CN116592991A

CN116592991A - Manufacturing method of vibration sensor, vibration sensor and electronic equipment

Info

Publication number: CN116592991A
Application number: CN202310522392.7A
Authority: CN
Inventors: 王邦水
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2023-05-10
Filing date: 2023-05-10
Publication date: 2023-08-15

Abstract

The application provides a manufacturing method of a vibration sensor, the vibration sensor and electronic equipment, wherein the manufacturing method of the vibration sensor comprises the following steps: providing a metal housing forming a first electrode toward a bottom wall of the opening; electroplating a metal layer on the vibration pickup assembly to form a second electrode; fixing the vibration pickup assembly in the metal shell and arranging the vibration pickup assembly opposite to the first electrode; the circuit board is covered on the opening of the metal shell and is electrically connected with the metal shell and the second electrode respectively. According to the technical scheme, the volume of the vibration sensor can be reduced, so that the electronic equipment is suitable for the development trend of light weight, thinness and miniaturization.

Description

Manufacturing method of vibration sensor, vibration sensor and electronic equipment

Technical Field

The present application relates to the field of sensors, and in particular, to a method for manufacturing a vibration sensor, and an electronic device.

Background

At present, the electret capacitive vibration sensor is generally formed by a circuit board and a shell to form a packaging cavity, and a parallel capacitor connected with the circuit board and composed of a vibrating diaphragm and a back electrode plate which are arranged in parallel is arranged in the packaging cavity, namely, the thickness of the vibration sensor is the sum of vibrating spaces of the vibrating diaphragm, the back electrode plate, the shell, the circuit board and the vibrating diaphragm which needs to be reserved, and the thickness is difficult to reduce, so that the product volume is difficult to further reduce.

Disclosure of Invention

The application mainly aims to provide a manufacturing method of a vibration sensor, the vibration sensor and electronic equipment, and aims to reduce the volume of the vibration sensor so as to adapt to the development trend of light weight and miniaturization of the electronic equipment.

In order to achieve the above object, the present application provides a method for manufacturing a vibration sensor, the method comprising the following steps:

providing a metal housing forming a first electrode toward a bottom wall of the opening;

electroplating a metal layer on the vibration pickup assembly to form a second electrode;

fixing the vibration pickup assembly in the metal shell and arranging the vibration pickup assembly opposite to the first electrode;

the circuit board is covered on the opening of the metal shell and is electrically connected with the metal shell and the second electrode respectively.

In one embodiment of the present application, the step of forming the second electrode by electroplating the metal layer on the vibration pickup assembly includes:

electroplating a metal layer on the surface of the vibrating diaphragm;

and fixing the vibrating diaphragm at an opening at one end of the connecting ring to form the vibration pickup assembly with the connecting ring.

In an embodiment of the present application, the connecting ring is made of an insulating material, and the step of fixing the diaphragm cover to the opening at one end of the connecting ring and the connecting ring includes:

covering the vibrating diaphragm on one end of the connecting ring, and enabling part of the vibrating diaphragm to be attached to the inner wall of the connecting ring to extend towards the other end of the connecting ring;

the step of covering the circuit board on the opening of the metal shell and electrically connecting the circuit board with the metal shell and the second electrode respectively comprises the following steps:

the circuit board is covered on the opening of the metal shell and is abutted against one end of the connecting ring, which is far away from the vibrating diaphragm, so that the circuit board is electrically connected with the metal shell and one end of the vibrating diaphragm, which is far away from the first electrode, respectively.

In one embodiment of the present application, the step of fixing the vibration pickup assembly in the metal casing and disposed opposite to the first electrode includes:

one end of the cover provided with the vibrating diaphragm faces the bottom wall of the metal shell and is inserted into the metal shell, and the vibrating diaphragm and the bottom wall of the metal shell are arranged at intervals.

In an embodiment of the application, before the step of fixing the diaphragm to the opening at one end of the connection ring and the connection ring, the method further includes:

the diaphragm is provided with a communication hole;

and/or, attaching a mass block on the vibrating diaphragm.

