200524108 五、發明說明（1) 發明所屬之技術領域： 本發明係有關於一種晶圓承栽農置，特別係有關於一 種可使用於氣相沈積設備之晶圓承栽裝置。 先前技術： Φ 目前氣相沈積設備，例如物理氣相沈積設備，係利用 電漿對金屬靶進行轟擊，以使金屬材料濺鍍於晶片之上。 然而，在沈積過程之中，金屬粒子不會僅沈積於晶片表 面，亦會沈積於物理氣相沈積設備的其他零件之上，例如 晶圓承載裝置的覆蓋環，便為一極易被金屬粒子污染的零 件。因此，每隔一段時間，覆蓋環便需要被清理，以維持 物理氣相沈積的品質。 覆蓋環通常利用化學溶劑以及噴砂的方式進行清理。 喷砂係利用氣體將砂高速吹過覆蓋環表面，以刮除覆蓋環 表面的污染物。然而，在去除污染物的過程中，覆蓋環本 身的材料也一樣會被消耗。因此，在經過數次噴砂清潔之 後，覆蓋環較薄的部分常會被磨穿，而致使覆蓋環不堪使 用〇 發明内容： 本發明提供之一種晶圓承載裝置及其組件。 本發明之覆蓋環設計’使該覆蓋環得於清理過程中， 例如化學溶劑以及噴砂的方式進行清理，減緩或免於因材 料之消耗而導致之裝置使用壽命降低。 本發明之覆蓋環設計可延長其使用壽命，因而節省設 備耗材的支出。200524108 V. Description of the invention (1) The technical field to which the invention belongs: The present invention relates to a wafer-bearing farm, and particularly relates to a wafer-bearing device that can be used for vapor deposition equipment. Prior technology: Φ Current vapor deposition equipment, such as physical vapor deposition equipment, uses a plasma to bombard a metal target to sputter metal materials onto the wafer. However, during the deposition process, metal particles are not only deposited on the surface of the wafer, but also on other parts of the physical vapor deposition equipment, such as the cover ring of the wafer carrier. Contaminated parts. Therefore, at regular intervals, the cover ring needs to be cleaned to maintain the quality of physical vapor deposition. Covering rings are usually cleaned using chemical solvents and sandblasting. Sand blasting uses gas to blow sand at a high speed across the surface of the cover ring to scrape off contaminants from the surface of the cover ring. However, in the process of removing contaminants, the material covering the ring itself is also consumed. Therefore, after several blast cleanings, the thinner part of the cover ring is often worn through, making the cover ring unusable. SUMMARY OF THE INVENTION The present invention provides a wafer carrying device and its components. The design of the cover ring of the present invention allows the cover ring to be cleaned during the cleaning process, such as chemical solvents and sand blasting, to slow down or avoid the reduction of the service life of the device caused by the consumption of materials. The design of the covering ring of the present invention can prolong its service life, thereby saving the expense of equipment consumables.
