. Although it is known that copper and copper are processed in batches using rectangular parallelepipeds, they are continuously processed based on cost. Compared with batch processing, the thickness of the continuous M layer is better, and the quality is superior. However, in the case of a parallel electrode T like a continuous bell steel, the current is concentrated at the end of the product, and a problem occurs that the thickness of the plating at the end is thicker than that of the center. % Dagger-shaped reel, the cumulative coating thickness at the end will increase by 2. The lower end of t-roller will bulge. If it is rolled up, the product end will be undulated due to plastic deformation of J. The material with undulations at the end of the roll will be subjected to sub-step exposure, degradation of resolution during resolution, or position accuracy problems caused by the product's curvature. Figure Amb π π ah In the h shape, undulations at the end of the roll must be avoided. To solve this problem, a shield plate is used when the far wall is used for continuous mining. Here, @ know the shielding board used, regardless of the shielding anode, the full length of this white recording slot is set. This is the main two of the conventional shielding plate: the bell layer thickness of the central part is equalized-as for the end of the reel, because of the guarantee range of 41, the thickness of the ore layer is thinner than the central part of the reel: , =: 200530434 It is not necessary to apply plating, and it is ignored based on this idea. Indeed, if a conventional shielding plate is used, the thickness of the plating at the end is thinner than that of the central portion, and when the end of the roll is still wound, it will not be plastically deformed, so it can achieve the desired purpose. However, as the thickness of the ore layer becomes thinner due to the shielding effect, the adhesion of the plating layer also tends to decrease, and the plating layer in the copper shovel electrolytic bath will peel off due to the transportation of the product or the impact of the liquid supply. When the conventional shielding plate is used, the thickness of the plating layer at the end of the roll is relatively thin, so peeling and peeling may occur from this portion. There are also peeled copper foils floating in the plating liquid, and some of them are attached to the switch. The situation happened. Copper is electrically conductive, and of course, copper deposits on the reattached copper box will produce a precipitation reaction of Z copper and abnormal plating will occur. Because the thickness of the abnormal plated part is thicker than the other parts, the patterned etching in the next step will occur = the gate difference, that is, the 'abnormal precipitation' part has a silent pattern due to copper residue, and the yield of leather products deteriorates . In the case of using a conventional shielding plate, there is no method to prevent the plating from peeling off. The method of abnormal plating is only limited to the method of removing peeling and falling off steel. This method considers filtration of the plating solution. However, since the copper foil is separated and dropped in the vicinity of the product, it is impossible to completely prevent J.V. Dan from adhering to the product by filtration. Therefore, even if the filtration method is used, the yield of the product cannot be sufficiently improved due to the copper residual white J pattern. Patent Literature 1 Japanese Patent Laid-Open No. 2002-155 3 95 Patent Literature 2 Japanese Patent Laid-Open No. 2002-371399 Patent Literature 3 Japanese Laid-Open Patent No. 1 1-68293 Patent Literature 4 Japanese Patent Laid-Open No. 5-44084 Patent Literature 5 Japanese Patent Laid-Open Publication No. 9-256194 200530434 Patent Literature 6 Patent Literature 