200522759 九、發明說明： 【發明所屬之技術領域】 本專利係關於麥克風，且更明確地說，係關於用於通信 裝置、音訊裝置或其類似裝置中之高性能電介體麥克風及 其製造方法。 【先前技術】 近年來，行動通信技術發展迅速。消費者愈來愈多地使 用行動通信裝置，諸如蜂巢式電話、網頁啓用蜂巢式電話、 個人數位助理（PDA)、掌上型電腦、膝上型電腦、平板電腦 (tablet)及其他可藉由公衆或私人通信網路進行通信之裝 置。蜂巢式網路之擴展及行動通信之技術進步已促使了更 多消費者使用行動通信裝置。對通信裝置增長之需求驅動 了併入行動通彳§裝置中之音訊元件之製造方法、功率消 耗、接收、製造及小型化之改良。行動通信裝置供應商之 間的競爭壓力增加了對更小、更低廉且更好執行之小型電 容式麥克風的需求。 大體而言，各種習知電介體電容式麥克風（”ECM，，）已用於 通信裝置。先前技術之ECM包括一防塵罩、一具有聲蜂之 外殼、一振動膜、一間隔器、一絕緣本體、一後擋蓋組件、 一導電環及一印刷電路板（，，PCB”）。該振動膜組件與該後擔 蓋組件組成一藉由對應於間隔器厚度之聲埠而耦合之對聲 壓級變化作出回應之可變電容器部分。 因為ECM之尺寸減小，所以有限之空間可用於容納絕緣 本體及導電環，導致電容器部分與PCB之間的干擾增加。 93414.doc 200522759200522759 IX. Description of the invention: [Technical field to which the invention belongs] This patent relates to a microphone, and more specifically, to a high-performance dielectric microphone used in a communication device, an audio device or the like, and a manufacturing method thereof . [Previous Technology] In recent years, mobile communication technology has developed rapidly. Consumers are increasingly using mobile communication devices, such as cellular phones, web-enabled cellular phones, personal digital assistants (PDAs), palmtops, laptops, tablets, and others through the public Or a private communications network. The expansion of cellular networks and technological advances in mobile communications have led to more consumers using mobile communications devices. The growing demand for communication devices has driven improvements in manufacturing methods, power consumption, reception, manufacturing, and miniaturization of audio components incorporated in mobile communications devices. Competitive pressure among mobile communication device vendors has increased the demand for smaller, cheaper and better performing small condenser microphones. Broadly speaking, various conventional dielectric condenser microphones ("ECM ,,") have been used in communication devices. The ECM of the prior art includes a dust cover, a housing with a horn bee, a vibration membrane, a spacer, a An insulating body, a rear cover assembly, a conductive ring, and a printed circuit board (,, PCB "). The diaphragm member and the rear cover member constitute a variable capacitor portion which is coupled to a sound pressure level change by an acoustic port corresponding to the thickness of the spacer. Because the size of the ECM is reduced, the limited space can be used to accommodate the insulating body and conductive ring, resulting in increased interference between the capacitor section and the PCB. 93414.doc 200522759
除追求小型化料，反復的撞擊與㈣久而久之可對ECM 之聲性能產生有害的影響。 【發明内容】 -種電介體麥克風，其包括··一外殼，其具有一形成 :其一壁内之聲埠；-振動膜組件，其導電且與該外殼 電耦合，該振動膜組件鄰近於該壁；一絕緣間隔器，其 鄰近於該振動膜、位於該振動膜之與該聲埠相對之一側 上，一後擋蓋組件，該後擋蓋組件具有一自一外圓周徑 向延伸之突起部，該後擋蓋與該絕緣間隔器接觸；一本 體組件，該本體組件由塑膠模製，具有一第一端及一第 一端，該本體組件被調適成嵌入於該外殼中且呈中空， 具有一被調適成容納該後擋蓋組件之内部周邊，該本體 組件進一步包括：一導電支架，其安置於該本體組件内， 該導電支架具有一第一端及一第二端，該導電支架藉由 該本體組件之一外圓周而與該外殼電絕緣，該導電支架 之該第一端安置於用於與該後擋蓋組件電耦合之該本體 組件之該中空部分内，該導電支架之該第二端延伸至該 本體組件之該第二端；及一印刷電路板，其被調適成與 該本體組件之該第二端相耦合，該印刷電路板具有一第 表面及弟一表面，其中該第一表面與該導電支架之 該第二端電耦合，且該第二表面與該外殼耦合，藉以在 該外殼之一内圓周與該後擋蓋組件之一外圓周之間的該 突起部之該等側處形成一聲通路，該聲通路允許由該振 動膜回應耦合入該聲埠中之聲能量之移動所引起之空氣 93414.doc 200522759 流動。 【實施方式】 雖然本發明容許各種修改及替代形式，但是在圖式中舉 例展示了確定實施例，且在本文中將詳細描述該等實： 例。然而’應瞭解到，本揭示内容不應將本發明限制於所 述之特定形式，相反地，本發明意欲涵蓋屬於由隨附申請 專利範圍所界定之本發明之精神及範疇的所有修改、替代 及均等物。 圖1係一電容式麥克風100之分解圖，該電容式麥克風實 際上可用於任何類型之通信裝置，諸如可藉由一或多個公 衆或私人通信網路進行通信之蜂巢式電話、網頁啓用蜂巢 式電話、個人數位助理（PDA)、掌上型電腦、其他類型之攜 帶型計算及網際網路存取電氣設備與裝置及其類似物。^ 克風100可包含一具有上表面部分11〇及側壁部分112之杯 形外殼108。在替代實施例中，外殼1〇8可採取各種其他形 狀之形式（諸如矩形、D形或梯形）且具有許多不同之尺寸。 外殼之側壁部分112終端位於連接表面114處，界定了一開 口 116。最初可形成具有一向外的張開部之連接表面丨14， 以使在外殼108内可置放其他元件。 當將所有元件以最終或封閉位置置放於外殼1〇8内時，將 連接表面m向開口 116之中心徑向地彎曲或再形成。此形 成操作藉由連接表面114機械地俘獲PCB 164的後表面 168’將其他元件鎖定在合適位置以及電連接pcB 164之後 表面168。所示之外殼108具有至少一層。然而，外殼ι〇8可 93414.doc 200522759 由導電材料及非導電材料之交替層製造，或一非導電基板 可具有塗覆在裏面之導電塗層，其允許振動膜組件與 PCB 164之後表面168之電連接。在一實施例巾，外殼⑽ 係用鋁製造。 將至少一孔徑或聲埠118引入於外殼1〇8之上表面ιι〇 上，以允許將聲波傳送至振動膜組件12〇。聲埠ii8可以任 何合適之方式形成，諸如鑽孔、衝壓或模製。聲埠US允許 對應於聲壓級變化之聲能量進入外殼丨〇 8。 