TW200530430A - Conductive electrolessly plated powder and method for making the same - Google Patents

Conductive electrolessly plated powder and method for making the same Download PDF

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TW200530430A
TW200530430A TW93106631A TW93106631A TW200530430A TW 200530430 A TW200530430 A TW 200530430A TW 93106631 A TW93106631 A TW 93106631A TW 93106631 A TW93106631 A TW 93106631A TW 200530430 A TW200530430 A TW 200530430A
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Taiwan
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powder
nickel
film
core material
aforementioned
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TW93106631A
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Chinese (zh)
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TWI352751B (en
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Masaaki Oyamada
Shinji Abe
Akihiro Kawazoe
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Nippon Chemical Ind
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Abstract

Provided is one type of conductive electrolessly plated powder of plated film with capability of improving heat tolerance and method for making the same. A conductive electroless plated powder of this invention includes a nickel film formed by an electroless plating process on the surface of each core particle. Its characteristic lies in that: crystal grain boundaries in the nickel film mentioned above are primarily oriented in the direction of the thickness of the nickel film. An electroless gold plating film may be deposited on the nickel film as the top layer. The nickel film is formed by electroless plating using glycine or ethylenediamine as a complexing agent.

Description

200530430 五 方 皮 貴 層 之 該 原 話 優 前 變 穩 發明說明(1) 發明所屬之技術領域 本發明係關於一種導電“ 法;更加詳細地說,關於一蘇電解鍍層用粉體及其製造 膜之導電性無電解鍍 ,高耐熱性之鍍層用 寸刀肢及其製造方法。 先前技術】 本申請人係首先提議:在人士 金屬捕捉性表面處理劑而1 f樹脂之芯材粉體來使用 液中而進行無電解鍍層處理之二金屬離子後,投入至鍍 心材粉體來進行無電解錄層会,來作為在合成樹脂 方法係稱為所謂建浴方式I方法(參考專利文獻1 )。 劑、錯合劑、緩衝劑、穩定層f要if金屬鹽、還 ’則具有所謂提高鍍層用皮以寺二該方法的 解,法之;;心本考申二: 得嚴:層要求之各種性能係遂曰地 定性。4年末…合性以外,也要求在高溫之 專利文獻1】 曰本特開昭6 1 — 64882號公報 專利文獻2】 曰本特開平1 — 242782號公報 【發明内容】200530430 The original words of the five-square leather precious layer are stable before the invention. Description of the invention (1) The technical field to which the invention belongs The present invention relates to a conductive method; more specifically, a powder for electrolytic coating of a Soviet and its manufacturing film Conductive electroless plating, high-heat-resistant plating blades for high-heat-resistant coatings, and a method for manufacturing the same. Prior art] The applicant first proposed: use a core metal powder of 1 f resin for personal metal capture surface treatment agents. The second metal ion that is subjected to the electroless plating treatment in the liquid is charged into the core material powder to perform the electroless recording session, and is referred to as a so-called bath-building method I in the synthetic resin method (refer to Patent Document 1). Agents, complexing agents, buffering agents, stabilizing layers f require metal salts, and also have the so-called solution for improving the coating for coatings, the method of the method; the heart of this application: the stringent: various layer requirements The performance is qualitatively determined. At the end of 4 years ... In addition to the consistency, it is also required to be at high temperature. Patent Document 1] Japanese Patent Publication No. 6 1-64882 Patent Document 2] Japanese Patent Publication No. 1-242782 [ Ming content]

200530430 五、發明說明(2) 因此,本發明之目的係提供一種具有提高耐熱性之鍍 層用皮膜之導電性無電解鍍層用粉體及其製造方法。 本發明人們係全心地進行檢討,結果,認為··可以藉 由形成前述專利文獻1所記載之锻層用皮膜之構造、也就 是不同於微細之金屬粒子至現濃密且實質之連續皮膜構造 之不同構造之皮膜而達成述目的。 本發明係藉由提供一種導電性無電解鍍層用粉體,在 芯材粒子之表面上藉由無電解鍍層法而形成鎳皮膜,其特 徵在於:前述鎳皮膜中之粒界係以該鎳皮膜為主而定向於 厚度方向;以便於達成前述目的。 _ 此外’本發明係藉由提供一種導電性無電解鍍層用粉 體=製造方法,其特徵在於:在藉由具有貴金屬離子之^ ,能或表面處理而在賦予貴金屬離子之捕捉能之前述芯材 粉體土捕捉貴金屬離子後,還原這個,使得前述貴金屬載 2於七述心材粉體之表面,接著,將该芯材粉體分散及混 合於包含鎳離子、還原劑及由胺化合物所構成之錯合劑之 初期薄膜形成液,還原鎳離子,在該芯材粉體之表面,形 成錄之初期薄膜,然後,在包含形成該初期薄膜之該芯材 粉體及該錯合劑之水性懸濁體,個別且同時地將含有同種 於該錯合劑之同種錯合劑之含鎳離子液及含還原劑液之2 種液體予以添加,進行無電解鍍層反應;來作為前述導電 性無電解艘層用粉體之理想製造方法’以便於達成前述目 的0 7082-6219-PF(N2);Ahddub.ptd 第6頁200530430 V. Description of the invention (2) Therefore, the object of the present invention is to provide a powder for conductive electroless plating having a coating for improving heat resistance and a method for producing the same. The present inventors conducted a thorough review, and as a result, they thought that the structure of the film for forging described in Patent Document 1 can be formed, that is, a structure different from the fine metal particles to a dense and substantial continuous film structure. Films with different structures achieve the stated purpose. The present invention is to provide a powder for conductive electroless plating, and to form a nickel film on the surface of a core material particle by an electroless plating method, characterized in that the grain boundary in the nickel film is based on the nickel film. Mainly oriented in the thickness direction; in order to achieve the aforementioned purpose. _ In addition, the present invention is to provide a powder for conductive electroless plating layer = manufacturing method, which is characterized in that: the aforementioned core which imparts the capturing energy of precious metal ions by ^, energy or surface treatment with precious metal ions, The material powder soil captures precious metal ions, and then reduces this so that the aforementioned precious metal is carried on the surface of the seventh heartwood powder. Then, the core material powder is dispersed and mixed with nickel ions, a reducing agent, and an amine compound. The initial thin film forming solution of the complexing agent reduces nickel ions, and forms an initializing film on the surface of the core material powder, and then, the aqueous suspension containing the core material powder and the complexing agent forming the initial film is suspended in water. Body, separately and simultaneously adding two kinds of liquids containing nickel ion liquid and reducing agent liquid containing the same type of complexing agent to the complexing agent to perform electroless plating reaction; as the aforementioned conductive electroless vessel layer The ideal manufacturing method of powder 'in order to achieve the aforementioned purpose 0 7082-6219-PF (N2); Ahddub.ptd Page 6

200530430 五、發明說明(3) 【實施方式】 、下根據5亥理想之貫施形態而參考圖式,同時,說 明^發明。本發明之導電性無電解鍍層用粉體(以下、也 僅稱為鍍層用粉體)係在芯材粉體之表面,藉由益電 層法而形成鎳皮膜。 又 形成於芯材粉體表面之鎳皮膜係該鎳皮膜中之粒界以 該鎳皮膜為主而定向於厚度方向。也就是說,#皮膜中之 結晶係主要成為延長於該皮膜厚度方向之柱狀構造。鎳 3 : 0 :::广否疋向於皮膜之厚度方向係可以藉由掃描型 電子頌被鏡(以下、也稱為SEM)之觀察而由視覺所得到。 ==之=由㈣而以1〇〇〇〇(3倍為止之擴大倍率來觀 2 = 剖面時’在觀察延長於該皮膜厚度方 ^方向。垃大悲下,可以說是結晶粒界主要定向於厚 相月ΪΓ表干將顯:本發明之鑛層用粉體之某-例子之· ί 率係_〇倍。由圖1而明白地顯 許多柱狀構造而構成。在圖1,各個柱=之Λ /Λ 柱狀構造之古声^ , t 酼者鎳皮膜之形成方法而也有 於高度之狀態產生。此外,也有可以:J:I方面比較大 其倒立形狀之狀態產生。另一方 為截碩錐體形狀或 所示之無電解鎳鍍層用粉體 品之圖2 倍),在鎳皮膜之厚度方向剖面^擴大倍率係5〇_ 嬈察到瘤形狀之結晶粒 200530430200530430 V. Description of the invention (3) [Embodiment] The following is a description of the invention according to the ideal implementation mode of the 5th generation, while referring to the invention. The powder for conductive electroless plating of the present invention (hereinafter, also referred to as a powder for plating) is formed on the surface of the core material powder, and a nickel film is formed by a favorable layer method. The nickel film formed on the surface of the core material powder is the grain boundary in the nickel film, and the nickel film is mainly oriented in the thickness direction. That is, the crystal system in the #film mainly has a columnar structure extending in the thickness direction of the film. The direction of the thickness of nickel 3: 0 ::: Guang Fang toward the film can be obtained visually by observing a scanning electron microscope (hereinafter also referred to as SEM). == 之 = From ㈣ to 10000 (3 times the magnification to look at 2 = in the cross section 'in the observation extended in the direction of the thickness of the film ^ direction. Under the great sadness, it can be said that the crystal grain boundary is mainly oriented In the thick phase of the moon, the surface will show: the powder of the mineral layer of the present invention-the rate is _ 0 times. It is composed of many columnar structures clearly shown in Figure 1. In Figure 1, each column = The ancient sound of the Λ / Λ columnar structure ^, t 酼 is a method of forming the nickel film and is also produced in a high state. In addition, it is also possible: J: I is relatively large in its inverted shape. The other is cut The shape of a large cone or the powder product for electroless nickel plating shown in Figure 2), the section in the thickness direction of the nickel film ^ The magnification is 50 °

界。 由圖1而明白地顯示:本 係無間隙且敏密地集合姑哀 月之鍍層用粉體之鎳皮膜 造,形成緻密且均質之連續膜°"与度方向之許多柱狀構 圖2所示之鍍層用粉體之鎳 '〃另一方面,成為習知品之 均質。由後面敘述之實施例膜係結晶粒子變粗且成為不 們之檢討而得知:圖1所示之1明白地顯示,藉由本發明人 熱性變高,即使是在高溫條具有柱狀構造之鎳皮膜係耐 體之導電性。 下’也不容易降低鍍層用粉 以SEM來觀察鍍層用粉boundary. It is clearly shown from FIG. 1 that this series is made of a nickel film of powder for the coating of Gu Yueyue without any gaps and densely, forming a dense and homogeneous continuous film. Many columnar patterns in the direction On the other hand, the nickel powder of the coating powder is homogeneous. It is known from the examples described later that the film-based crystal particles become thicker and become a review: 1 shown in FIG. 1 clearly shows that by the inventors the thermal properties become higher, even in the case of high-temperature bars having a columnar structure. The nickel film is the conductivity of the body. It ’s not easy to lower the powder for plating. Observe the powder for plating with SEM.