In an embodiment of the present application, the step of covering the circuit board on the opening of the metal casing and electrically connecting the circuit board with the metal casing and the second electrode respectively includes:

placing the circuit board inside the opening of the metal shell and electrically connecting the circuit board with the second electrode;

and bending the opening edge of the metal shell inwards to be abutted against the outer side surface of the circuit board so as to be electrically connected with the circuit board.

fixing a gasket at the edge of the bottom wall of the metal shell;

fixing the vibration pickup assembly on the gasket and oppositely arranging the vibration pickup assembly and the first electrode;

and/or, before the step of covering the circuit board on the opening of the metal shell and electrically connecting the circuit board with the second electrode, the method further comprises:

mounting a field effect transistor on the surface of the circuit board;

and/or, the manufacturing method further comprises the following steps:

the metal shell is provided with sound holes, and the sound holes are covered with dust-proof net.

The application also proposes a vibration sensor comprising:

a circuit board;

the metal shell is covered on the circuit board and is enclosed with the circuit board to form an encapsulation space, and a first electrode is arranged on the inner wall of the metal shell facing the circuit board; and

the vibration pickup assembly is arranged in the packaging space and is opposite to the circuit board, a second electrode is arranged on the surface of the vibration pickup assembly, and the second electrode is electrically connected with the circuit board and forms a capacitance structure with the first electrode.

In an embodiment of the application, the vibration pickup assembly includes a vibration film, the vibration film is disposed between the first electrode and the circuit board, the surface of the vibration film is provided with the second electrode, and two sides of the vibration film form a first vibration space and a second vibration space respectively.

In an embodiment of the application, the vibration pickup assembly further includes a connection ring, and the connection ring is disposed inside the packaging space and circumferentially around the metal housing;

the two ends of the connecting ring are communicated, and the circuit board and the vibrating body are respectively positioned at the two ends of the connecting ring so as to form the second vibrating space in the connecting ring.

In an embodiment of the present application, the connection ring is made of an insulating material, and the diaphragm includes:

the vibration main body is arranged opposite to the circuit board, and the second electrode is arranged on the vibration main body; and

and the conductive part is arranged on the inner side of the connecting ring and extends to one side of the circuit board, and one end of the conductive part, which is far away from the vibrating body, is electrically connected with the circuit board.

In an embodiment of the application, the vibration pickup assembly further includes a mass block, and the mass block is disposed on a surface of the diaphragm;

and/or the vibrating diaphragm is provided with a communication hole which is communicated with the first vibrating space and the second vibrating space.

In an embodiment of the present application, the metal housing is electrically connected to the circuit board;

and/or the opening edge of the metal shell is bent inwards to form a limiting part, the circuit board is arranged on the inner side of the opening, and the limiting part is abutted to one side, away from the vibrating diaphragm, of the circuit board.

In an embodiment of the application, the vibration sensor further includes a gasket, the gasket is disposed on an inner wall of the metal housing and circumferentially disposed along the metal housing, and the vibration pickup assembly is disposed on a side of the gasket facing away from the first motor;

and/or the vibration sensor further comprises a field effect tube, wherein the field effect tube is arranged on the surface of the circuit board facing the vibration pickup assembly and is electrically connected with the circuit board, and is used for amplifying electric signals;

and/or the material of the second electrode is electret material;

and/or, the metal shell is provided with an acoustic hole, the vibration sensor further comprises a dustproof net, and the dustproof net cover is arranged on the acoustic hole.