防塵罩102具有對應於外殼1〇8之形狀的形狀，但其可採 取未必對應於該外殼形狀之各種形狀，且可具有許多不同 之尺寸。在一實施例中，所示之防塵罩1〇2具有對應於環狀 外殼108之環狀形狀。該防塵罩可由布或錄來製造，其具 $第一表面104及第二表面1〇6。防塵罩1〇2之第二表面1〇6 藉由黏著劑而附著於外殼⑽以覆蓋聲埠118。以此方式有 助於防止#屬進入麥克風i⑼而損壞安置於外殼⑽内之電 子元件170。防塵罩1〇2亦可改良頻率回應、引起延遲並提 供指向性回應。 >克几100可進一步包含一振動膜組件。振動膜組件 12〇包含-支撐環122及—附著於該支撐環122上之振動膜 124振動膜組件12〇具有一大致對應於外殼⑽之形狀，但 了在不同μ ^例中可&取各種形狀之形式，且具有許多不 同之尺寸1撐％ 122可由例如不錄鋼之導電材料製造；然 而可利用任何導電材料或包含導電塗層（包含黃銅或錫） 之材料支撐壤122具有一第一表面126及一第二表面m 93414.doc 200522759 支撐％122之第-表面126與上表面11〇保持接觸，且第二表 面128與間益！ 34保持接角哥。振動膜124係由一可對聲波回 應而振動之導電材料製造。此—材料為—般在商標下 可購得之聚對苯二甲酸乙二δ旨膜。振動膜124具有—第一表 3〇及第一表面132。振動膜124之第一表面13〇藉由（例 如）用黏著劑結合而附著於支撐環122之第二表面。然 而，熟悉此項技術者或一般技術者將瞭解到，任何形式之 接口均足夠，包含壓縮或在邊緣處機械附著及其類似形 式藉由諸如鉻之導電材料層塗佈振動膜124之第二表面 U2，形成一電活性部分，其一般稱為活動電極，與間隔器 134保持接觸。 麥克風1〇〇可進一步包含一具有中空區域135及分別為 36與138之第一與第二表面之間隔器134，用於使振動膜組 件120與外殼108内之其他元件相隔離。間隔器134係由電絕 緣材料（例如200標準規格（gaUge)iMyiar塑膠）製造，其具 有間隔於振動膜組件120與後擋蓋組件14〇之間之厚度。間 隔裔1 34使振動膜124向後播蓋組件140偏斜。間隔器134可 具有未必對應於外殼形狀之各種形狀，且可具有許多不同 之尺寸。在一實施例中，所示之間隔器134具有對應於外殼 108之形狀的環狀形狀。間隔器134之厚度及材料可依應用 要求而改變。間隔器134置放於振動膜組件12〇與後擋蓋組 件140之間，且藉由連接表面1丨4在其於pcb 164上封閉後所 施加之機械壓力而將該間隔器i 34保持於合適之位置。間隔 器134之第一表面136與振動膜124之第二表面132保持接 93414.doc -10- 200522759 觸。間隔器134之第二表面138與後擋蓋組件丨4〇保持接觸， 且將振動膜組件120與後擔蓋組件14〇隔離。 麥克風100可進一步包含一後擋蓋組件14〇。所示之後擋 蓋組件140具有至少一突起部142及至少一緩衝區域（reUef SeCti〇n)144。然而，該後擋蓋組件可包含複數個突起部 142a-d及複數個緩衝部分144a_d，且對此實施例將作更詳細 之淪述。後擋蓋組件140藉由前述連接表面114之機械壓力 而置放於間隔器134之第二表面ι38與本體組件15〇之間。 麥克風1〇〇亦具有一本體組件150,其具有一中空區域152 及分別為154與156之上與下表面。本體組件15〇安置於外殼 1〇8内。本體組件150可被模製成不同形狀及尺寸以適合應 用之需要。在一實施例中，本體組件丨5〇呈圓柱體形狀，且 由例如模製聚乙烯塑膠之電絕緣材料製造。當組裝時，本 體組件150之第一表面154藉由前述連接表面之機械壓力而 與間隔器134之第二表面138保持接觸。本體組件15〇之第二 表面156形成有一定位突出構件16〇。定位突出構件16〇係設 计用以谷納PCB 164,以使後擋蓋組件14〇與pCB 164機械隔 離但電連接。如此，後擋蓋組件140與振動膜組件120之間 的間隔未受到外殼108内變形之影響。在一實例中，定位突 出構件160係由諸如不銹鋼之導電材料製造；然而，可利用 任何導電材料或包含導電塗層之材料。 麥克風100還進一步包含一安置於外殼1〇8内之印刷電路 板（PCB)164。PCB 164可與外殼108同軸排列。pCB 164具 有别表面I66及一後表面168。Ρ(3Β 164可以對應於外殼或 93414.doc 200522759In addition to the pursuit of miniaturization, repeated impacts and aging can have a detrimental effect on the sound performance of the ECM. [Summary of the Invention]-A dielectric microphone comprising a housing having a sound port formed in one wall thereof; a diaphragm assembly, which is conductive and electrically coupled with the housing, and the diaphragm assembly is adjacent At the wall; an insulating spacer adjacent to the vibrating membrane, located on the side of the vibrating membrane opposite to the sound port, a rear cover assembly, the rear cover assembly has a radial direction from an outer circumference An extended protrusion, the back cover is in contact with the insulating spacer; a body assembly, which is molded from plastic and has a first end and a first end, the body assembly is adapted to be embedded in the housing It is hollow and has an inner periphery adapted to receive the rear cover assembly. The body assembly further includes: a conductive bracket disposed within the body assembly, the conductive bracket having a first end and a second end. The conductive bracket is electrically insulated from the housing by an outer circumference of the body component, and the first end of the conductive bracket is disposed in the hollow portion of the body component for electrical coupling with the rear cover component, The guide The second end of the bracket extends to the second end of the body component; and a printed circuit board adapted to be coupled to the second end of the body component, the printed circuit board having a first surface and a first A surface, wherein the first surface is electrically coupled to the second end of the conductive bracket, and the second surface is coupled to the casing, so that between an inner circumference of the casing and an outer circumference of the rear cover assembly An acoustic path is formed at the sides of the protrusion, and the acoustic path allows air 93414.doc 200522759 to flow caused by the vibration membrane