例子係正如以了,鍍層用膜剖旦'之順序之某- 81 5(日本環氧樹脂股份有限公司製)丨^埃皮科特 Epicure(埃皮庫阿)(日本環Z 重ι份和 份,藉由⑴之乾燥機而限公司製)5重 X 1 Omm X 2mm之試料,來進疒士 、: 硬化’對於1 Omi 來進行彎曲破裂,以SEM來料’ 之部位。 观嘈用皮膜之破裂3The example is the same as above, the order of the coating film is-81 5 (manufactured by Japan Epoxy Resin Co., Ltd.) 丨 ^ Epicure (Epicurea) (Japanese ring Z multiples and Part, limited by the company's dryer) 5 weight X 1 Omm X 2mm sample, into the tester: Harden the part for 1 Omi to bend and crack, and use SEM to feed. Rupture of the membrane used for viewing noise 3

本發明人們係進行X π冰現耵測定/巧 發明之鍍層用粉體之鎳皮膜係除了結晶質° 传知:The present inventors performed the X π ice present measurement / invention. The nickel coating of the powder for coating was in addition to the crystalline substance.

有部分非結晶質之部分,—般係混在結晶刀=外 狀態。此外,鎳皮膜之結晶形態係在本發明_、、、°晶 界,如果具有柱狀構造的話,則不論該^ ^非成 或非結晶質,皆發現所要求之耐熱性。、及犋成為結 鎳皮膜之厚度係非常影響其密合性或耐熱 「王,在There is a part of non-crystalline material, which is usually mixed in the crystal knife = external state. In addition, the crystalline morphology of the nickel film is in the crystal grain boundaries of the present invention, and if it has a columnar structure, the required heat resistance is found regardless of the non-formation or non-crystallinity. The thickness of the nickel film greatly affects its adhesion or heat resistance.

200530430200530430

— _ I I 五、發明說明(5) 過厚時,會有 降低之傾向產生易=自芯材粉體之剝離而導電性容易 所要求之導電性。由 】也無法得到 最好是〜1。⑽皮膜之厚度係 厚度係除了例如可以由則 .1 左右。鎳皮膜之 由錄離子之添^量或化學分析而算出。 夕卜,也可以 用有藉由利用無電解鍍層而形成鋅虔胺士 用之遢原劑之種類來使得成杲皮膜之所使 之狀態產生。例如在使用次;鎳和其他元素之合金 下,所得到之鎳皮膜係成為錦作為還原劑之狀態 明,此種錄合金之皮膜係也;;C’在本發 本發明之錢層用粉體係在;膜。 鎳皮膜所構成,但是,由更加 辞你表面來形成前述 之觀點來看的話,可以在最表面阿層用粉體之導電性 金電鑛層係才目㈤於鎳皮膜,藉纟層之金電鍵層。 鍍層之厚度係—般〇. 〇〇1〜〇. 5 ,,、、/'解鍍層而形成。金電 係可以由金離子之添加量工。金電鍍層之厚度 在形成鎳皮膜之芯材粉體:;:而鼻出。 使用有機物粉體及無機物粉體=^,並無特別限制,也— _ I I V. Description of the invention (5) When the thickness is too thick, there is a tendency to decrease. Easily = peeling from the core material powder and the conductivity is easy. The required conductivity. It can't be obtained by】 It is best to be ~ 1. The thickness of the diaphragm is in addition to, for example, about .1. The nickel film is calculated from the amount of added ions or chemical analysis. In addition, it is also possible to use a type of a rhenium agent for forming a zinc film by using an electroless plating to produce a state of a rhenium film. For example, the use of nickel; alloys of nickel and other elements, the obtained nickel film is known as a reducing agent, and the film system of this alloy is also; C 'powder for the money layer of the present invention System in; membrane. It is composed of nickel film. However, from the point of view of forming the surface from the above point of view, it is possible to use a conductive gold electric ore layer of powder on the outermost surface layer to focus on the nickel film. Electric key layer. The thickness of the plating layer is generally-〇〇〇〇1〜〇. 5 ,,,, / 'deplating layer formed. Gold electricity can be added by gold ion. The thickness of the gold plating layer forms the core material powder of the nickel film :; and the nose comes out. The use of organic powder and inorganic powder = ^ is not particularly limited, and

面敘述之無電解鑛層法時,最好是^何-種。在考慮後 水中。因此’芯材粉體係最好;^粉體係可以分散於 4即使對於酸或驗也不溶解或變:非溶性於水’更加理 係扣可以藉由攪拌等之通常分=所謂能夠分散於水 成只貝分散於水中之懸濁In the non-electrolytic ore layer method described above, it is best to use 何 -species. After considering water. Therefore, the 'core material powder system is the best; ^ powder system can be dispersed in 4 does not dissolve or change even for acids or tests: insoluble in water' is more reasonable because it can be usually divided by stirring, etc. = so-called dispersible in water Suspended shellfish dispersed in water

7082-6219-PF(N2);Ahddub.ptd 成於芯材粉體表面之程度,:泰二:以能夠鎳皮 200530430 五、發明說明(6) 體。7082-6219-PF (N2); Ahddub.ptd to the extent that it is formed on the surface of the core material powder: Thai II: To be able to nickel skin 200530430 V. Description of the invention (6) Body.

在芯材粉體之形狀,並I 粉體係可以是粉粒狀,但是:可:1制。一般而言,芯材 如纖維狀、中空狀、板 以外之形狀、例 形。芯材粉體之大小係配人於2或者疋也可以是不定 用途而選擇適當之大 ='本么明之鍍層用粉體之具體 來作為電子電路連接i之;=用本發明之鐘層用粉體 最好作是:;材左右= 璃、陶(也包含合金)、玻 有含水物)、包含鋁矽酸鹽之金5孟屬之乳化物(也含 金屬氮化物、金屬碳酸鹽屬屬:鹽、金屬碳化物、 屬硫化物、金屬酸鹽、金屬等金酸鹽、金 丙烯、聚氯乙浠」;=義;、天然樹脂、聚乙歸、聚 酯、聚丙烯腈、聚縮醛、離子::: :聚醯胺、聚丙烯酸 樹脂、醇酸樹脂、苯嶋旨子;;:;:=之熱塑性 脂、三聚氰胺樹脂、二甲苯 ’、、、曰本开鳥糞胺樹 二烯丙基酞酸鹽樹脂等。這此夕^树月曰、鞦氧樹脂或 為2種以上之混合物而使用二係可以早獨使用,也可以成 芯材粉體係最好是其表而 者是進行表面改質而具有貴金屬離d: c能或 子係最好是鈀或銀之離子。戶 b貝金屬離 係指可以捕捉貴金屬離子而$=^I貴金屬離子之捕捉能 于而成為螯合物或鹽。例如在芯材 第10頁 7082-6219-PF(N2);Ahddub.ptd 200530430 五、發明說明(7) 粉體之表面存在胺基、亞胺基、醯胺基、醯亞胺基、氰 基、氫氧基、腈基、羧基、等之狀態下,該芯材粉體之表 面係,有貴金屬離子之捕捉能。在進行表面改質而具有貴 金屬離子之捕捉能之狀態下,可以使用例如日本特^ ' — 64882號公報所記载之方法。 、開日口 61 接著,就本發明之鍍層用粉體之理想之製造方法而進 打說明。鍍層用粉體之製造方法係大致分成為(丨)觸 處理製程、(2)初期薄膜形成製程和(3 )無電解鍍層 觸媒化處理製程,在具有貴金屬離子之捕捉能、或去。 疋藉2表面處理而賦予貴金屬離子之捕捉 = = 後,還原這個,將前述貴金屬載 “材粉體,分ί(』)二薄Λ形二製" 化合物所構成之二:^混合於包含錄離子、還原劑及由胺 在該芯材粉體之;:别的初期薄膜形成液,還原鎳離子, 層製程,在形成鎳初期薄膜。在⑻無電解錢 之水性懸濁體,==薄膜之芯材粉體及前述錯合劑 之同種胺化合物同時地添加含有由同種於該錯合;; 液之2種液體,進彳_ 之錯合劑之含鎳離子液和含還原劑 而詳細地敘述。進仃無電解鑛層反應。以下,就各個製程 (1 )觸媒化處理製程In the shape of the core material powder, the powder system can be powdery, but can be: 1 system. Generally, the core material has a shape other than a fibrous shape, a hollow shape, or a plate. The size of the core material powder is assigned to 2 or 疋. It can also be an indefinite use and choose an appropriate size = 'the specific of the powder for the plating of this meming is used as the electronic circuit connection i; The best powder is :; material left and right = glass, ceramic (also contains alloy), glass with water), aluminosilicate gold 5 genus emulsion (also contains metal nitrides, metal carbonates Genus: salt, metal carbide, metal sulfide, metal acid salt, metal and other metal salts, gold propylene, polyvinyl chloride, etc .; meaning; natural resin, polyethylene glycol, polyester, polyacrylonitrile, poly Acetal, Ion :::: Polyamine, polyacrylic resin, alkyd resin, benzoic acid ;; ::: = thermoplastic grease, melamine resin, xylene ',,, and guanamine Diallyl phthalate resin, etc. Now, ^ tree month, autumn oxygen resin or a mixture of two or more can be used alone early, can also be used as a core material powder system is best The surface modification is performed with the precious metal ion d: c energy or daughter system is preferably an ion of palladium or silver. Household metal ionization refers to the ability to capture precious metal ions and $ = ^ I capture of precious metal ions can become a chelate or salt. For example, in core material, page 10, 7082-6219-PF (N2); Ahddub.ptd 200530430 V. Description of the invention (7) In the state where the surface of the powder has amine, imine, amido, amido, cyano, hydroxyl, nitrile, carboxyl, etc., the core powder On the surface, there is a trapping energy of precious metal ions. In a state where the surface is modified to have a trapping energy of precious metal ions, for example, the method described in Japanese Patent Publication No. 64882 can be used. The following describes the ideal method for manufacturing the powder for coating of the present invention. The method for manufacturing the powder for coating is roughly divided into (丨) a contact treatment process, (2) an initial film formation process, and (3) non-electrolysis. In the process of coating catalyst treatment, the precious metal ions can be captured or removed. 赋予 The precious metal ions are captured by 2 surface treatments ==, then this is reduced, and the aforementioned precious metal is loaded with "material powder, divided into (") " Two thin Λ-shaped two systems " Compound Institute Composition two: ^ mixed with ions, reducing agent, and amine powder in the core material ;: other initial film forming solution, reducing nickel ions, layer process, forming an initial nickel film. In the absence of electrolytic money Aqueous suspension, == the core material powder of the film and the same amine compound of the aforementioned complexing agent are simultaneously added to contain the same kind of the complex; the liquid two kinds of liquid, the nickel-containing ion of the complexing agent The liquid and the reducing agent are described in detail. The electroless ore layer reaction is carried out. In the following, each process (1) is a catalyst treatment process.