The application also proposes an electronic device comprising a vibration sensor as described in any one of the preceding claims, the vibration sensor comprising:

a circuit board;

According to the technical scheme, the first electrode is arranged on the metal shell, the second electrode is arranged on the vibration pickup assembly, so that a capacitance structure is formed between the bottom wall of the metal shell and the vibration pickup unit, when the vibration pickup unit senses a vibration signal and vibrates along with the vibration signal, the distance between the first electrode and the second electrode changes to change the capacitance value, and the voltage changes to generate an electric signal, so that the vibration signal is fed back through the electric signal. That is, the first electrode is arranged on the metal shell in the vibration sensor, so that the back electrode plate structure in the conventional vibration sensor is eliminated, the thickness of the back electrode plate is reduced, and the thickness and the volume of the vibration sensor are reduced compared with those of the conventional vibration sensor, so that the electronic equipment can be made to be lighter and thinner, the volume of the electronic equipment is reduced, and the development trend of lightening and miniaturization of the electronic equipment is met.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of an embodiment of a vibration sensor according to the present application;

FIG. 2 is a flowchart of a first embodiment of a method for manufacturing a vibration sensor according to the present application;

FIG. 3 is a flowchart of a method for manufacturing a vibration sensor according to a second embodiment of the present application;

FIG. 4 is a flowchart of a third embodiment of a method for manufacturing a vibration sensor according to the present application;

FIG. 5 is a flowchart of a fourth embodiment of a method for manufacturing a vibration sensor according to the present application;

FIG. 6 is a flowchart of a fifth embodiment of a method for manufacturing a vibration sensor according to the present application;

fig. 7 is a flowchart of a sixth embodiment of a method for manufacturing a vibration sensor according to the present application.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				100	Vibration sensor	313	Conductive part
10	Metal shell	315	First vibration space
				11	Packaging space	317	Second vibration space
13	Limiting part	319	Communication hole
				20	Circuit board	33	Connecting ring
30	Vibration pickup assembly	35	Mass block
				31	Vibrating diaphragm	40	Gasket
311	Vibrating body	50	Field effectStress tube

The achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

In the present application, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.

The application provides a manufacturing method of a vibration sensor 100 and a correspondingly formed vibration sensor 100.

Referring to fig. 1, in some embodiments of a vibration sensor 100 of the present application, the vibration sensor 100 includes:

a circuit board 20;

the metal shell 10 is arranged on the circuit board 20 in a covering way, so that an encapsulation space 11 is formed by enclosing the metal shell 10 and the circuit board 20, and a first electrode is arranged on the inner wall of the metal shell 10 facing the circuit board 20; and

the vibrating diaphragm 31, the vibrating diaphragm 31 is disposed in the packaging space 11 and is disposed opposite to the circuit board 20, two sides of the vibrating diaphragm 31 form a first vibrating space 315 and a second vibrating space 317 respectively, and a second electrode is disposed on the surface of the vibrating diaphragm 31 to form a capacitor structure with the first electrode.

Referring to fig. 2, based on the above hardware structure, the present application provides a method for manufacturing a vibration sensor 100, which includes the following steps:

step S10, providing a metal housing 10, wherein the metal housing 10 forms a first electrode towards the bottom wall of the opening;

step S20, electroplating a metal layer on the vibration pickup assembly 30 to form a second electrode;

step S30, fixing the vibration pickup assembly 30 in the metal shell 10 and arranging the vibration pickup assembly opposite to the first electrode;

in step S40, the circuit board 20 is covered on the opening of the metal casing 10 and the circuit board 20 is electrically connected to the metal casing 10 and the second electrode, respectively.

The vibration sensor 100 provided by the application can be used for converting an external vibration signal into an electric signal, so that vibration information can be fed back through the electric signal, the vibration signal can be vibration generated when an object moves, for example, the vibration sensor can be used as an inertial sensor and the like for feeding back the movement information of the object, and the vibration sensor can be applied to virtual reality equipment, augmented reality equipment, mixed reality equipment or other wearable electronic equipment; the vibration sensor 100 may also be used to collect vibration information of a propagation medium during the propagation of sound, for example, vibration information of a fixed medium when the sound is propagated in air to drive air vibration or the sound is transmitted through bone conduction, so that the vibration sensor 100 is used as a microphone (microphone) to realize acousto-electric conversion, and convert the sound information into an electric signal for propagation or interpretation; of course, the vibration sensor 100 may be used to collect other vibration signals, which is not limited herein.