in response to the movement of acoustic energy coupled into the acoustic port. [Embodiment] Although the present invention allows various modifications and alternative forms, certain examples are shown in the drawings as examples, and these examples will be described in detail herein. However, 'it should be understood that this disclosure should not limit the present invention to the particular form described, but rather, the present invention is intended to cover all modifications and substitutions which fall within the spirit and scope of the invention as defined by the scope of the accompanying patent application. And the equivalent. FIG. 1 is an exploded view of a condenser microphone 100. The condenser microphone can be used in virtually any type of communication device, such as a cellular phone that can communicate through one or more public or private communication networks, and a web-enabled honeycomb. Phones, personal digital assistants (PDAs), palmtop computers, other types of portable computing and Internet access electrical equipment and devices, and the like. The grams of wind 100 may include a cup-shaped shell 108 having an upper surface portion 110 and a side wall portion 112. In alternative embodiments, the housing 108 may take the form of various other shapes (such as rectangular, D-shaped, or trapezoidal) and have many different sizes. The side wall portion 112 of the housing terminates at the connecting surface 114 and defines an opening 116. A connecting surface 14 having an outwardly flared portion may be initially formed so that other components can be placed in the housing 108. When all components are placed in the housing 108 in the final or closed position, the connection surface m is bent or reformed radially toward the center of the opening 116. This forming operation mechanically captures the rear surface 168 'of the PCB 164 by the connection surface 114 to lock other components in place and electrically connect the rear surface 168 of the pcB 164. The illustrated housing 108 has at least one layer. However, the housing ι〇8 may be made by alternating layers of conductive materials and non-conductive materials, or a non-conductive substrate may have a conductive coating coated thereon, which allows the diaphragm assembly and the rear surface 168 of the PCB 164 Of its electrical connection. In one embodiment, the outer shell ⑽ is made of aluminum. At least one aperture or sound port 118 is introduced on the upper surface of the housing 108 to allow sound waves to be transmitted to the vibration membrane module 12. The sound port ii8 may be formed in any suitable manner, such as drilling, stamping or molding. The sound port US allows sound energy corresponding to a change in sound pressure level to enter the housing 8. The dust cover 102 has a shape corresponding to the shape of the housing 108, but it can take various shapes that do not necessarily correspond to the shape of the housing, and can have many different sizes. In one embodiment, the dust cover 102 shown has a ring shape corresponding to the ring-shaped housing 108. The dust cover can be made of cloth or tape, and has a first surface 104 and a second surface 106. The second surface 106 of the dust cover 102 is attached to the housing 黏 with an adhesive to cover the sound port 118. In this way, it is possible to prevent the metal component 170 from entering the microphone i⑼ and damaging the electronic component 170 disposed inside the case ⑽. Dust shield 102 can also improve frequency response, cause delay, and provide directional response. > The gram 100 may further include a vibration membrane module. The vibrating membrane module 120 includes-a supporting ring 122 and-a vibrating membrane 124 attached to the supporting ring 122. The vibrating membrane module 12 has a shape substantially corresponding to the outer shell ，, but it can be & taken in different examples. Various forms of shapes, with many different sizes 1% 122 can be made of conductive materials such as non-steel; however, any conductive material or material containing a conductive coating (including brass or tin) can be used to support the soil. 122 has a The first surface 126 and a second surface m 93414.doc 200522759 The first surface 126 of the support% 122 is kept in contact with the upper surface 110, and the second surface 128 and Jianyi! 