在芯材粉體本身且古主人M 直接地進行觸媒化:貝孟屬離子之捕捉能之狀態下, 改質處理。表面改ΐ;理;;;::之狀態下,進行表面 、 解表面處理劑之水或有機 m 7082-6219-PF(N2);Ahddnb.ptd 第Π頁 200530430 五、發明說明(8) 溶媒來加入芯材粉體而充分地進行授拌及八^ "" 乾無該粉體。表面處理劑之量-人# 刀政後,分離及 由調整於粉體之表面積每丨m2 〇、^。〜材粉體之種類,藉 一之改質效果。 ·〜1 00lIlg之範圍而得到均 接著,將芯材粉體分散於例如 屬鹽之稀薄酸性水溶液。藉此而將1入遥或硝酸銀之貴金 表面。貴金屬鹽之濃度係充分於二離子捕捉在粉體 10-7〜1 X 1〇-2莫爾之範圍。捕捉主77人-表面積每lm2之1 X 分離於系統而進行水洗。接著,倭^ ^離子之芯材粉體係 中,在此加入還原劑而進杆主 侍芯材粉體懸濁於水 而在芯材粉體之表面,來載持貴金卞之遇原處理。藉此 例如次亞磷酸鈉、氫化硼鈉、。作為還原劑係使用 聯氨、曱醛等。 硼鉀、二甲基胺硼烷、 可以在貴金屬離子捕捉於芯材 錫離子吸附於粉體表面之感受性化^/之表面前,施加將 附於粉體表面,因此,例如可以將S理。為了將錫離子吸 體投入至氯化亞錫水溶液而攪拌既定5改負處理之芯材粉 (2)初期薄膜形成製程 疋日t間。 初期薄膜形成製程係由於對於芯 〜 出及對於芯材粉體之表面來進行平^化粉體之鎳之均勻析 初期薄膜形成製程,首先將載持貴二之=的而進行。在 地分散於水中。可以在分散,使用例如1芯材粉體,充分 剪斷分散裝置等。在分散芯材粉體時,0膠體輕或勻化器之 而使用界面活性劑等之分散劑。將偾^例如可以配合需要 將像巧樣所得到之水性懸In the state of the core material powder itself and the ancient master M, the catalyst is directly catalyzed: in the state of the capture energy of the Berman ions, the modification treatment is performed. Surface modification ;;;; :: in the state of surface, water or organic solution of surface treatment agent 7082-6219-PF (N2); Ahddnb.ptd page Π 200530430 V. Description of the invention (8) Solvent Come to add the core material powder and thoroughly mix and dry the powder. The amount of surface treatment agent-person # After the knife, separate and adjust the surface area of the powder per m2, ^. ~ The type of wood powder, by which one improves the effect. · Achieving uniformity in the range of ~ 100 lIlg Next, the core material powder is dispersed in a thin acidic aqueous solution of, for example, a salt. This will put 1 into the precious gold surface of distant or silver nitrate. The concentration of the noble metal salt is sufficient for the diions to be trapped in the range of 10-7 to 1 X 10-2 Moore. Capture the main 77 people-1 X per lm2 of surface area separated from the system and washed with water. Next, in the core material powder system of 倭 ^ ions, a reducing agent is added here, and the core material powder is suspended in water and is placed on the surface of the core material powder to carry the original treatment of precious gold tincture. . Thereby, for example, sodium hypophosphite, sodium borohydride, etc. As the reducing agent, hydrazine, formaldehyde and the like are used. Boron potassium and dimethylamine borane can be attached to the surface of the powder before the precious metal ions are captured on the surface of the core material, and the ions are adsorbed on the surface of the powder. Therefore, for example, S can be treated. In order to add the tin ion absorber to the stannous chloride aqueous solution, the core material powder having a predetermined 5-to-negative treatment was stirred. (2) The initial film formation process was performed within t of the next day. The initial thin film formation process is due to the uniform precipitation of nickel from the core to the core powder and the surface of the core material powder. The initial thin film formation process is carried out by first carrying the expensive two. Dispersed in water at ground. For dispersion, for example, one core material powder can be used, and the dispersion device can be sufficiently sheared. In dispersing the core material powder, a dispersant such as a surfactant is used instead of colloidal light or a homogenizer. For example, ^^ can be used to suspend the water

剛 7〇82-6219-PF(N2);Ahddub.ptd 第12頁 200530430 五、發明說明(9) 濁體’分散及混合於包含鎳離子、還添 構成之錯合劑之初期薄膜形成液。葬原别及由胺化合物所 之還原反應,在芯材粉體之表面,^此而開始進行鎳離子 如前面所敘述的,初期薄膜形成製^成鎳之初期薄膜。正 於心材粉體之表面來進行平滑化之目系由於均勻析出及對 成之鎳初期薄膜係可以變薄至能夠=而進行,因此,形 度。由該觀點來看的話,初期薄膜^,芯材粉體表面之程 〜2 、特別最好是〇. 〇〇5〜i二爪、。之厚度係最好是〇· 〇〇1 以由,離子之添加量或化學分析而曾初期薄膜之厚度係可 子之還原而不消耗錯合劑。 斤出。此外,由於鎳離 由形成前述厚度之初期薄膜之_ 膜形成液之鎳離子之濃度係最好e 9 π來看的話,初期薄 升、特別是1·0Χ 10-3〜〇」莫爾/ =并〜1·〇莫爾/公 用例如硫酸鎳或氯化鎳之水溶性^ 。作為鎳離子源係使 話,初期薄膜形成液之還原劑:由同樣觀點來看的 〇莫爾/公升、特別是2 · 〇 χ 1〇〜3〜〇辰^係最好是4 X 10-4〜2· 劑係可以使用相同於前面敘述之主莫爾/公升。作為還原 之同樣者。 貝金屬離子之還原所採用 在初期/專膜形成液來含有人 ^ 由這個和在後面敘述之含鎳離;;得重要。可以藉 成具有柱狀構造之鎳皮膜。錯合劑合劑而容易形 金屬離子而具有錯合物形成作用、人;成為鍍層對象之 為錯合劑係使用胺化合物、例 s物。在本發明,作 胺、二乙烯三胺、三乙稀四胺、丙胺酸、乙稀二 五乙埽六亞甲基四胺等之 Μ 7082-6219-PF(N2);Ahddub.ptd 200530430 五、發明說明(10) 具有胺基之=合物。這些錯合劑係可以使用i種或2種以 上。在使=這些錯合劑中、特別是甘胺酸或乙烯二胺時, 可以更加容易形成具有柱狀構造之鎳皮膜,因此,變得理 ί成::劑:;度係對於具有柱狀構造之錄緣 = 及錯合劑之溶解度之觀點來看的話, 八=/特別r 、乂夜之錯合劑之量係最好是〇· 〇〇3〜10莫爾/ 公升、特別是0.0 0 6〜4莫爾/公升。 3體S Z二二^形成初期薄膜之方面來看的話’則水性懸 濁體之β材粉體之道命及p ^ 0.5〜 3 0 0g/公升。又係取好是0.1〜5〇〇g/公升、特別是 包含芯材粉體之k, 得到之水性懸濁體係;體和混合初期薄膜形成1 程。在附加於無電解錄後面敘述之無電解錢” 易形成具有柱狀構造之二衣秩刖之水性懸濁體,由可以谷 懸濁體所包含之該芯二皮獏之方面來看的話,則該水性 懸濁體之體積之比5 4知體之表面積之總和相對於該水性 成為0 · 1〜1 5 m2 /公升、為比例係一般稱為負荷量)係最好是 得過高時’在後"面敘述是1〜10#/公升。在負荷量變 子之還原係非堂士 Μ 無電解鍍層製程,在液相之鎳離 附著在芯材粉體之表、係呈液相地產生多量’這個係 (3)無電解鍍層製程^ ’不容易形成均勻之鎳皮膜。 在無電解鍍層製裎 ^ 材粉體及前述錯人挪丨 $用(a)包含形成初期薄膜之怒 含還原劑液之3 0種液^之水性懸濁體、(b)含鎳離子液及(c) ° ia)之水性懸濁體係可以仍然直接Just 7〇82-6219-PF (N2); Ahddub.ptd Page 12 200530430 V. Description of the invention (9) The turbidity substance 'is dispersed and mixed in the initial film-forming liquid containing nickel ion and a complexing agent added thereto. As a result of the initial reaction and the reduction reaction caused by the amine compound, nickel ions begin to form on the surface of the core material powder. As described above, the initial thin film is formed to form an initial nickel film. The purpose of smoothing the surface of the heartwood powder is because the uniform precipitation and formation of the initial nickel film can be performed to a thinner thickness, and therefore the shape. From this point of view, the initial film ^, the range of the surface of the core material powder is ~ 2, and particularly preferably 0.05. I ~ two jaws. The thickness is preferably 0.001. The thickness of the thin film at the initial stage is reduced by the amount of ions added or chemical analysis without consuming the complexing agent. Pound out. In addition, since the concentration of nickel from the initial thickness of the initial thin film forming the film of the aforementioned thickness is best seen from the aspect of e 9 π, the initial thin rise, especially 1.0 × 10-3 ~ 〇 ”Moore / = And ~ 1 · mol / water-soluble ^ such as nickel sulfate or nickel chloride. As a nickel ion source system, the reducing agent for the initial thin film forming solution: 0 mole / liter from the same viewpoint, especially 2 · 〇χ 1〇 ~ 3〜〇 辰 ^ system is preferably 4 X 10- 4 ~ 2 · The agent system can use the same main moire / liter as described above. As the same as reduction. The reduction of shell metal ions is used in the initial / special film-forming solution to contain human ^ This and the nickel-containing ion described later; it is important. A nickel film with a columnar structure can be borrowed. The compounding agent mixes easily to form metal ions and has the function of forming complexes, and the object of plating is the compounding agent, which uses an amine compound, as an example. In the present invention, M 7082-6219-PF (N2) is used as amine, diethylenetriamine, triethylenetetramine, alanine, dipentaethylenehexamethylenetetramine, etc .; Ahddub.ptd 200530430 2. Description of the invention (10) A compound having an amine group. These complexing agents can be used in i or two or more kinds. Among these complexing agents, especially when glycine or ethylenediamine is used, a nickel film having a columnar structure can be formed more easily. Therefore, it becomes reasonable :: agent :; From the viewpoint of the record margin = and the solubility of the blending agent, eight = / special r, and the amount of the blending agent of the night is preferably 〇〇〇〇3 ~ 10mol / liter, especially 0.00 ~ 6 ~ 4 Moore / L. From the viewpoint of the formation of the three-body S Z 222, the formation of the initial film is' the life of the β-material powder of the aqueous suspension and p ^ 0.5 to 300 g / liter. In addition, it is taken to be 0.1 ~ 500g / liter, especially k containing the core material powder, to obtain an aqueous suspension system; the body and the initial stage of mixing are formed into a film. In addition to the electroless money described later in the electroless recorder, it is easy to form an aqueous suspension of Niigata with a columnar structure. From the aspect of the core dihide that can be included in the suspension, Then, the ratio of the volume of the aqueous suspension to the total surface area of the 5 body is 0 · 1 ~ 1 5 m 2 / liter with respect to the water, and the ratio is generally called the load.) It is preferably too high. 'In the back', the description is 1 ~ 10 # / liter. In the reduction of the load changer, it is a non-Domestic non-electrolytic plating process, and the nickel in the liquid phase is adhered to the surface of the core powder, which is in the liquid phase. A large amount of 'this system (3) electroless plating process ^' is not easy to form a uniform nickel film. In the electroless plating process, the material powder and the above-mentioned mistakes are used (a) including the anger of forming an initial film Aqueous suspensions of 30 kinds of liquids containing reducing agent liquid, (b) nickel ion-containing liquids and (c) ° ia) aqueous suspension systems can still be directly