0467-A40153TWF(η);920008;\ 2005241080467-A40153TWF (η); 920008; \ 200524108
並定義於申請專利範圍内。 本發明將欽述如後 實施方式： 本發明係-種支樓結構。一些實施例係如第ι圖所顯 :的。在該實施例中’纟可用於晶圓承載。在 實施It is defined in the scope of patent application. The present invention will be described later. Embodiments: The present invention is a kind of branch structure. Some embodiments are as shown in FIG. In this embodiment, '纟 can be used for wafer loading. Implemented
中’本發明之晶圓承載裝置100至少包括一晶座心」 些貫施例中，本發明之晶圓承載裝置丨〇 〇至少包括一榨 座120及-覆蓋環130。在一些實施例中，本發明之晶圓承 載裝置100至少包括一壓接環丨40、一壓接環支撐模組15〇 以及一外遮罩160。支撐座120用以支撐晶座11〇的邊緣。 在一些貫施例中，覆蓋環1 3 〇設於該支撐座丨2 〇之上， 其可用以遮播粒子或有其他必要之作用。覆蓋環亦利用支 撐座120支撐。 在一些實施例中，壓接環1 4 〇設於覆蓋環1 3 0之上，其 亦可用以阻擋粒子。壓接環支撐模組丨5 〇設於壓接環丨4 〇之 下’以支撐壓接環1 4 0。外遮罩1 6 〇設於壓接環1 4 0壓接環 支撐模組1 5 0外側，其亦可用以遮檔粒子。 參照第2 a圖’其係顯示本發明之一些實施例之晶座 110、支撐座120以及覆蓋環130的詳細結構。 在一些實施例中，在支撐座120上至少具有一支撐座 主體121、一墊片123以及一個或數個固定件122。 在一些實施例中，墊片123利用固定件122固定於支撐 座主體121之上。 參照第2 b圖，其係顯示本發明之一些實施例之塾片 1 2 3以及固定件1 2 2的詳細結構。The wafer carrying device 100 of the present invention includes at least a wafer core. In some embodiments, the wafer carrying device of the present invention includes at least a pressing seat 120 and a cover ring 130. In some embodiments, the wafer carrier device 100 of the present invention includes at least a crimp ring 40, a crimp ring support module 15, and an outer cover 160. The support base 120 is used to support the edge of the crystal base 110. In some embodiments, the cover ring 130 is disposed on the support seat 200, which can be used to cover particles or have other necessary functions. The cover ring is also supported by a support 120. In some embodiments, the crimping ring 140 is disposed on the covering ring 130, which can also be used to block particles. The crimp ring support module 丨 50 is provided below the crimp ring 丨 4 ′ to support the crimp ring 1400. The outer cover 160 is provided on the outer side of the crimping ring 140 crimping ring supporting module 150, and it can also be used to block particles. Referring to Fig. 2a ', a detailed structure of the crystal base 110, the support base 120, and the cover ring 130 according to some embodiments of the present invention is shown. In some embodiments, the support base 120 has at least one support base body 121, a washer 123, and one or more fixing members 122. In some embodiments, the gasket 123 is fixed on the support base body 121 by a fixing member 122. Referring to FIG. 2b, a detailed structure of the cymbal 1 2 3 and the fixing member 1 2 2 according to some embodiments of the present invention is shown.
0467 -A401531^( η); 920008; HEARTA. p td0467 -A401531 ^ (η); 920008; HEARTA. P td
200524108 五、發明說明（3) 在-些實施例中，固定件122可以為螺检。在— 施例中，固=件122可以為黎頭式螺栓（pi〇w b〇it)。二貝 在-些貫施例中’墊片123上形成有開口124 此 實施例中’整片123上之開口124係呈錐形。 二 在-些實施例中，當固定件122固定墊片123時， 部m可完全_收容於開口 124之中（如第2c圖所顯示的）: 在一些貫轭例中，，參照第2d圖，端部丨25可部分突 出於墊片1 23表面。在一些實施例中，其突出高度d小於工 公釐。 再回到第2a圖，在一些實施例中，此晶圓承載裝置可_ 更包括一熱感測元件（未圖示），設於墊片123與支撐座主 體1 2 1之間，其可用以監測物理氣相沈積時的反應溫度。 參照第3 a圖’其係為本發明之一些實施例之覆蓋環 130於第2a圖中的A方向視圖。第3a圖顯示覆蓋環130的一 端至少具有^一配合部131。在一些實施例中，覆蓋環於 此配合部1 3 1的厚度可厚達4公釐以上。在一些實施例中， 覆蓋環1 3 0的一端至少具有溝槽丨3 2。在一些實施例中，配 合部131設於覆蓋環130 —端表面之相應於固定件122的位 置。 在一些實施例中，溝槽1 3 2與配合部1 3 1相接。 ® 在一些實施例中，第3a圖中之B部分放大圖如第3b圖 所顯示的，配合部1 3 1為一凹槽，其可用以容納該固定件 122突出於該墊片123表面的端部U5。 