34 keep the corner brother. The vibration film 124 is made of a conductive material capable of vibrating in response to sound waves. This material is a polyethylene terephthalate delta film, which is generally available under the trademark. The diaphragm 124 has a first surface 30 and a first surface 132. The first surface 13 of the vibration film 124 is attached to the second surface of the support ring 122 by, for example, bonding with an adhesive. However, those skilled in the art or those of ordinary skill will understand that any form of interface is sufficient, including compression or mechanical attachment at the edges and the like. The second form of coating the vibrating film 124 by a layer of conductive material such as chromium The surface U2 forms an electroactive portion, which is generally called a movable electrode, and is in contact with the spacer 134. The microphone 100 may further include a spacer 134 having a hollow region 135 and first and second surfaces 36 and 138, respectively, for isolating the diaphragm assembly 120 from other elements in the housing 108. The spacer 134 is made of an electrically insulating material (for example, a 200 standard specification (gaUge) iMyiar plastic), and has a thickness spaced between the diaphragm assembly 120 and the rear cover assembly 140. The spacer 1 34 deflects the diaphragm 124 toward the rear cover assembly 140. The spacer 134 may have various shapes that do not necessarily correspond to the shape of the housing, and may have many different sizes. In one embodiment, the illustrated spacer 134 has a ring shape corresponding to the shape of the housing 108. The thickness and material of the spacer 134 can be changed according to application requirements. The spacer 134 is placed between the diaphragm assembly 120 and the rear cover assembly 140, and the spacer i 34 is held at the mechanical pressure applied by the connection surface 1 丨 4 after it is closed on the PCB 164. The right place. The first surface 136 of the spacer 134 and the second surface 132 of the diaphragm 124 remain in contact with each other. The second surface 138 of the spacer 134 is kept in contact with the rear cover assembly 4o, and isolates the vibration membrane assembly 120 from the rear cover assembly 14o. The microphone 100 may further include a rear cover assembly 14. The rear cover assembly 140 shown has at least one protruding portion 142 and at least one buffer region (reUef SeCtin) 144. However, the rear cover assembly may include a plurality of protruding portions 142a-d and a plurality of buffer portions 144a-d, and this embodiment will be described in more detail. The rear cover assembly 140 is placed between the second surface I38 of the spacer 134 and the body assembly 150 by the mechanical pressure of the aforementioned connecting surface 114. The microphone 100 also has a body assembly 150 having a hollow region 152 and upper and lower surfaces of 154 and 156, respectively. The body assembly 15 is housed in the housing 108. The body assembly 150 can be molded into different shapes and sizes to suit the needs of the application. In one embodiment, the body assembly 50 has a cylindrical shape and is made of an electrically insulating material such as a molded polyethylene plastic. When assembled, the first surface 154 of the body assembly 150 is held in contact with the second surface 138 