7082-6219-PF(N2);Ahddub.ptd 苐14頁 200530430 五、發明說明(]1) 使用在前面敘述之初期薄膜形 不同於(a)之水性懸濁體,:,斤侍到者。 (c)之含還原劑液之2種液體。人"^製(b)之含鎳離子液及 子源之硫酸鎳或氯化鎳之 二鎳離子液係例如成為鎳離 易形成具有柱狀構造之銲皮=士 1鹽之水溶液。由可以容 係最好是成為OH.2 = M八來/的話’則鎳離子之濃度 公升。 、 A升、特別是0 · 5〜1. 0莫爾/7082-6219-PF (N2); Ahddub.ptd 页 page 200530430 V. Description of the invention () 1) Use of an aqueous suspension with a film shape different from (a) in the initial stage described above: (c) 2 kinds of liquid containing reducing agent. (B) The nickel ion solution containing nickel ion solution and the secondary source of nickel sulphate or nickel chloride is a nickel ion solution which is, for example, an aqueous solution in which nickel can easily form a solder skin with a columnar structure. If it can be considered to be OH.2 = M eighty /, the concentration of nickel ions is liter. , A liter, especially 0 · 5 ~ 1. 0 Moore /

在含錄離子液來肖冬PI 劑之同種錯合劑係變得重要。也以濁:厂广有,錯合 濁體及(b)之含鎳離子液之也^疋說,在(a)之水性懸 得重要。可以蕤t卜而六R 者而含有同種之錯合劑係變 理由係並不明u,=具有柱狀構造之鎳皮膜。該 濁體及(b)之含鎳離子I夜及係由於藉由在(a)之水性懸 子,枋海3 〜、子液之兩者來含有錯合劑而穩定鎳離 子妨礙该返原反應急劇地進行之緣故。 性轉(:^之夕含蚀錄離子液之錯合劑之濃度係也相同於(a)之水 塑了由蟀1合劑之濃度,對於鎳皮膜之形成,造成影 : “。點及錯合劑之溶解度之觀點來看的話,則含鎳In the case of the ionic liquid containing Xiaodong PI, the same complex system becomes important. It is also known as turbidity: it is widely available in the factory, and it is mixed with turbidity and (b) nickel-containing ion solution, and it is important to suspend in (a). It is possible to change the reason why the compound type containing the same kind of compound is changed. The reason is not clear. U = nickel film with columnar structure. The turbid body and the nickel-containing ion of (b) are stable because of the inclusion of a complexing agent in both the aqueous suspension of (a), Erhai 3 ~, and the sub-liquid, thereby stabilizing the reversion reaction. For the sake of proceeding. The concentration of the complexing agent containing the ionic liquid containing etched ions is also the same as that of (a). The concentration of the mixture of 蟀 1 mixture is used to form the nickel film, which affects: ". In terms of solubility, nickel

& ί 之錯口劑之量係最好是成為0.0 0 6〜12莫爾/公升、 特別疋0· 012〜8莫爾/公升。 ^ (c\之含還原劑液係一般成為還原劑之水溶液。作為 1原劑係可以使用相同於前面敘述之貴金屬離子之還原所 才木用=同樣者。特別最好是使用次亞磷酸鈉。由對於鎳離 子^還原狀悲來造成影響來看的話,則還原劑之濃度係最 好疋调整成為0 · 1〜2 0莫爾/公升、特別是1〜1 〇莫爾/公升& The amount of staggering agent is preferably from 0.06 to 12 mol / liter, particularly from 0. 012 to 8 mol / liter. ^ (c \ the reducing agent-containing liquid system generally becomes an aqueous solution of the reducing agent. As the original agent system, the same as the reduction of the precious metal ions described above can be used = the same. It is particularly preferable to use sodium hypophosphite From the point of view of the impact on the reduction of nickel ions, the concentration of the reducing agent should preferably be adjusted to 0 · 1 ~ 20 Moore / liter, especially 1 ~ 10 Moore / liter.

200530430 五、發明說明(12) 之範圍。 此外,可以在h、 少 除了由前述胺化合物所構懸濁體及(b)之含鎳離子液, 類之錯合劑。作為此種 $錯合劑以外’還加入其他種 例如檸檬酸、經基乙酉,、;别’係列舉有機叛酸或其鹽、 或者是其驗金屬鹽或;趟;石;;韻:酸、乳酸或葡糖酸 狀態下,相同於由胺^::^ °在併用其他種類之錯合劑之 同種生懸濁體及(b)之:鎳離;;之:= 在(a)之水性縣、、器M J ^ ^ 子液及(C)之含還;劑液之2固二同時地添加⑻之含鎳離 在芯材粉體之表面,斤液出之链2種;f。編還原鎳離子, 含還原劑液之添加速;膜。含鎳離子液和 塑。因此,錄夕構造之鎳皮膜之形成,造成影 加速度而控制成為是藉±由調整2種液體之添 米/小時。鎳之析出速二含 速度來計算而求出。 稽考田3鏢離子液之添力口 =種液體添加於水性懸濁體之期間,該 體之錯合劑之濃度係轡挥 —^ ^ 添加所造成之水性縣濁= ;:=起因於由於2種液體之 包含之錯合劑之心=t 之增加及含鎳離子液所 慮錯合劑之溶解度二“ 5 :。在本製造方④’在也考 2種液體之添加過程\,=發:人們之檢討而得知:在 之奸人高丨$ * #私中特別疋有利於使得水性懸濁體中 之U之浪度保持在〇·〇〇3〜1〇莫爾/公升、特別是 200530430 五、發明說明(13) 0· 0 0 6〜4莫爾/公升之範圍。可以藉由將2種液體添加過程 之水性懸濁體中之錯合劑之濃度保持在前述範圍内,而更 加容易形成ΐ有柱狀構造之鎳皮膜。I了將水性懸濁體中 之錯合劑之浪度保持在前述範圍内,因此,可以 離子液及含還原劑液之添加速度(鎳之析出速度)或水性ί 濁體中之錯合劑之初期濃度或者是含鎳離子液中之錯合; 之濃度。就這些值而言,正如前面敘述。 ^ 在2種液體添加於水性懸濁體之期間,最好是使 面救述之負荷量保持在〇]〜1W/公升、特別是卜㈤/ 公升之範圍。1以藉此而均句地析出鎳,同時,更力 地形成^不到結晶粒界之鎳皮膜。由於同樣之理由易 1匕’ t*,好是使得在結束2種液體之添加而完成鎳離子還 原之時間點之負荷量,成為該範圍。 雕千遇 像這樣,得到在芯材粉體之表面形成鎳皮膜 鍍層用粉=接著,該鍍層用粉體之鎳皮膜中之粒界俜主 要定向於該鎳皮膜之厚度方向。 1係主 也根據所使用之還原劑之種類,但是, 懸濁體之抑值係保持在3〜13、特別是2 巳 疋由防止鎳之非水溶性沉澱物之生成之大 面來看,話’則變得理想。為了調整PH值,因此,例如^ 以在含還原劑液中,以既宕旦办夭*长产 例如可 整劑。 以既疋里來添加虱氧化鈉等之pH值詞 所得到之鍍層用粉體係在重複地 洗後’進行分離。料,作為附加製程係可以在=水200530430 V. Scope of invention description (12). In addition, at h, the addition of the suspension composed of the aforementioned amine compound and the nickel-containing ion solution of (b), and the like can be reduced. In addition to this kind of $ complexing agent, other types such as citric acid, acetoacetate, etc. are added as a series of organic acid or its salt, or its metal test salt; or; stone; stone; rhyme: acid, In the state of lactic acid or gluconic acid, it is the same as that of amine ^ :: ^ ° in the same kind of raw suspension in combination with other types of complexing agents and (b): nickel ion;; of: = in (a) aqueous county , MJ ^ ^ Sub-liquid and (C) containment; 2 solids of the agent liquid simultaneously add ⑻ of nickel-containing ion to the surface of the core material powder, 2 kinds of chain from the liquid; f. Weaving reduction of nickel ions, adding rate of reducing agent-containing liquid; membrane. Contains nickel ion solution and plastic. Therefore, the formation of the nickel film of the recording structure causes the acceleration of the shadow to be controlled by adjusting the addition of two liquids per meter per hour. The nickel precipitation rate is calculated and calculated. Jikoutian 3 dart ionic liquid Tim Likou = During the period of time when a liquid is added to an aqueous suspension, the concentration of the complexing agent of the body is fluctuated — ^ ^ The water-based county turbidity caused by the addition =;: = due to 2 The concentration of the complexing agent included in a liquid = the increase in t and the solubility of the complexing agent considered in a nickel-containing ion solution 2 "5:. In the manufacturer ④ 'the test of the addition of 2 kinds of liquids is also performed. \, = Hair: people It was learned from the review that the traitor in the high 丨 $ * #Private is particularly conducive to keeping the U wave in the aqueous suspension at 0.003 ~ 10 Moore / liter, especially 200530430 V. Explanation of the invention (13) 0 · 0 0 6 ~ 4 Moore / liter range. It can be easier to keep the concentration of the complexing agent in the aqueous suspension during the two kinds of liquid addition process within the aforementioned range, and it is easier. A nickel film with a columnar structure is formed. I keep the wave length of the complexing agent in the aqueous suspension within the aforementioned range. Therefore, the addition rate of the ionic liquid and the reducing agent-containing liquid (the nickel precipitation rate) or The initial concentration of the complexing agent in the waterborne turbidity or the complexing in the nickel-containing ion solution; Concentrations of these values are as described above. ^ While the two liquids are added to the aqueous suspension, it is best to keep the load of the surface within 0] ~ 1W / liter, especially Bu / Liter range. 1 In this way, nickel is uniformly precipitated, and at the same time, a nickel film that is less than the crystal grain boundary is more strongly formed. For the same reason, it is easy to d't *. The load at the point in time when the addition of the liquid completes the reduction of nickel ions is within this range. Carving Chinyu like this, to obtain a nickel coating film for forming a nickel film on the surface of the core powder, and then a nickel film for the coating powder The grain boundary 俜 in the medium is mainly oriented in the thickness direction of the nickel film. 1 series is also based on the type of reducing agent used, but the suppression value of the suspension is maintained at 3 ~ 13, especially 2 From the perspective of the formation of the water-insoluble precipitate of nickel, the word 'becomes ideal. In order to adjust the pH value, for example, ^ can be used in a reducing agent-containing liquid, and can be used for long-term production. The whole agent. It is obtained by adding pH words such as lice sodium oxide into the existing The powder system for coating is separated after repeated washing ’. As an additional process system,

200530430 五、發明說明(14) ___ 上,進行成為最上層之金電鍍層之形 形成係可以按照向來習知之無電解鍍層^ f電鍍層之 由在鍍層用粉體之水性懸濁體,包含^嬌-仃。例如藉 鈉、檸糢酴二如U 人^ ^歸一 ^四乙酸四 pH值之益電解铲屏,、一,添加在利用氫氧化鈉來調整 像在鎳皮膜上,形成金電鑛層。 侬&樣所侍到之鍍層用粉體係適合 將異方性導電薄膜f Α ΓίΜ弋舳玄私、击& 用作為例如用以200530430 V. Description of the invention (14) On ___, the formation of the gold plating layer that becomes the uppermost layer can be performed according to the conventionally known electroless plating layer ^ f The aqueous suspension of the plating layer is made of powder for coating, including ^ Jiao- 仃. For example, using sodium and citrate, such as U, ^, ^, ^, ^, ^, tetraacetic acid, and the pH value of the electrolytic shovel screen, one, and adding sodium hydroxide to adjust the image on the nickel film to form a gold power ore layer. The powder system for coatings served by Nong & samples is suitable for using anisotropic conductive films f Α ΓίΜ 弋 舳 玄 私, && for example, to