7 Patent Literature 8 Patent Literature 9 Patent Literature 10 Patent Literature 11 Patent Literature 12 Patent Literature 13 Patent Literature 14 Japanese Patent Laid-Open No. 2002-54000 2003 — 25 3 496 Japanese Patent Publication No. 10-60686 Japanese Patent Application Publication No. 1 1 — 106989 Japanese Patent Application Publication No. 8 — 283984 Japanese Patent Application Publication No. 10 — 140392 Japanese Patent Application Publication No. 11-124700 JP-A No. 2000-195 823 JP No. 2003- 1292 No. 80 Yonai Mingfa [Since the thickness of the plating at the end of the product of the conventional shielding plate is reduced as described in IT, the copper plating will Peeling due to a decrease in adhesion and contamination of the plating tank due to the occurrence of copper foil may cause a problem in that the product yield is deteriorated. The present invention is intended to solve the problems caused by such conventional shielding plates. Therefore, the continuous steel plating method of the present invention is used to continuously manufacture a printed wiring board using a roll-shaped substrate. In the copper plating step, the end surface of the roll is covered by dividing it into at least two shielding plates along the conveyance direction. Here, it is preferred that the total length of the divided shielding plate in the roll conveying direction be 20 to 80% of the effective length of the plating tank, and that the end of the rabbit covered by the shielding plate is self-calculated. From 2 to i, the gap between the shielding plate and the product is preferably 1 to 10 mm. According to the present invention, it can be processed in the continuous copper plating process of the printed wiring board manufacturing process without the product end surface bulging strong I4. Therefore, long objects can be wound, and 200530434 improves the productivity of continuous clock steps. In addition, it can be processed with no coating falling off, and no conductive foreign matter is mixed in the mineral bath. This prevents abnormal precipitation caused by foreign matter adhering to the copper foil and helps improve yield. Although the present invention mainly controls the thickness of the end face of the substrate, it is also easy to perform single-sided plating or electroplating with different thicknesses on both sides by the application of the shielding plate of the present invention. [Embodiment] FIG. 1 is a schematic diagram of a shielding plate arrangement in a copper plating tank of the present invention. In Figure 1, '1' is the cathode of the recording material as the roll-shaped substrate, 2 is the liquid removing roller, 3 is the shielding plate, and 4 is the anode. As shown in FIG. 1, the shielding plate 3 is not provided over the entire length of the plating tank, but is arranged in a state where the divided shielding plates 3 are dispersed. Of course, each forcing plate 3 may be provided independently and individually. In this embodiment, although the shielding plate 3 'is disposed away from the anode 4, it is of course possible to arrange the shielding plate 3 below the position of the anode 4, and it can be arbitrarily selected according to plating conditions or product specifications. Furthermore, by integrating the shielding plates 3 in which the end portions are aligned in a row, the valley interval can be adjusted easily. When the shielding plate 3 was used and the plating adhesion was removed when the shielding plate 3 was removed, as a result, the end bulged as the winding progressed without using the shielding plate 3, and on the other hand, the shielding In the case of the plate 3, there is no end bulging, and the winding is normal. If the shield plate 3 is used as described above, the plating of the product end portion is also normal, and it is confirmed that the copper foil does not peel off or fall off. 200530434 Ministry of production! Knowing how to extend the shielding of the entire length of the plating tank 3 shielding product end month / s of course according to the shielding plate 3 or electrode configuration in various ways,