of the spacer 134 by the mechanical pressure of the aforementioned connection surface. The second surface 156 of the body assembly 15 is formed with a positioning protrusion member 160. The positioning protruding member 160 is designed to sacrifice the PCB 164 so that the rear cover assembly 14 is mechanically isolated but electrically connected to the pCB 164. In this way, the interval between the rear cover assembly 140 and the diaphragm assembly 120 is not affected by the deformation in the casing 108. In one example, the positioning protrusion member 160 is made of a conductive material such as stainless steel; however, any conductive material or a material including a conductive coating may be used. The microphone 100 further includes a printed circuit board (PCB) 164 disposed in the housing 108. The PCB 164 may be arranged coaxially with the housing 108. pCB 164 has a unique surface I66 and a rear surface 168. Ρ (3Β 164 can correspond to the shell or 93414.doc 200522759
另外根據特疋應用之各種形狀及尺寸而形成。PCb 164之前 表面166可具有印刷線路跡線及複數個電子元件17〇，諸如 一接面場效電晶體（JFET)及用於將由振動膜組件12〇與後 擔盍組件140所產生之電容變化轉化為電阻抗之至少一電 容器。PCB 164之前表面166與定位突出構件16〇保持接觸， 且藉由導電支架158而與後擋蓋組件14〇電連接。後表面168 具有印刷線路迹線，且藉由連接表面114而與外殼1〇8電耦 口。PCB 164可藉由焊接處理而附著於導電支架158 ;然而， 任何形式之電連接均足夠。 接著，將本體組件150按壓配合於外殼1〇8内與間隔器134 接觸。本體組件150之按壓配合抑制了下面之元件以減少在 製U，月間可此出現之位移及損壞。另外，本體組件1使後 擋蓋組件140及振動膜組件丨2〇能與pCB丨7〇電連接而未使 定位突出構件160變形。In addition, it is formed according to various shapes and sizes of special applications. The front surface 166 of the PCb 164 may have printed circuit traces and a plurality of electronic components 17 such as a junction field effect transistor (JFET) and a capacitor for changing the capacitance generated by the vibrating membrane module 12 and the rear load cell 140. At least one capacitor converted into electrical impedance. The front surface 166 of the PCB 164 is in contact with the positioning protruding member 160 and is electrically connected to the rear cover assembly 14 through the conductive bracket 158. The rear surface 168 has printed circuit traces and is electrically coupled to the housing 108 via the connection surface 114. The PCB 164 may be attached to the conductive bracket 158 by a soldering process; however, any form of electrical connection is sufficient. Next, the body assembly 150 is press-fitted into the housing 108 and brought into contact with the spacer 134. The pressing fit of the body assembly 150 suppresses the following components to reduce the U-manipulation, which can occur during this month and damage. In addition, the main body assembly 1 enables the rear cover assembly 140 and the diaphragm assembly 20 to be electrically connected to the pCB 170 without deforming the positioning protrusion member 160.
μ參看圖2，其展示了後擋蓋組件14G之-實施例。將後老 蓋組件140衝M為碟形，其具有至少一突起部142及至少一 緩衝區域144。在所示之實施例中，後擒蓋組件刚包含潜 數個突起部142a_d及複數個緩衝部分144“ 刚系由諸如残鋼之導電材料製造；㈣，可利用任何 電材料或包含導電塗層之材料。後撞蓋組件14。具有一二 f面及—第二表面148。後擋蓋組件140之第一表面14< "—;1 %膜或電介體材料（例如聚四氟乙烯）來塗覆 息在運订中’該後擋蓋形成一固定電極，且可靜電 充電至m面電荷，例如360 V。第二表面148係由諸 93414.doc -12- 200522759 如不銹鋼之導、電材料製造。β此方式形成之後擋蓋組件140 具有中心下方之表面區域增加或振動膜124之區域最易動 之優勢，藉此增加了麥克風1〇〇之電聲性能。根據本文所揭 示之發明性概念而建置之裝置具有以下優勢：外形尺寸縮 小’同時在敏感性、雜訊、穩定性、緊密性、耐用性與對 電磁干擾（，ΈΜΓ)不敏感及其他外部與環境條件下（包含撞 擊與碎屑）均保持了良好之電聲性能。 現參看圖3，在一實施例中，將本體組件15〇按壓或模製 成具有中空區域152之圓柱體形狀。本體組件15〇係由諸如 模衣水乙知塑膠之電絕緣材料製造，其具有一上表面154及 一下表面156。定位突出構件160係由諸如不銹鋼之導電材 料製造，且可模製或按壓配合於本體組件15〇之下表面156 中。上端158a-d可被衝壓而成，且被附著或模製於本體組 件150之内部周邊部分。導電支架158及定位突出構件16〇可 由相同原料形成，且可作為一單元被模製或按壓配合於本 體組件150中。使用一本體組件150提供了裝置外形尺寸縮 小同時保持良好之電聲性能之優勢。在另一實施例中，後 擋蓋組件140可為無突起部142a-d之圓形。為產生必要的聲 通路172，可形成本體組件以於後擋蓋組件14〇外部邊緣之 至少一部分周圍提供緩衝。 參看圖4及圖5，對本體組件150及後擋蓋組件14〇進行了 論述及描述。本體組件15〇之内部周邊部分形成有一具有複 數個上端158a、158b、158c、158d之導電支架158。在一實 例中，導電支架15 8係由諸如不銹鋼之導電材料製造；然 93414.doc -13- 200522759 而，可利用任何導電材料或包含導電塗層之材料。導電支 架158與定位突出構件16〇藉由熔接或焊接而電連接。導電 支采158及疋位突出構件！ 6〇或者可由相同原料件形成。安 置導電支架158以容納後擋蓋組件14〇之第二表面148。後擋 盍組件I40上每個突起部142a-d均附著於一由導電支架158 之上端158a_d形成之相應安裝點。該附著可藉由用黏著劑 結合而進行。