电潯膜CACE)或熱岔封連接器(HS 益面板之電極來連接至驅動用L s丨晶 液^顯不 材料等。 ^<电峪基板之導電 本發明係並無限制在前述實施形 形態,於芯材粉體之表"成4:狀::在前述實施 但是,為了取代這個,因此鎳皮臈, 在形成1他厶扈士 j j以在心材粉體之表面, 德i ,、金屬皮膜之粉體之該皮膜表面,带成呈古4 u、 :之鎳皮膜。此夕卜,本發明之鍍 :土大 並無限制在前述方法。 ⑺货體之製造方法係 【實施例】 本發::範例而更加詳細地說明本發明。但是, [實施例二,係限制在此種實施例。 (1)觸媒化處理製程 來作徑:二真比重2.23之球狀二氧… 毫升之調節界水、、容心材粉體之4〇g,攪拌及投入至400 節器231」)。調;i(CyPrei(西普雷)公司製之「潔淨調 凋即斋水溶液之濃度係4〇毫升/公升。接 200530430 五、發明說明(15) =在液溫60。。’施加超音波’同時,攪拌3〇分鐘 ::粉體之表面改質及分散處理。過據水溶液,使得一次 ίΐ體水洗之芯材粉體,成為2〇0毫升之槳體。將氣化亞 二水溶液20。毫升投入至讓。該水溶液之濃度係=亞 笔升/公升。在常溫’攪拌5分鐘,進行將錫離 =心材粉體表面之感受性化處理。接著,過遽 ::次再漿體水洗。然後’使得芯材粉體成為4〇 之 =,維持於60 t。併用超音波,進行漿體授 添加0.11莫爾/公升之氣化鈀水溶液2 :Electro-membrane CACE) or heat-sealed connector (HS benefit panel electrode to connect to L s 丨 crystal liquid ^ display material, etc.) ^ < the conductivity of the electric substrate is not limited to the foregoing implementation The shape is on the surface of the core material powder, which is 4 :: In the foregoing implementation, however, in order to replace this, the nickel skin is now formed on the surface of the heartwood powder. The surface of the film of the powder of the metal film is formed with a nickel film of ancient 4 u :. Moreover, the plating of the present invention is not limited to the aforementioned method. The method of manufacturing the cargo body is [ [Example] This hair :: an example to explain the present invention in more detail. However, [Example 2 is limited to this type of example. (1) Catalyst process to make the diameter: the spherical shape of the two true specific gravity 2.23 Dioxygen ... 40 milliliters of regulated water, 40 g of Rongxin wood powder, stir and put into 400 knots 231 "). Tune; i (CyPrei (Cyprei) company's "clean tune with fast water solution concentration of 40 ml / liter. Continued 200530430 V. Description of the invention (15) = at the liquid temperature of 60. 'Apply ultrasonic waves' At the same time, stirring for 30 minutes :: the surface modification and dispersion treatment of the powder. According to the aqueous solution, the core material powder washed with water once became 200 ml of paddle. The sub-aqueous solution 20 was gasified. The milliliter is added to the mixture. The concentration of the aqueous solution is = Asian pen liters / liter. Stir for 5 minutes at room temperature, and perform the sensitization treatment of tin ion = the surface of the heartwood powder. Then 'make the core material powder to be 40%, and maintain it at 60 t. And use ultrasound to perform slurry addition and add 0.11 mole / liter of gasified palladium aqueous solution 2:

=處理。接著’過濾水溶液,使得—次再聚體熱水洗之 心材粉體’成為20 0毫升之漿體。併用超音波,同時,攪 =該漿體,加人〇_〇17莫爾/公升之二甲基胺魏和0.16莫 爾/公升之硼酸間之混合水溶液20毫升至該處。在常溫, ,用超音波,同時,進行2分種搜拌,進行鈀離子之 處理。 (2 )初期薄膜形成製程= Handle. Then, "the aqueous solution was filtered, so that the repolymerized heartwood powder washed with hot water once" became a slurry of 200 ml. Ultrasound was used at the same time, the slurry was stirred, and 20 ml of a mixed aqueous solution of 0.17 mol / liter of dimethylamine and 0.16 mol / liter of boric acid was added thereto. At room temperature, sonication was performed at the same time, and 2 minutes of searching and mixing were performed to perform the treatment of palladium ions. (2) Initial film formation process

將在(1)製程所得到之2 0 〇毫升之漿體,攪拌及添加於 表1所不之(a)之初期薄膜形成液,成為水性懸濁體。初期 薄膜形成液係加溫於7 5 C ’液體量係1 · 8公升。在投入漿 體後,馬上就看到氫之產生,確認初期薄膜形成之開始。 在1分鐘後,投入0 · 0 6 3莫爾之次亞磷酸鈉,並且,還持續 地進行1分鐘攪拌。水性懸濁體之負荷量係4 · 5 m2 /公升。 (3)無電解鍍層製程The 200 ml of the slurry obtained in the process of (1) was stirred and added to the initial film-forming liquid of (a) shown in Table 1 to become an aqueous suspension. The initial film-forming liquid system was heated at 7 5 C 'and the liquid amount was 1.8 liters. Immediately after the slurry was charged, the generation of hydrogen was observed, and the start of the initial film formation was confirmed. After 1 minute, 0. 06 3 mol of sodium hypophosphite was added, and stirring was continued for 1 minute. The load of the aqueous suspension is 4 · 5 m 2 / liter. (3) Electroless plating process

7082-6219-PF(N2);Ahddub.ptd 第19頁 200530430 五、發明說明(16) ' ----- c ,9來添加表1所示之⑴之含錄離子液及 升在3= ί ;广夜體。添加量係分別成為 LI二 馬上就看到氫之產生,確認鍍層 。一直到2種液體之添加結束為止之間,水性 度。在結束2種液體之添Λ之/辰一度直=持在表1所示之濃 止,保持於75t之溫度,同時,持直之發泡停止為 體之添加結束後之負荷量係2 4m2/夺/進仃攪拌。2種液 懸濁體,在對於過濾物來進行3 A f。接著,過濾水性 9 #^110 鍍層用皮膜之鍍層用粉體。在莽 侍到具有鎳一磷合金 而觀察所得到之鍍層用粉體之^g大倍率5 0 0 0 〇倍之SEM 於圖1,皮膜之粒界係主要定向又於\女用皮膜之剖面時,相同 面。由鎳離子之添加量所算出少皮膜之厚度方向剖 。 之鍍層用皮膜之厚度係0.54 [實施例5〜8] 調製金鍍層用之無電解鍍層〉夜丨八 係包含0. 0 2 7莫爾/公升之乙烁:\公升。無電解鍍層液 ^ fee 四 7 糾 爾/公升之檸檬酸三鈉及〇 〇1苴 G酉夂四鈉、0.038莫 • 吳_/公斗+ & 氫氧化鈉水溶液而調整pH值成為6 之氰化金鉀,藉由 解鍍層液,同時,在該鍍層液,八。授拌液溫6 0 t:之無電 得到之鍍層用粉體33g,進行2〇 / +別添加在實施例1〜4所 著,過濾液體,在對於過濾物來刀鐘之金鍍層處理。接 進行3次再漿體洗淨後,7082-6219-PF (N2); Ahddub.ptd Page 19 200530430 V. Description of the invention (16) '----- c, 9 To add the ionic liquid containing ⑴ as shown in Table 1 and raise it at 3 = ί; wide night body. The amount of addition is LI 2 respectively. Immediately see the generation of hydrogen, confirm the coating. Until the end of the addition of the two liquids, the water content. At the end of the two liquids, the addition of Λ / chen once straight = held at the concentration shown in Table 1, maintained at a temperature of 75t, and at the same time, the load of the straight foaming stopped after the addition was 2 4m2 / Whisk into the pan and stir. Two kinds of liquid suspensions were subjected to 3 A f for the filtrate. Next, the water-based 9 # ^ 110 coating powder for coating was filtered. The SEM of ^ g large magnification of 50000 times magnification of the powder for coating obtained when the nickel-phosphorus alloy was observed and observed in Figure 1. The grain boundary of the film is mainly oriented in the cross section of the female film. Same time. The thickness of the thin film was calculated from the amount of nickel ions added. The thickness of the coating film is 0.54 [Examples 5 to 8] [Electroless plating for modulation of gold plating layer] Ye 丨 8 series contains 0.02 7 Moore / liter of Yishuo: \ liter. Electroless plating solution ^ fee 4 7 Jie / L of trisodium citrate and 001 苴 G 酉 夂 tetrasodium, 0.038 Mo • Wu _ / gongdou + & sodium hydroxide aqueous solution to adjust the pH to 6 The gold and potassium cyanide are removed by the plating solution, and at the same time, the plating solution is eight. The temperature of the mixing solution was 60 t: no electricity, and 33 g of the powder for the coating was obtained, and 20 / + was added without adding the materials described in Examples 1 to 4. The liquid was filtered, and the filtered substance was subjected to a gold plating treatment. After three times of re-slurry washing,

200530430200530430

,由Η 0、C之真空乾燥機而進行乾燥。藉此而得到在鎳 膜上形成金無電解電鍍層的鍍層用粉體。由金離子之、天 量所算出之金電鍍層之厚度係0.025 //m。 /j、、^ [實施例9 ] (1) 觸媒化處理製程 使用平均粒徑14 、真比重1.39之球狀苯并鳥袁 ”-三聚氰胺-甲醛樹脂[日本觸媒(股)公司製、商品名= π Ε ρ 〇 s 1: a r (也波斯】素ν' 1,成& a ^ 石% ,,f ^達)],來作為芯材粉體。使得該芯# r ?之,,成為4 00毫升之渡體,維持於6〇。〇。 :七It is dried by a vacuum dryer of Η 0, C. Thereby, a powder for a plating layer is obtained in which a gold electroless plating layer is formed on a nickel film. The thickness of the gold plating layer calculated from the amount of gold ions is 0.025 // m. / j 、、 ^ [Example 9] (1) The catalyst treatment process uses a spherical benzoguanine with an average particle size of 14 and a true specific gravity of 1.39 "-melamine-formaldehyde resin [manufactured by Japan Catalysts, Inc., Commodity name = π Ε ρ 〇s 1: ar (also Persian) prime ν '1, into &a; stone% ,, f ^)], as the core material powder. Make the core # r? 之 , , To become a body of 400 ml, maintained at 60.0 .: 7

皮、…Λ 添加0.11莫爾/公升之氯化鈀 =液2^升。㈣、維持此㈣拌 ^ 粉體之表面來捕捉鈀離子 ^刀里逛仃在心材 汸,你,曰AT 離于之活化處理。接著,過濾水溶 液’使付一次再漿體埶水哞 將栌说田如也丄广洗之心材粉體,成為200毫升之 浆體。併用超音波,同日主 ,x . . . » ^ 1 门4,攪拌該漿體,加入0.017莫爾/ ^ 〇 Λ ^ „ 不U · 1 b ^ /公升之硼酸間之混合水 八括m祕 你吊,皿併用超音波,同時,進行2 刀種攪拌,進行鈀離子之還原處理。 (2) 初期薄膜形成製程Peel, ... Λ Add 0.11 Moore / L of palladium chloride = 2 ^ L of liquid. ㈣, maintain this ㈣ mix ^ the surface of the powder to capture palladium ion ^ walk in the knife 仃 in the heartwood 汸, you, said AT away from the activation treatment. Next, the aqueous solution was filtered and the slurry was re-slapped once. The water was mixed with the heartwood powder which had been washed by Ruta Tianru to make a slurry of 200 ml. Using ultrasound, the same day master, x... »^ 1 door 4, stir the slurry, add 0.017 Moore / ^ 〇Λ ^„ not U · 1 b ^ / liter of mixed water between boric acid You hang the dish and use ultrasonic waves, and at the same time, perform 2 knife agitation to reduce the palladium ion. (2) Initial film formation process

本q 在(1 )製程所得到之2 0 Ο毫升之漿體,攪拌及添加於 ^不之(a)之初期薄膜形成液,成為水性懸濁體。初期 2形成液係加溫於75t,液體量係18公升。在投入漿 7 馬上就看到氫之產生,確認初期薄膜形成之開始。 在1为鐘後,投入0.042莫爾之次亞磷酸鈉,並且,還持續 地進行1分鐘攪拌。水性懸濁體之負荷量係4.6mV公升。The 200 ml of the slurry obtained in the process of (1) is stirred and added to the initial film-forming liquid of (a) to become an aqueous suspension. The initial 2 formation liquid system was heated at 75t, and the liquid volume was 18 liters. The generation of hydrogen was observed immediately after the slurry 7 was introduced, and it was confirmed that the initial film formation started. After 1 minute, 0.042 moles of sodium hypophosphite was added, and stirring was continued for 1 minute. The load of the aqueous suspension is 4.6mV liters.