不過，鑛層厚度自遮蔽部分逐漸變薄，端部的鑛層厚戶大 致為零，亦即成無析出狀態。 X 在元王不使用遮蔽板情形下，由於電流资 度集中於端部’故製品端部變厚。雖錢亦依電解條^ 電極配置而疋，不㉟，相較於中央部的鑛層厚度，1變成 約、3倍的鑛層厚度。本發明係著眼於此二種狀態，研究藉 由併用_者’能否到達製品端部具有均—的鍍層厚度。 晉捭二即，如弟1 特徵在於：沿捲筒搬送方向分割配 思*反3 ’此經分割配置的遮蔽板3在捲筒搬送方向的長 Γο合:為鑛槽有效長度的2〇〜8〇%，亦即，遮蔽部分為 精由不分割遮蔽板，使其長度較電解槽的長度短，亦 即使遮敝率成為20〜8〇% ’可達成均一化鍍層厚度的目的。 然而’於此方法中，遮蔽、非遮蔽部分的邊界顯著，而形 ^鑛膜不連續狀態。相對於此，藉由分割配置遮蔽板3,反 覆形成遮蔽與非遮蔽，可使製品寬度方向的鑛層厚度分 更平滑。 又，若微細分割配置遮蔽板3，即有以下所述更大優 點。製品寬度方向的鍍層厚度分布亦因電鍍條# (電流密 度、錢層厚度）而異。然而，製品的態樣各式各樣，即使 =連續錢中，仍通常不會流通僅單-條件的製品。由於電 流密度、鍍層厚度等態樣因製品而異，故鍍層厚度亦不同， 200530434 各製品的遮蔽方法不同。因+ a 、非遮蔽的比例固 品的更換。亦即， 的變更等，進行分 能對應製品的電錢 U此在遮蔽 疋於某一疋值形下’無法對應此等紫 藉由分割配置遮蔽板3，可針對電命條件 割配置的遮蔽板3的局部除去或追加 條件的變更。 本發明將遮蔽率定為20〜8〇0/〇。 其原因在於，於遮蔽率 低於20%情形下，由於製品端部 手 ^錢附著變大，故端部 的鍵層厚度車父中央為厚，於盤〇姐 I 口口掩繞時會損傷製品端部。 '另-方面’若遮蔽率㈣8G%，製品端部的鍍層厚度即變 溥，造成鍵層的剝離、脫落。本發明雖然分割配置遮蔽板3 來使用’不過’重要的是分割配置的遮_ 3的合計遮蔽 率定為此值’ $蔽效果不會因分割個數而改變。 有關分割配置的各遮蔽板3的構造，於本發明中，以 遮蔽板3遮蔽的寬度自製品端面算起為2〜。醜，遮蔽板3 與製品的間隙為l〜10mm。其依據以下理由。 製Π口的寬度方向的遮蔽寬度雖因陽極與製品的位置關 係而異，不過由於在連續錢中，相較於垂直分批式，陽極 與陰極間的距離較小，㈣生電流集中於端部者大致係自 製品端部算起12mm的部分。亦即，自製品兩端的12麵的 部分起，鍍層厚度變厚，於端部最大。相較於12mm，於中 央側鍵層厚度更均—。因此，最需要遮蔽者係製品端部至 此部分為止的部分。另一方面，遮蔽寬度# 0mm，即無法 控制製品端部的艘層厚度。即使考慮製品的通過，遮蔽寬 度為〇mm仍有損傷製品端面之虞。因此，需要至少2mm的 200530434 遮蔽。 於連續鑛中，遮蔽板3與製品的間隙在imm 於發生製品張力變動所造成的製品位置變動，故益法避免 遮敝板3舆製品接觸。目前技術無法提供“以下的製品 通過。又，在遮蔽板3盥製口 & & L + 口的間隙太寬情形下，容易發 生來自陽極的電流的環燒因卜 、-衣、免因此，利用遮蔽板3的遮蔽效 專“卩使進行遮蔽寬度等的調整，仍無法控制錢層厚 度分布。因此，將其界限值設為1〇mm。 本發明雖然最適合採用於印刷配線基板製程的連續銅 鍍，不過，當然亦適用於銅鍍以外的連續鍍。又，亦可適 用於印刷配線基板的製造以外的連續鍍。 【圖式簡單說明】 第1圖係本發明之鍍槽中遮蔽板的配置的示意圖。 【主要元件符號說明】However, the thickness of the ore layer gradually becomes thinner from the shielding part, and the thickness of the ore layer at the end is almost zero, which means that there is no precipitation state. X In the case that Yuan Wang does not use a shielding plate, the end portion of the product becomes thicker because the current qualification is concentrated on the end portion '. Although money is also dependent on the configuration of the electrode ^ electrode, compared to the thickness of the ore layer in the center, 1 becomes about 3 times the thickness of the ore layer. The present invention focuses on these two states, and studies whether it is possible to achieve a uniform coating thickness at the end of the product by a combination of users. Jin Yier, namely, Rudi 1 is characterized by splitting along the reel conveying direction * reverse 3 'The length of the divided shielding plate 3 in the reel conveying direction is Γο: It is 20% of the effective length of the mine trough. 80%, that is, the shielding part is finely divided and the shielding plate is made shorter than the length of the electrolytic cell, and even if the shading ratio becomes 20 to 80%, the purpose of uniformizing the thickness of the coating can be achieved. However, in this method, the boundary of the shielded and non-shielded parts is significant, and the shape of the mineral film is discontinuous. In contrast, the shielding plate 3 is divided and arranged to form shielding and non-shielding repeatedly, which can make the thickness of the mineral layer in the width direction of the product smoother. Further, if the shielding plate 3 is finely divided and arranged, there are further advantages as described below. The thickness distribution of the plating layer in the width direction of the product also varies depending on the plating strip # (current density, money layer thickness). However, the products are in various forms, and even if they are continuous money, the products with single-conditions are usually not circulating. Since the current density and coating thickness vary from product to product, the thickness of the coating is also different. The shielding method of each product is different from 200530434. Replacement of solid products due to + a, non-shielded ratio. That is, changes such as change, the electric money U that can be divided into corresponding products is masked in a certain threshold value. 