人 如此，配合部可承受較多次的喷砂清潔程序而不至於200524108 V. Description of the invention (3) In some embodiments, the fixing member 122 may be a screw inspection. In the embodiment, the solid piece 122 may be a piow bolt. In some embodiments, the opening 124 is formed on the 'shim 123. In this embodiment, the opening 124 on the entire sheet 123 is tapered. In some embodiments, when the fixing member 122 fixes the gasket 123, the portion m can be completely received in the opening 124 (as shown in FIG. 2c): In some examples of yoke, refer to 2d In the figure, the end portion 25 may partially protrude from the surface of the gasket 1 23. In some embodiments, its protruding height d is less than one millimeter. Returning to FIG. 2a, in some embodiments, the wafer carrying device may further include a thermal sensing element (not shown), which is disposed between the spacer 123 and the support base body 1 2 1 and may be used. To monitor the reaction temperature during physical vapor deposition. Referring to Fig. 3a ', it is a view of the covering ring 130 of Fig. 2a according to some embodiments of the present invention. Figure 3a shows that one end of the cover ring 130 has at least one mating portion 131. In some embodiments, the thickness of the covering ring 1 3 1 at this mating portion may be more than 4 mm. In some embodiments, one end of the cover ring 130 has at least a groove 32. In some embodiments, the mating portion 131 is provided on the end surface of the cover ring 130 at a position corresponding to the fixing member 122. In some embodiments, the groove 1 3 2 is in contact with the mating portion 1 3 1. ® In some embodiments, the enlarged view of part B in FIG. 3a is as shown in FIG. 3b. The mating portion 1 31 is a groove that can be used to receive the fixing member 122 protruding from the surface of the gasket 123.端 部 U5。 End U5. In this way, the mating part can withstand multiple blast cleaning procedures without
0467-A40153TWF(n);920008;HEARTA.ptd 200524108 五、發明說明（4) 被磨穿。 在一些實施例中，本發明之覆蓋環130其組成材質可 包括不錄鋼。 在一些實施例中，本發明之覆蓋環1 3 〇其組成材質可 包括非磁性材料。 參照第4圖，當一晶圓2 00置於該晶座11〇之上時，晶 座110支撐晶圓200。晶座11〇位於支撐座120之上，並部分 由支撐座120支撐。覆蓋環130設於該支撐座12〇之上用以 遮槽粒子。壓接環140設於覆蓋環130之上，以阻擋粒子。 壓接環支撐模組150設於壓接環丨4〇之下，以支撐壓接環 140。外遮罩160設於壓接環丨4〇壓接環支撐模組丨5〇外側， 亦用以遮檔粒子。 當進行物理氣相沈積時，上述之晶圓200置於該晶座 11 0之上，以蒸鍍的方式或濺鍍的方式進行沈積。 本發明之晶圓承載裝置100，其覆蓋環130可容 較多次喷砂清潔程序，因而其使用壽命較長，; 環130Λ\種價格Λ昂的耗材，因此本發明可有效節省成 本，提南製秋的競爭力。0467-A40153TWF (n); 920008; HEARTA.ptd 200524108 V. Description of the invention (4) Worn through. In some embodiments, the material of the cover ring 130 of the present invention may include non-recorded steel. In some embodiments, the cover ring 130 of the present invention may include a non-magnetic material. Referring to FIG. 4, when a wafer 200 is placed on the wafer 110, the wafer 110 supports the wafer 200. The wafer base 110 is located above the support base 120 and is partially supported by the support base 120. The cover ring 130 is disposed on the support base 120 to shield the groove particles. The crimping ring 140 is disposed on the covering ring 130 to block particles. The crimp ring support module 150 is disposed below the crimp ring 415 to support the crimp ring 140. The outer cover 160 is provided on the outer side of the crimping ring 4o crimping ring support module 5o, and is also used to block particles. When performing physical vapor deposition, the wafer 200 described above is placed on the wafer base 110, and is deposited by evaporation or sputtering. In the wafer carrying device 100 of the present invention, the covering ring 130 can accommodate multiple blast cleaning procedures, and thus has a long service life. The ring 130 is a kind of consumables with a high price, so the present invention can effectively save costs and improve Competitiveness of Southern System Autumn.