200530430 五、發明說明(18) (3)無電解鍍層製程 在初期薄膜形成製程所 , 1所不之添加逮度,夹禾Λ主, κ「王心淘篮刀別以表 (C)之含還原劍液之2種液°表1所不之(b)之含鎳離子液及 升。在# 種/夜體。添加量係分別成為409毫 开在添加2種液體後,馬上袜丟糾今+玄a ^ pe ^ ^ 1上就看到虱之產生,確認鍍層 開始。一直到2種液體之添加結束為止之間,水性 豆之具有胺基之錯合劑之濃度係保持在表丨所示之濃 :。在結束2種液體之添加後’一直到氫之發泡停止為 止’保持於75 ΐ:之溫度’同時’持續地進行攪拌。2種液 體之添加結束後之負荷量係3. 3mV公升。接著,過據水性 懸濁體,在對於過渡物來進行3次再聚體洗淨後,藉由! ! 〇 t之真空乾燥機而進行,燥。藉此而得到具有鎳—磷合金 鍍層用皮膜之粉雜。在藉由擴大倍率500 0()倍之SEM而觀察 所得到之鍍層用粉體之^層用皮膜之剖面時,相同於圖 1,皮膜之粒界係主/要定向於該皮膜之厚度方向剖面。由 鎳離子之添加量所异出之鍍層用皮膜之厚度係〇 26 Am。 [實施例1 〇 ] 除了使用在實㈣9所得到之鍛層用粉體2i.36g以200530430 V. Description of the invention (18) (3) The electroless plating process is in the initial thin film formation process. The addition of 1 is not included, and the master is κ. "King's heart basket knife is not listed in Table (C) with reduction sword. The two kinds of liquids ° The nickel ion-containing solution and liters that are not in (b) in Table 1. In # species / night body. The amount of addition is 409 milligrams. After adding the two kinds of liquids, immediately lose the socks + Xuan a ^ pe ^ ^ 1 can see the generation of lice, confirm the start of the plating. Until the end of the addition of the two liquids, the concentration of the amine-based complexing agent of water-based beans is maintained as shown in Table 丨Concentrated: After the addition of the two liquids, the temperature is maintained at 75 ° C until the hydrogen foaming stops, and the temperature is simultaneously and continuously stirred. The load after the addition of the two liquids is 3. 3mV Liter. Next, the resuspended polymer was washed three times with the aqueous suspension, and then dried with a vacuum dryer of 〇t. This resulted in a nickel-phosphorus alloy. Powder of coating for coating. Observation of coating obtained by SEM magnification of 500,000 () times. The cross-section of the coating film for the body is the same as that in Figure 1. The grain boundary of the coating film is mainly / cross-section oriented in the thickness direction of the coating film. The thickness of the coating film is different from the amount of nickel ions added. 26 Am. [Example 1 〇] In addition to using 2i.36g of powder for forging layer obtained in actual ㈣9

外’其餘係相同於貫施例5 ’得到在鎳皮膜上形成金無電 解電鍍層的鍍層用粉體。由金離子之、天+ β 卜 鑛層之厚二。+之添加!所算出之金電 [實施例11 ] 、真比重133之球狀丙烯樹脂, (1)觸媒化處理製程 使用平均粒# 10 νThe rest is the same as in Example 5 ', and a powder for a plating layer is obtained in which a gold electroless plating layer is formed on a nickel film. It consists of gold ion, sky + β, and thickness of ore layer. + Added! Calculated gold electricity [Example 11], spherical acrylic resin with a true specific gravity of 133, (1) Catalyst processing process Use an average particle # 10 ν

7082.6219-PF(N2);/vhddub.ptd 第22頁 200530430 五、發明說明(19) 來作為芯材粉體。使得該芯材粉體之2 〇g,成為2〇〇毫升之 聚體’將氯化亞錫水溶液2 〇 〇毫升投入至該漿體。該水溶 液之濃度係5 X 1 〇_3毫升/公升。在常溫,攪拌5分鐘,進行 將錫離子吸附於芯材粉體表面之感受性化處理。接著,過 慮水溶液’進行一次再漿體水洗。然後,使得芯材粉體成 為40 0毫升之製體,維持於6〇 i。併用超音波,進行漿體 授拌’同時’添加0 · 1 1莫爾/公升之氣化鈀水溶液2毫升。 仍然維持此種攪拌狀態5分鐘,進行在芯材粉體之表面來 捕捉鈀離子之活化處理。接著,過濾水溶液,使得一次再 漿體熱水洗之芯材粉體,成為2 〇 〇毫升之漿體。併用超音 波’同時’搅拌該漿體,加入〇 · 〇丨7莫爾/公升之二曱基胺 獨烧和0 · 1 6莫爾/公升之硼酸間之混合水溶液2 〇毫升至該 處。在常溫,併用超音波,同時,進行2分種攪拌,進行 鈀離子之還原處理。 (2 )初期薄膜形成製矛呈 將在(1)製程所得到之2 〇 〇毫升之漿體,攪拌及添加於 表1所示之(a)之初期薄膜形成液,成為水性懸濁體。初期 薄膜形成液係加溫於75艺,液體量係丨· 8公升。在投入漿 體後’馬上就看到氫之產生,確認鍍層反應之開始。在1 分鐘後’投入0· 042莫爾之次亞磷酸鈉,並且,還持續地 進行1分鐘攪拌。水性懸濁體之負荷量係4· 5m2/公升。 (3 )無電解鍍層製程 在初期薄膜形成製程所得到之水性懸濁體,分別以表 1所示之添加速度,來添加表1所示之(b)之含鎳離子液及7082.6219-PF (N2); /vhddub.ptd Page 22 200530430 V. Description of the invention (19) As the core material powder. 200 g of the core material powder was made into a polymer of 200 ml '. 2000 ml of an aqueous solution of stannous chloride was put into the slurry. The concentration of this aqueous solution was 5 X 10-3 ml / liter. Stir at room temperature for 5 minutes to perform a sensitization treatment to adsorb tin ions on the surface of the core material powder. Next, the aqueous solution 'was subjected to re-slurry washing once. Then, the powder of the core material was made into a preparation of 400 ml and maintained at 60 i. Then, using a ultrasonic wave, the slurry was blended, and at the same time, 2 ml of a vaporized palladium aqueous solution of 0. 11 mole / liter was added. The stirring state was maintained for 5 minutes, and an activation treatment was performed on the surface of the core powder to capture palladium ions. Next, the aqueous solution was filtered so that the core material powder, which was washed with the hot water once, became 2000 ml of slurry. Then, the slurry was stirred at the same time with ultrasonic waves, and 20 ml of a mixed aqueous solution of 0 · mol · 7 mol / liter of difluorenylamine and 0 · 16 mole / liter of boric acid was added thereto. Simultaneously, ultrasonic waves were used at room temperature for 2 minutes while stirring to perform a reduction treatment of palladium ions. (2) Initial film formation: The 2,000 ml of the slurry obtained in the process of (1) was stirred and added to the initial film-forming solution of (a) shown in Table 1 to form an aqueous suspension. The initial film-forming liquid system was heated at 75 ° C, and the liquid volume was 8 liters. Immediately after the slurry was charged, the generation of hydrogen was seen and the start of the plating reaction was confirmed. One minute later, 0.042 mol of sodium hypophosphite was added, and stirring was continued for 1 minute. The load of the aqueous suspension was 4.5 m2 / liter. (3) Electroless plating process The aqueous suspensions obtained in the initial film formation process are added at the addition rates shown in Table 1 to the nickel-containing ion solution (b) shown in Table 1 and

7082-6219-PF(N2);Ahddub.ptd7082-6219-PF (N2); Ahddub.ptd

第23頁 200530430 五、發明說明(20) '〜----—____ (c)之含還原劑液之2種液體。添加旦〆 升。在添加2種液體後,馬上就看^里^係分別成為4〇4毫 反應之開始。一直到2種液體之於氫之產生,確認鍍層 懸濁體之具有胺基之錯合劑之4声"結束為止之間,水性 度。2種液體之添加結束後之 又旦'保持在表1所示之濃 2種液體之添加後,一斤、何里係3· 2m2/公升。在結束 °C之溫度,同時,拄—Λ 之發泡停止為止,保持於75 體,在對於過濾物來』^進^仃攪拌。接著,過濾水性懸濁 真空乾燥機而進行浐订#人再漿體洗淨後,藉由1〗0 °c之 用皮膜之粉體。在^、呆。藉此而得到具有鎳一磷合金鍍層 到之鍍層用粉體之=由擴大倍率5 0 0 0 0倍之SEM而觀察所得 膜之粒界係主要定=層用皮膜之剖面時,相同於圖1,皮 之添加量所算出之D於該皮膜之厚度方向剖面。由鎳離子 [實施例12] # 錢層用皮膜之厚度係0· 26 //m。 除了使用在命 外,其餘係相同二;例11所得到之鍵層用粉體17.0§以 解電鍍層的鍍芦用汽施例5,得到在鎳皮膜上形成金無電 鍍層之厚度係〇曰〇?粉體。由金離子之添加量所算出之金電 [比較例1 ] 5 & m。 在本比較例, 一直到觸媒化产 扭用向來進行之無電解鑛層建浴方式。 解鍍層液係使^ ^製程為止’相同於實施例1。作為無電 公升之次亞碟於包含〇· 11莫爾/公升之琉酸錄、0· 24莫爾/ 爾/公升之乙外酸欠納、0. 2 6莫爾/公升之頻果酸鈉、〇 · 1 8莫 欠納和2 X 1 〇—6莫爾/公升之乙酸鉛並且pH值調 — 7082-6219-PF(N2);Ahddub.tPage 23 200530430 V. Description of the invention (20) '~ ----____ (c) 2 kinds of liquid containing reducing agent. Add liters. Immediately after adding the two kinds of liquids, it was seen that the ^^^ system became the beginning of the reaction. Until the two kinds of liquids are generated by hydrogen, it is confirmed that the water solubility of the plating suspension is 4 times as long as the sulfide having an amine group is ended. After the addition of the two liquids, the density of the two liquids shown in Table 1 was maintained. After the addition of the two liquids, one pound and Hori were 3.2 m2 / liter. At the end of the temperature of ° C, at the same time, until the foaming of 拄 -Λ ceases, it is maintained at 75, and the mixture is stirred for ^^^^ to the filter. Next, the water-based suspension vacuum dryer was filtered to clean the slurry, and then the powder was coated with a coating film at 1 ° C and 0 ° C. ^, Stay. In this way, a coating powder having a coating layer of nickel-phosphorus alloy is obtained. The grain boundary of the obtained film is mainly determined by an SEM with a magnification of 50000 times. The section of the film for the layer is the same as the figure. 1. D calculated from the amount of skin added is a cross section in the thickness direction of the film. From nickel ions [Example 12] # The thickness of the film for money layer is 0. 26 // m. Except that it is used, the other two are the same; the powder of the bond layer obtained in Example 11 was 17.0§, and the electroplating layer was used for steam refining example 5 to obtain the thickness of the gold electroless layer formed on the nickel film. Said 〇? Powder. Gold electricity calculated from the amount of gold ions added [Comparative Example 1] 5 & m. In this comparative example, the electroless ore layer construction method has been used until the catalyst production. The deplating liquid system is the same as in Example 1 until the process ^^. As the second sub-disc without electric liters, it contains 0.111 moles / liter of sodium acid, 0.24 moles / liter / liter of sodium acetic acid, 0.26 moles / liter of sodium sodium fruit , 0.8 Mojina and 2 X 1 0-6 Moore / liter lead acetate and pH adjusted-7082-6219-PF (N2); Ahddub.t