'Can't correspond to these purple. By dividing the shielding plate 3, the shielding plate can be cut for the electrical condition. Partial removal or addition of 3 conditions. In the present invention, the masking rate is set to 20 ~ 800/0. The reason is that in the case where the masking rate is less than 20%, the thickness of the key layer at the end is thicker because the hand attachment of the end of the product becomes larger, and the center of the driver is thicker, which will be damaged when it is wrapped around the mouth Product end. 'Other-aspect' If the masking rate is ㈣8G%, the thickness of the plating layer at the end of the product will become 溥, resulting in peeling and peeling of the key layer. In the present invention, although the masking plate 3 is divided and used, 'but' it is important that the total masking rate of the masked_3 of the divided arrangement is set to this value. The masking effect does not change with the number of divisions. Regarding the structure of each shielding plate 3 arranged in a divided manner, in the present invention, the width shielded by the shielding plate 3 is 2 to 2 from the end surface of the product. Ugly, the gap between the shielding plate 3 and the product is 1 to 10 mm. This is based on the following reasons. Although the shielding width in the width direction of the nozzle is different due to the positional relationship between the anode and the product, but in continuous money, compared to the vertical batch type, the distance between the anode and the cathode is smaller, and the generated current is concentrated at the end. The part is roughly 12mm from the end of the product. That is, the thickness of the plating layer becomes thicker from the part of the 12 faces at both ends of the product, and is largest at the ends. Compared with 12mm, the thickness of the key layer on the central side is more uniform. Therefore, the person who needs the cover most is the part up to the end of the product. On the other hand, the shielding width # 0mm, that is, the thickness of the ship layer at the end of the product cannot be controlled. Even if the passage of the product is considered, the shielding width of 0 mm may damage the end surface of the product. Therefore, at least 2mm of 200530434 shielding is required. In a continuous mine, the gap between the shielding plate 3 and the product is imm at the position of the product caused by the change in the tension of the product. Therefore, it is beneficial to avoid the contact of the shielding plate 3 with the product. The current technology cannot provide "the following products pass. In addition, in the case where the gap between the toilet opening & & L + opening of the shielding plate 3 is too wide, it is easy to cause the simmering of the current from the anode. By using the shielding effect of the shielding plate 3, "the adjustment of the shielding width and the like is made, and the thickness distribution of the money layer cannot be controlled. Therefore, the limit value is set to 10 mm. Although the present invention is most suitable for continuous copper plating in a printed wiring board process, it is of course applicable to continuous plating other than copper plating. It can also be applied to continuous plating other than the manufacture of printed wiring boards. [Brief description of the drawings] FIG. 1 is a schematic diagram of the configuration of the shielding plate in the plating tank of the present invention. [Description of main component symbols]
陰極 除液輥 遮蔽板 陽極 11Cathode liquid removal roller shielding plate anode 11