替代接合形式可包含壓縮、機械附著及其類 似Φ式。後播盍組件140可在安裝於外殼内之前與本體 組件150接合，或後擋蓋組件14〇可在麥克風1〇〇之最終組合 期間與本體組件150接合。 將後擋蓋組件140按壓配合於本體組件15〇内，且藉由用 黏著劑結合而附著於安置在本體組件15〇内部周邊部分中 之導電支架158。交替突起部界定了複數個聲通路172。該 等聲通路172遠離振動膜之高遷移率中心至後擋蓋外部邊 緣，位於緩衝部分144a_d處，以使振動膜124與後擋蓋組件 140間之空間中的空氣自由流動至pCB 16〇所位於之後容積 而未損害性能。 圖6係將結合一組合麥克風1〇〇之方法之實施例之描述而 參考的橫截面圖。首先，將振動膜組件12〇嵌入於外殼1〇8 中，與聲埠118相對。接著，將間隔器134嵌入於外殼ι〇8中， 使間隔器134之第一表面136面向振動膜組件12〇之第二表 面132。然後，將後擋蓋組件14〇嵌入於本體組件15〇中。當 嵌入於外殼108中時，將後擋蓋組件14〇之第一表面146定向 成面向間隔态134之第二表面138。將複數個突起部i42a_d 93414.doc -14- 200522759 進行排列，且將其黏附於導電支架158之複數個上端 158a-d。接著，將本體組件150嵌入於外殼108中。後擋蓋 組件140、間隔器134及振動膜組件120藉由本體組件150之 摩擦配合而抑制了因製造期間發生之振動而引起之其位置 的偏移。本體組件150之第二表面156形成有一安置於一對 應於PCB 164之位置處的定位突出構件丨6〇。PCB 164預組合 有複數個電子元件170。在振動膜組件12〇之後，將間隔器 134、後擋蓋組件140及本體組件15〇完全嵌入於外殼ι〇8 中，PCB 164之後表面168被外殼1〇8之連接表面114藉由（例 如）機械緊固、卷邊、熔接或黏著結合而俘獲。在此位置上， 振動膜組件120及後擋蓋組件140與PCB 164電連接。 本文引用之包含公開案、專利申請案及專利案之所有參 照案係以引用的方式併入本文中，該引用之程度就如同已 個別地及特定地將各個參照案以引用的方式併入且全部陳 述於本文中一般。 社描述本發Referring to FIG. 2, an embodiment of the rear cover assembly 14G is shown. The rear cover assembly 140 is punched into a dish shape and has at least one protruding portion 142 and at least one buffer region 144. In the illustrated embodiment, the rear cover assembly has just included a plurality of protruding portions 142a-d and a plurality of buffer portions 144 ", which are just made of a conductive material such as residual steel; alas, any electrical material may be used or include a conductive coating Material of the rear bumper cover assembly 14. It has one or two f surfaces and a second surface 148. The first surface 14 of the rear bumper assembly 140 < "-1% film or dielectric material (such as polytetrafluoroethylene) The back cover forms a fixed electrode and can be electrostatically charged to an m-plane charge, such as 360 V. The second surface 148 is made of 93414.doc -12- 200522759 such as stainless steel. Manufacture of electrical materials. Β After forming in this way, the cover assembly 140 has the advantage of increasing the area of the surface below the center or the area of the vibrating membrane 124 that is most mobile, thereby increasing the electroacoustic performance of the microphone 100. According to the disclosure of this article The device built based on the inventive concept has the following advantages: reduced size, and at the same time in sensitivity, noise, stability, tightness, durability and insensitivity to electromagnetic interference (, ΜΜΓ) and other external and environmental conditions (contain Impact and debris) have maintained good electro-acoustic performance. Referring now to FIG. 3, in one embodiment, the body assembly 150 is pressed or molded into a cylindrical shape with a hollow region 152. The body assembly 15 is made of Manufactured from an electrically insulating material such as mold-coating water and plastic, which has an upper surface 154 and a lower surface 156. The positioning protruding member 160 is made of a conductive material such as stainless steel, and can be molded or press-fitted to the body assembly 150. In the lower surface 156. The upper ends 158a-d may be stamped and attached or molded to the inner peripheral portion of the body assembly 150. The conductive bracket 158 and the positioning protruding member 160 may be formed of the same raw material and may be used as a unit. Molded or pressed to fit into the body assembly 150. Using a body assembly 150 provides the advantage of reducing the size of the device while maintaining good electro-acoustic performance. In another embodiment, the rear cover assembly 140 may be a protrusion-free portion 142a -d rounded. To generate the necessary sound path 172, a body assembly may be formed to provide cushioning around at least a portion of the outer edge of the rear cover assembly 14o. See Figure 4 and 5. The body assembly 150 and the rear cover assembly 14 are discussed and described. The inner peripheral portion of the body assembly 150 is formed with a conductive support 158 having a plurality of upper ends 158a, 158b, 158c, and 158d. In one example, The conductive bracket 15 8 is made of a conductive material such as stainless steel; however, 93414.doc -13- 200522759 Any conductive material or a material including a conductive coating can be used. The conductive bracket 158 and the positioning protruding member 16 are welded or welded. And the electrical connection. The conductive support 158 and the position protruding member! 