第24頁 200530430 五、發明說明(21) '"'~ 整成為5者。將6公升之無電解鍍層液來加溫至^它而進行 建洛,在該浴,投入施加觸媒化處理之芯材粉體,進行授 拌及分散,開始進行鎳之還原反應。使用pH值自動調節裝 置,藉由5莫爾/公升之氳氧化納水溶液之添加而使得還原 反應中之液體之pH值,維持在5。此外,如果停止中途反、 應的話,則每次微量地加入2莫爾/公升之次亞磷酸鈉水溶 液而持績地進行反應。如果即使是加入次亞磷酸鈉水溶液 也不使得液體發泡的話,則停止全部之添加,過濾液體, 在對於過濾物來進行3次再漿體洗淨後,藉由丨丨〇它之真空 乾燥機而進行乾燥。藉此而得到具有鎳一磷合金鍍層用皮 膜之粉體。在藉由擴大倍率5〇〇〇〇倍之SEM而觀察所得到之 鍍^用粉體之鍍層用皮膜之剖面時,相同於圖2,在皮膜 尽又方白]面 看到瘤形狀之結晶粒界。該艘層用粉體 係藉由向來進行之無電解鍍層方式而製造,因此,混入微 細之鎳分解物而無法供應於實用上。 [比較例2 ] 使得相同於m施例1所得到之觸媒化處理後之芯材粉 體,成為2(H)耄升之漿體,在這個,攪拌及添加表丨所示之 (a),之初@期薄膜形成液而成為水性懸濁體。初期薄膜形成 液,加溫f 75 °C,液體量係1· 8公升。在漿體投入後,馬 上就看到氫之產生,確認初期薄膜形成之開始。在1分鐘 後,投入0· 0 6 3莫爾之次亞磷酸鈉,並且,還持續地進行工 分鐘之攪拌。在該水性懸濁體,分別以表丨所示之添加速 度而添加表1所示之(b)之含鎳離子液及(c)之含還原劑液Page 24 200530430 V. Description of Invention (21) '"' ~ It becomes five. 6 liters of electroless plating solution was heated to ^ it for Jianluo. In this bath, the core material powder subjected to the catalyst treatment was put into the mixture and dispersed, and the reduction reaction of nickel was started. An automatic pH adjustment device was used to maintain the pH of the liquid in the reduction reaction at 5 by the addition of a 5 mole / liter aqueous solution of tritium oxide. In addition, if the reaction is stopped halfway, a small amount of 2 moles / liter of a sodium hypophosphite aqueous solution is added in small amounts each time, and the reaction is performed continually. If the liquid does not foam even when the sodium hypophosphite aqueous solution is added, stop all the additions, filter the liquid, and after the slurry is washed three times with re-slurry, dry it under vacuum. Machine to dry. Thereby, a powder having a film for nickel-phosphorus alloy plating was obtained. When observing the cross section of the coating film of the coating powder obtained by SEM magnification of 50000 times, the cross section of the coating film was the same as that shown in FIG. Grain boundary. The powder for the ship layer is manufactured by the conventional electroless plating method. Therefore, it is impossible to supply it with practical use because it contains fine nickel decomposition products. [Comparative Example 2] The same core material powder after the catalytic treatment as obtained in Example 1 was made into a 2 (H) liter slurry. Here, (a ), At the beginning of the @phase film forming liquid and became an aqueous suspension. The initial film formation liquid was heated at f 75 ° C, and the liquid volume was 1.8 litres. After the slurry was put in, hydrogen was generated on the horse, and the start of the initial film formation was confirmed. One minute later, 0.063 moles of sodium hypophosphite was added, and stirring was continued for one minute. To this aqueous suspension, the nickel ion-containing liquid (b) and the reducing agent-containing liquid (c) shown in Table 1 were added at the addition rates shown in Table 丨, respectively.

7082-6219-PF(N2);Ahddub.ptd 第25頁 200530430 五、發明說明(22) 之2種液體。余加|里#係分別成為87〇毫升。在2種液體之添 加後,馬上就看到氫之產生,確認鍍層反應之開始。在結 束2種液體之气加±後’—直到氫之發泡停止為止,保持於 7 5 〇C之溫度,同日^持續地進行攪拌。接著,過濾水性懸 濁體,在對於過濾物來進行3次再漿體洗淨後,.藉由11()。〇 燥!而進行?燥。藉此而得到具有鎳-填合金鑛 Η *、之米刀體。在藉由擴大倍率5 0 0 0 0倍之SEM而觀察所 得到之鍍層用粉體之鍍層用皮膜之剖面時,相同於圖2, 在皮膜之厚度方向剖面’看到瘤形狀之結晶粒[由鎳離 子之添加量所算出之鑛層肖㈣之厚度係0· 54 /z m。 [比較例3 ] 夕除了使用在比較例2所得到之鍍層用粉體3 3 g以外,其 餘係相同於實施例5,得到在鎳皮膜上形成金無電解電鍍、 層的鍍層用粉體。由金離子之添加量所算出之金電鍍芦x 厚度係0.025 /zm。 [性能評價] 就在實施例1〜1 2及比較例1〜3所得到之鍍層用粉體 而έ ’藉由以下之方法而測定體積固有電阻值,並且,評 價耐熱性。將這些結果,顯示在以下之表2。 σ [體積固有電阻值之測定] 在垂直豎立之内徑1 〇_之樹脂製圓筒内,加入鑛層用 粉末1· 0g,在施加10kg荷重之狀態下,測定上下電極間之 電阻,求出體積固有電阻值。 [鐘層用皮膜之耐熱性之評價]7082-6219-PF (N2); Ahddub.ptd Page 25 200530430 V. Description of the invention (22) 2 kinds of liquids.余 加 | 里 # are 8700 ml. Immediately after the addition of the two liquids, the generation of hydrogen was observed, and the start of the plating reaction was confirmed. After the end of the two liquids, the gas was added ±-until the foaming of hydrogen ceased, kept at a temperature of 750C, and stirring was continued on the same day. Next, the aqueous suspension was filtered, and the filtrate was washed three times with re-slurry, and then 11 () was used. 〇 Dry! And proceed? dry. Thereby, a rice cutter body having nickel-filled alloy ore Η *, was obtained. When observing the cross section of the coating film of the obtained powder for coating layer through an SEM with a magnification of 50000 times, the cross section of the coating film was the same as that shown in FIG. The thickness of the ore layer calculated from the amount of nickel ions was 0.54 / zm. [Comparative Example 3] Except that 3 3 g of the powder for plating layer obtained in Comparative Example 2 was used, the remainder was the same as in Example 5 to obtain a powder for plating layer in which gold electroless plating and a layer were formed on a nickel film. The gold plating reed x thickness calculated from the amount of gold ions added was 0.025 / zm. [Performance evaluation] The powders for plating layers obtained in Examples 1 to 12 and Comparative Examples 1 to 3 were used to measure the volume specific resistance value by the following method and evaluate the heat resistance. These results are shown in Table 2 below. σ [Measurement of volume specific resistance value] In a resin cylinder with an inner diameter of 1 〇_ standing vertically, add 1.0 g of powder for the mineral layer, and measure the resistance between the upper and lower electrodes under a load of 10 kg. The volume inherent resistance value. [Evaluation of Heat Resistance of Film for Bell Layer]

200530430 五、發明說明(23) 在2 0 0 °C之氧化性氣氛下,將鍍層用粉末分別保存2 4 小時、4 8小時、7 2小時、9 6小時及1 2 0小時。就保存後之 鍍層用粉體而言,藉由前述方法而測定體積固有電阻值, 以該電阻值作為耐熱性之尺度。 陵1】200530430 V. Description of the invention (23) Under the oxidizing atmosphere at 200 ° C, the coating powder is stored for 24 hours, 48 hours, 72 hours, 96 hours, and 120 hours, respectively. For the powder for plating after storage, the volume specific resistance was measured by the method described above, and the resistance was used as a measure of heat resistance. Tomb 1