雖然f發：已揭露如上，然其並非用以限定本發明 接、奋a夕堪刑甘r不—定為橢圓或圓，其可為任何_ 種適當之構型，其取決於 17 為例示性而用於說明之方】用者之而要，或圖不之尺度{ 沉積設備，其他的材料加更’或是所使用之場所並非僅方 件之材料亦是可選擇的1f設備亦可採用本發明；或各矣 任何熟習此項技藝者，在不脫离Although f hair: has been disclosed as above, but it is not used to limit the present invention, it can be used as an ellipse or circle, it can be any appropriate configuration, which depends on 17 as an example For the purpose of explanation] It is required by the user, or the scale of the picture {deposition equipment, other materials plus more ', or the place used is not only square materials, but also optional 1f equipment. Adopt the invention; or any person skilled in the art, without departing
200524108 五、發明說明（5) 本發明之精神和範圍内，仍可作些許的更動與潤飾，因此 本發明之保護範圍當視後附之申請專利範圍所界定者為 準。 0467-A40153TWF(η);920008;HEARTA.p td 第9頁 200524108 圊式簡單說明 第1圖係顯示本發明之一餘 拔· 只轭例之晶圓承 部結構； 第2丨 要結構； 第2a圖係顯示本發明之—實施例之晶圓承 形； 第2b圖係顯示塾片以及固定件之構 第2c圖係顯示固定件端部完全收容於墊片 栽數置的外 栽裝置之主 之開 第2d圖係顯示固定件端部部分突 形； 、纪月之開第3a圖係顯示第2a圖中之A方向視圖； 第3b圖係顯示第3a圖中之B部分放大圖； 之情 之情 一晶圓。 符號說明： 100〜 晶圓承栽裝 110〜 晶座 120〜 支撐座 121〜 支撑座主H 122〜 固定件 123〜 墊片 124〜 開口 125〜 端部 130〜 覆蓋環 栽200524108 V. Description of the invention (5) Within the spirit and scope of the present invention, some modifications and retouching can still be made. Therefore, the scope of protection of the present invention shall be defined by the scope of the attached patent application. 0467-A40153TWF (η); 920008; HEARTA.p td Page 9 200524108 Simple description of the formula Figure 1 shows the structure of the wafer receiving part of one of the present invention's pull-and-yoke example; Figure 2a shows the wafer shape of the embodiment of the present invention; Figure 2b shows the structure of the cymbal and the fixing member; Figure 2c shows the end of the fixing member completely accommodated in the external device of the spacer Figure 2d of the main opening shows the protruding part of the end of the fixture; Figure 3a of the opening of the month shows a view in the direction A of Figure 2a; Figure 3b shows an enlarged view of the portion B in Figure 3a; The feeling of love is a wafer. Explanation of symbols: 100 ~ wafer loading 110 ~ wafer base 120 ~ support base 121 ~ support base main H 122 ~ fixture 123 ~ gasket 124 ~ opening 125 ~ end 130 ~ cover ring
200524108 圊式簡單說明 131〜 配合部 132〜 溝槽 140〜 壓接環 150〜 壓接環支撐模組 160〜 外遮罩 200〜 晶圓 IHii 0467 - A40153TW( n); 920008; HEARTA. p t d 第11頁200524108 Simple description 131 ~ Mating section 132 ~ Groove 140 ~ Crimp ring 150 ~ Crimp ring support module 160 ~ Outer cover 200 ~ Wafer IHii 0467-A40153TW (n); 920008; HEARTA. Ptd 11th page