60 or may be formed of the same raw material. The conductive support 158 is arranged to receive the second surface 148 of the rear cover assembly 14. Each protrusion 142a-d on the rear cymbal assembly I40 is attached to a corresponding mounting point formed by the upper ends 158a-d of the conductive bracket 158. This attachment can be performed by bonding with an adhesive. Alternative joining forms may include compression, mechanical attachment, and the like. The rear broadcast assembly 140 may be engaged with the body assembly 150 before being installed in the housing, or the rear cover assembly 140 may be engaged with the body assembly 150 during the final assembly of the microphone 100. The rear cover assembly 140 is press-fitted into the body assembly 150 and is attached to a conductive bracket 158 disposed in an inner peripheral portion of the body assembly 150 by bonding with an adhesive. The alternating protrusions define a plurality of acoustic paths 172. The sound paths 172 are far from the center of the high mobility of the diaphragm to the outer edge of the rear cover, and are located at the buffer portions 144a-d, so that the air in the space between the diaphragm 124 and the rear cover assembly 140 flows freely to pCB 16〇 Behind the volume without compromising performance. Fig. 6 is a cross-sectional view which will be referred to in connection with the description of an embodiment of the method of combining microphones 100. First, the vibrating membrane module 120 is embedded in the housing 108, facing the sound port 118. Next, the spacer 134 is embedded in the casing 08, so that the first surface 136 of the spacer 134 faces the second surface 132 of the diaphragm assembly 120. Then, the rear cover assembly 14 is embedded in the body assembly 15. When embedded in the housing 108, the first surface 146 of the rear cover assembly 14 is oriented to face the second surface 138 of the spacer 134. A plurality of protrusions i42a_d 93414.doc -14- 200522759 are arranged, and they are adhered to a plurality of upper ends 158a-d of the conductive bracket 158. Next, the body assembly 150 is embedded in the casing 108. The rear cover assembly 140, the spacer 134, and the diaphragm assembly 120 suppress the displacement of their positions due to the vibration fit during the manufacturing process by the frictional fit of the body assembly 150. The second surface 156 of the body assembly 150 is formed with a positioning protrusion member 60 disposed at a pair of positions corresponding to the PCB 164. The PCB 164 is pre-assembled with a plurality of electronic components 170. After the diaphragm assembly 120, the spacer 134, the rear cover assembly 140, and the body assembly 150 are completely embedded in the housing 08, and the rear surface 168 of the PCB 164 is connected by the connection surface 114 of the housing 108 (for example, ) Captured by mechanical fastening, crimping, welding or adhesive bonding. In this position, the diaphragm assembly 120 and the rear cover assembly 140 are electrically connected to the PCB 164. All references, including publications, patent applications, and patents, cited herein are hereby incorporated by reference to the same extent as if each reference had been individually and specifically incorporated by reference and All statements are general in this article. Agency description