W (a)初期薄膜形成液 (mol/l) (b)含錶離子液 (mol/l) (b)含還原劑液 (mol/l) 添加速度 ml/min 具有胺基之錯化劑濃度 mol/l 宜施例1 甘胺酸 硫酸鎳 次亞磷酸鈉 0.27 0.013 0.032 甘胺酸 硫酸鎳 0.54 0.86 次亞磷酸鈉 S氧化鈉 2.57 2.6 7 0.27 寅施例2 乙烯二胺 硫酸鎳 次亞磷酸鈉 0.33 0.013 0.032 乙烯二胺 硫酸錄 0.66 0.86 次亞磷酸鈉 氫氧化鈉 2.57 2.6 7 0.33 音施例3 甘胺酸 画石酸鈉 硫酸鎳 次亞磷酸鈉 0.27 0.087 0.013 0.032 甘胺酸 圈石酸鈉 硫酸鎳 0.54 0.17 0.86 次亞磷酸鈉 氫氧化鈉 2.57 2.6 7 0.27 宜施例4 甘胺酸 硫酸餽 次亞磷酸鈉 2.0 0.013 0.032 甘胺酸 碲酸鎳 4.0 0.86 次亞磷酸鈉 氫氧化鈉 2.57 2.6 7 2.00 寳施例9 甘胺酸 硫酸鎳 次亞璘酸鈉 0.27 0.0086 0.021 甘胺酸 硫酸鎳 0.54 0.86 次亞磷酸鈉 氧氧化鈉 2.57 2.6 3 0.27 ί 0.30 亩施例11 甘胺酸 te酸鎳 次亞磷酸鈉 0.27 0.0086 0.021 甘胺酸 硫酸鎳 0.54 0.86 次亞磷酸鈉 氣氧化鈉 2.57 2.6 3 0.27 1 0.30 比較例2 硫酸鎳 次亞璘酸鈉 0.013 0.032 硫酸鎳 0.86 次亞磷酸鈉 2.57 7 — #W (a) Initial film-forming solution (mol / l) (b) Epidemic-containing liquid (mol / l) (b) Reducing agent-containing liquid (mol / l) Adding speed ml / min Concentration of an ammonium-containing modifier mol / l Preferable Example 1 Sodium nickel glycine sulfate hypophosphite 0.27 0.013 0.032 Nickel glycine sulfate 0.54 0.86 Sodium hypophosphite S sodium oxide 2.57 2.6 7 0.27 Example 2 Ethylene diamine nickel sulfate hypophosphite 0.33 0.013 0.032 Ethylene diamine sulfuric acid 0.66 0.86 sodium hypophosphite sodium hydroxide 2.57 2.6 7 0.33 tone example 3 sodium glycine picronate sodium nickel hyposulfite sodium 0.27 0.087 0.013 0.032 Nickel 0.54 0.17 0.86 Sodium hypophosphite sodium hydroxide 2.57 2.6 7 0.27 Expedient Example 4 Glycine sulfuric acid fed sodium hypophosphite 2.0 0.013 0.032 Nickel tellurate glycine 4.0 0.86 Sodium hypophosphite sodium hydroxide 2.57 2.6 7 2.00 Bao Shi Example 9 Nickel Glycine Sulfate Sodium Hypophosphite 0.27 0.0086 0.021 Nickel Glycine Sulfate 0.54 0.86 Sodium Hypophosphite Sodium Oxide Oxide 2.57 2.6 3 0.27 ί 0.30 Mu Example 11 Nickel Glycine Teteophosphite Sodium 0.27 0.0086 0.021 Nickel Glycine Sulfate 0.54 0.86 Phosphorous acid Sodium vapor sodium oxide 3 2.57 2.6 0.27 1 0.30 Comparative Example 2 Nickel sulfate, sodium lin hyposulfurous nickel sulfate 0.013 0.032 0.86 2.57 sodium hypophosphite 7-- #

7082-6219-PF(N2);Ahddub.ptd 第27頁 200530430 五、發明說明(24) 【表2】 體積固有電阻値(πιΩ cm) 電鍍後 24小時後 4日小時後 72小時後 96小時後 120小時後 寶施例1 24 59 66 95 92 91 實施例2 19 32 50 78 9D 93 實施例3 24 48 63 85 89 98 實施例4 20 50 70 84 90 101 寳施例5 4.5 4.8 4.9 5.2 4.6 6.3 實施例6 3.2 5 5.5 5.4 5.6 5.9 實施例7 4.2 5.2 5.2 5.3 6 6 寳施例8 3.8 4.9 5 5.3 5.9 6.3 實施例9 45 56 58 74 94 110 實施例10 2.2 4.1 5.8 9 10 10 實施例11 42 60 63 88 98 105 實施例12 4.3 4.2 8.8 10 11 10 比較例1 無法測定本 無法測定* 無法測定* 無法測定* 無法測定* 無法測定> 比較例2 48 30000 100000以上 100000以上 100000以上 10000D以上 比較例3 4.2 1200 23000 10000D以上 100000以上 1000DG以上 厂混入微糸 田之鎳分解1 匆,無法供應於測定上。7082-6219-PF (N2); Ahddub.ptd Page 27 200530430 V. Description of the invention (24) [Table 2] Volume specific resistance 値 (π Ω cm) 24 hours after plating 4 hours after 4 hours 72 hours after 96 hours 120 hours later, Bao Shi 1 24 59 66 95 92 91 Example 2 19 32 50 78 9D 93 Example 3 24 48 63 85 89 98 Example 4 20 50 70 84 90 101 Bao Shi 5 4.5 4.8 4.9 5.2 4.6 6.3 Example 6 3.2 5 5.5 5.5 5.4 5.6 5.9 Example 7 4.2 5.2 5.2 5.3 5.3 6 6 Baoshi Example 8 3.8 4.9 5 5.3 5.9 6.3 Example 9 45 56 58 74 94 110 Example 10 2.2 4.1 5.8 9 10 10 Example 11 42 60 63 88 98 105 Example 12 4.3 4.2 8.8 10 11 10 Comparative Example 1 Unable to measure. Unable to measure. * Unable to measure. * Unable to measure. * Unable to measure. * Unable to measure. Example 3 4.2 1200 23000 Nickel over 10000D and above 100,000 and 1000DG and above. Nickel disintegrated into Micro Putian 1 is unavailable for measurement.

W 由表2所示之結果而明白地得知:各個實施例之鑛層 用粉末(本發明品)係電阻非常低,並且,即使是長時間地 保存於高溫,也使得電阻之增加變小,财熱性非常高。相 對於這個,得知:比較例之鍍層用粉末係電阻低,由於長 時間之保存而使得電阻增加,耐熱性變低。W It is clear from the results shown in Table 2 that the powder for the mineral layer (product of the present invention) of each example has a very low resistance, and even if it is stored at high temperature for a long time, the increase in resistance is small. The financial heat is very high. Contrary to this, it was found that the powder for the plating layer of the comparative example had low resistance, increased resistance due to long-term storage, and low heat resistance.

【發明效果】 以上,正如所詳細敘述的,如果藉由本發明的話,則 提高導電性無電解鍍層用粉體之耐熱性,即使是長時間地 保存於高溫,也使得電阻之增加變小。[Effects of the Invention] As described in detail above, according to the present invention, the heat resistance of the powder for conductive electroless plating is improved, and even if it is stored at high temperature for a long time, the increase in resistance is reduced.

7082-6219-PF(N2);Ahddub.ptd 第28頁 200530430 圖式簡單說明 圖1係顯示本發明之導電性無電解鍍層用粉體之鍍層 用皮膜之剖面之某一例子之掃描型電子顯微鏡相片。 圖2係顯示習知之導電性無電解鍍層用粉體之鍍層用 皮膜之剖面之某一例子之掃描型電子顯微鏡相片。 #7082-6219-PF (N2); Ahddub.ptd Page 28 200530430 Brief Description of Drawings Figure 1 is a scanning electron microscope showing an example of a section of a coating film for a coating of a powder for conductive electroless plating of the present invention photo. Fig. 2 is a scanning electron microscope photograph showing an example of a cross-section of a coating film for a conventional electroless plating powder. #

7082-6219-PF(N2);Ahddub.ptd 第29頁7082-6219-PF (N2); Ahddub.ptd Page 29

Claims (1)

200530430 六、中請專利範圍 一 1 · -種導電性無電解鍍層用粉體,在 上藉由無電解鍍層法而形成鎳皮膜, "’之表面 其特徵在於: ' 前述鎳皮膜中之粉乳#、 方向。 1係以該鎳皮膜為主而定向於厚度 2 ·如申請專利範圍第 體,其巾,在最表面m導電性無電解鍍層用粉 3· -種導電性無電解無電解電鑛層。 解鍍·層用粉體之制;生方、、在丨1 請專利範圍第1項所述之導 餸之衣k方去,製造申 其特徵在於:之導電性無電解鑛層用粉體, 在藉由具有貴金屬雜 貴金屬離子之捕捉能之前 +捉旎或表面處理而在賦予 後,還原這個,心粉體來捕捉貴金屬離子 面,接著,將該芯材粉體二呷乃? 2於前述芯材粉體之表 劑及由胺化合物所構成之a於包含鎳離子、還原 .—々Γ y 、 體之表面,形成鎳之初期薄膜,麸 後,在已3形成該初期薄膜之該芯材粉體及該錯合: 性懸濁體’個別且同時地將含有同種於該錯合劑:二 子液及含還原劑液之2種液體予以添加,進曰 订無電解鍍層反應。 ^ 4 ·如申清專利範圍第3項之導電性無電解鑛層用粉體 之製造方法,#中,在包含前述芯材粉體之水性懸濁體來 添加前述含鎳離子液及前述含還原劑液之過程,調整該含 鎳離子液及該含還原劑液之添加量或該水性懸濁體中^該200530430 VI. Patent application range 1 ·-A kind of powder for conductive electroless plating is formed on the nickel film by electroless plating method. The surface of "" 'is characterized by:' The powder milk in the aforementioned nickel film #, Direction. 1 is mainly based on the nickel film and is oriented in thickness. 2 · As in the scope of the patent application, the towel has m conductive powder for electroless plating on the outermost surface. 3 · A kind of conductive electroless electroless plating layer. The production of powders for deplating and layering; the raw materials are described in item 1 of the patent scope, and the manufacturing process is characterized by: the powder for conductive electroless ore layer Before the capture energy of the precious metal ions with noble metal ions is added + capture or surface treatment and after the application, reduce this, the heart powder to capture the noble metal ion surface, and then, the core material powder 呷? 2 On the surface of the aforementioned core material powder and a made of amine compound, a is formed on the surface of the body containing nickel ions and reduced. 々Γ y, the initial film of nickel is formed, and after the bran, the initial film is formed 3 The core material powder and the complex: The sexual suspensions are added individually and simultaneously to two kinds of liquids containing the same kind of complexing agent: two sub-liquids and a reducing agent-containing liquid, and the electroless plating reaction is added. ^ 4 As described in the method for manufacturing a powder for conductive electroless ore layer in item 3 of the patent application, in #, the aforementioned nickel-containing ion-containing liquid and the aforementioned containing are added to an aqueous suspension containing the aforementioned core material powder. In the process of the reducing agent liquid, adjust the addition amount of the nickel ion-containing liquid and the reducing agent-containing liquid or the aqueous suspension ^ 200530430 六、申請專利範圍 錯合劑之初期濃度或者是該含鎳離子液中之該錯合劑之濃 度,而使得該水性懸濁體中之前述錯合劑之濃度保持在〇 · 003〜10莫爾/公升之範圍。 5. 如申請專利範圍第3或4項之導電性無電解鍵層用粉 體之製造方法,其中,前述錯合劑係甘胺酸或乙烯二胺。 6. 如申請專利範圍第3至5項中任一項之導電性無電解 鍍層用粉體之製造方法,其中,在包含前述芯材粉體之水 性懸濁體來添加前述含鎳離子液及前述含還原劑液前之該 水性懸濁體所包含之該芯材粉體之表面積總合相對於該水 性懸濁體之體積之比例係0 . 1〜1 5 m2 /公升。200530430 6. The initial concentration of the complexing agent in the scope of patent application or the concentration of the complexing agent in the nickel-containing ion solution, so that the concentration of the aforementioned complexing agent in the aqueous suspension is maintained at 0.003 ~ 10 Moore / Range of liters. 5. The method for producing a powder for a conductive electroless bond layer according to item 3 or 4 of the scope of patent application, wherein the aforementioned complexing agent is glycine or ethylenediamine. 6. The method for producing a powder for conductive electroless plating according to any one of claims 3 to 5, wherein the aforementioned nickel ion-containing liquid and the aqueous suspension containing the aforementioned core material powder are added to The ratio of the total surface area of the core material powder contained in the aqueous suspension before the reducing agent-containing liquid to the volume of the aqueous suspension is 0.1 to 15 m 2 / liter. 7082-6219-PF(N2);Ahddub.ptd 第31頁7082-6219-PF (N2); Ahddub.ptd p. 31
TW93106631A 2004-03-12 2004-03-12 Conductive electrolessly plated powder and method for making the same TW200530430A (en)

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