々 、八—| N 丁明哥不丨J範圍3 容中），術語"一⑷，，與"一（an)”及"該（the)"及類似指示电 使用均被解釋為涵蓋單數及複數，除非本文另有說明資 :文明顯矛盾。本文中價值範圍之陳述僅用作個別地;丨 於该乾圍内之每-獨立價值之簡寫方法，除非本文另 -明’如同已個別地引用於本文中一般，將 : =說明書中。本文所描述之所有方法均可以任何: 所提供之任何及所有告 ♦、肩矛盾。本 仃及所“例或例示性語言(例如、 93414.doc -15- 200522759 使用僅為更好地闡明本發明，並非對本發明之範嘴 y '、_另有主張。本說明書中並無語言可被解釋 為將任=主張之元素作為本發明實施之基本。 於執^:了本發明之若干實施例，包含發明者已知之用 、仃本务明之最佳模式。應瞭解，所說明之該等 僅是例示性的’且不應限制本發明之範缚。 “ 【圖式簡單說明】 圖1係一電容式麥克風之分解圖；々 、 八 — | N 丁明哥 不 丨 J range 3 content)), the term " 一 ⑷, and " 一 (an) " and (the) " and similar instructions are explained In order to cover both the singular and the plural, unless otherwise stated in this document, the text clearly contradicts the statements. The statement of value ranges in this article is used only as an individual; 丨 the abbreviation method of each-independent value within the scope, unless otherwise stated in this article. As has been individually cited in this text, will: = In the description. All methods described herein can be any: any and all provided, conflicting. This and the "examples or illustrative language (such as , 93414.doc -15- 200522759 The use is only to better clarify the present invention, and not to claim the scope of the present invention y ', _. There is no language in this specification that can be interpreted as the element of ren = claim as this The basics of the implementation of the invention. Yu Zhi: Several embodiments of the present invention, including the best mode known to the inventors, and the best of the subject matter. It should be understood that the descriptions are merely exemplary and should not be limited. The scope of the invention. "[Schematic description ] Figure 1 is an exploded view of a condenser microphone;
圖2係一後擋蓋組件之俯視圖； 圖3係一本體組件之俯視圖； 圖4係展示後擋蓋及本體組件之組態的透視圖； 圖5係圖4之後擋蓋及本體組件之組態的俯視圖；及 圖6係一電容式麥克風之橫截面圖。 【主要元件符號說明】 100 電容式麥克風 102 防塵罩 104 防塵罩之第一表面 106 防塵罩之第二表面 108 外殼 110 外殼之上表面部分 112 外殼之側壁部分 114 連接表面 116 開口 118 聲埠Figure 2 is a top view of a rear cover assembly; Figure 3 is a top view of a body assembly; Figure 4 is a perspective view showing the configuration of the rear cover and the body assembly; Figure 5 is a set of the rear cover and the body assembly of FIG. 4 FIG. 6 is a cross-sectional view of a condenser microphone. [Explanation of Symbols of Main Components] 100 Condenser Microphone 102 Dust Cover 104 First Surface of Dust Cover 106 Second Surface of Dust Cover 108 Housing 110 Upper Surface of Housing 112 Side Wall of Housing 114 Connection Surface 116 Opening 118 Sound Port
93414.doc -16- 200522759 120 振動膜組件 122 支撐環 124 振動膜 126 支撐環之第一表面 128 支撐環之第二表面 130 振動膜之第一表面 132 振動膜之第二表面 134 間隔器 135 中空區域 136 間隔器之第一表面 138 間隔器之第二表面 140 後擔蓋組件 142a-d 後擋蓋組件之突起部 144a_d 後擋蓋組件之緩衝部分 146 後擋蓋組件之第一表面 148 後擋蓋組件之第二表面 150 本體組件 152 本體組件之中空區域 154 本體組件之上表面 156 本體組件之下表面 158 導電支架 158a-d 導電支架之上端 160 定位突出構件 164 印刷電路板（PCB)93414.doc -16- 200522759 120 Vibration membrane module 122 Support ring 124 Vibration membrane 126 First surface of support ring 128 Second surface of support ring 130 First surface of vibration membrane 132 Second surface of vibration membrane 134 Spacer 135 Hollow Area 136 First surface of the spacer 138 Second surface of the spacer 140 Rear cover assembly 142a-d Protrusions of the rear cover assembly 144a_d Buffer portion of the rear cover assembly 146 First surface of the rear cover assembly 148 Rear stop Second surface of the cover assembly 150 Body assembly 152 Hollow region of the body assembly 154 Upper surface of the body assembly 156 Lower surface of the body assembly 158 Conductive bracket 158a-d Upper end of the conductive bracket 160 Positioning protruding member 164 Printed circuit board (PCB)
93414.doc -17- 200522759 166 印刷電路板之前表面 168 印刷電路板之後表面 170 電子元件 172 聲通路93414.doc -17- 200522759 166 Front surface of printed circuit board 168 Rear surface of printed circuit board 170 Electronic components 172 Sound path
93414.doc -18-93414.doc -18-