Specifically, the vibration sensor 100 includes a metal casing 10 and a circuit board 20, where the metal casing 10 is a cylindrical structure with an opening at one end, the cross section of the metal casing 10 may be circular, rectangular, square, polygonal or other regular or irregular shape, without limitation, the circuit board 20 is covered on the opening of the metal casing 10 to form an enclosure space 11 with the metal casing 10, the vibration sensor 100 further includes a vibration pickup assembly 30 disposed in the enclosure space 11, the vibration pickup assembly 30 may be a vibrating diaphragm 31, a vibrating piece or other vibration structure capable of sensing vibration signals and vibrating along with the vibration, meanwhile, a bottom wall of the metal casing 10 facing the circuit board 20 is formed with a first electrode, the first electrode may be a bottom wall of the metal casing 10, or may be formed on the bottom wall of the metal casing 10 by electroplating and then coated with a metal layer, in addition, the conductive layer is electroplated on the surface of the vibration pickup assembly 30 to serve as a second electrode, the second electrode is a movable electrode capable of vibrating along with the vibration pickup assembly 30, when the vibration pickup assembly 30 is fixed in the metal shell 10, the first electrode and the second electrode form a capacitance structure, an electric signal conversion module can be arranged on the circuit board 20 and respectively electrically connected with the metal shell 10 and the second electrode to form a complete loop, when the vibration sensor 100 collects vibration signals, the vibration pickup assembly 30 is vibrated, at the moment, the distance between the first electrode and the second electrode changes along with the vibration of the vibration pickup assembly 30, the capacitance value of the capacitance structure changes, the electric fields at two ends of the first electrode and the second electrode change, thereby alternating voltage changing along with the change of the vibration signals is generated, so that an electric signal is generated on the circuit board 20, the conversion of vibration signals and electric signals is realized. And the first electrode is disposed on the metal case 10, thereby eliminating the back plate structure in the conventional vibration sensor 100, so that the vibration sensor 100 of the present application reduces the thickness of the back plate compared to the conventional vibration sensor 100, and reduces the thickness and volume of the vibration sensor 100.

Since the vibration sensor 100 changes the electric fields at both ends of the first electrode and the second electrode by the vibration of the diaphragm 31, an alternating voltage that changes with the change of the vibration signal is generated, and the power frequency interference of the alternating current is easy to have stray signals, so that the normal electric signal is affected. In this embodiment, the metal casing 10 is electrically connected to the circuit board 20, so that when the vibration sensor 100 is applied, the stray signals can be grounded through the metal casing 10, so as to avoid affecting the signal acquisition accuracy, and when the vibration sensor is used as a microphone, the problems of self-excitation howling and the like can be avoided. In addition, grounding the vibration sensor 100 can also discharge static electricity or other charges, thereby improving the use safety of the vibration sensor 100. The metal shell 10 is made of metal, such as aluminum shell, aluminum-magnesium alloy shell, brass shell, silver or other metals, but not limited thereto.

Therefore, it can be understood that in the technical solution of the present application, by disposing the first electrode on the bottom wall of the metal casing 10 and disposing the second electrode on the vibration pickup assembly 30, a capacitance structure is formed between the bottom wall of the metal casing 10 and the vibration pickup assembly 30, and when the vibration pickup assembly 30 vibrates, the distance between the first electrode and the second electrode changes to change the capacitance value, so that the voltage changes to generate an electrical signal, and the vibration signal is fed back through the electrical signal. That is, the vibration sensor 100 of the present application has the first electrode disposed on the circuit board 20, thereby eliminating the back plate structure of the current vibration sensor 100, so that the thickness of the back plate of the vibration sensor 100 is reduced compared with the conventional vibration sensor 100, and the thickness and the volume of the vibration sensor 100 are reduced, thereby making the electronic device lighter and thinner, reducing the volume of the electronic device, and meeting the trend of the miniaturization and the thinning of the electronic device.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, the vibration pickup assembly 30 includes a vibration film 31, the vibration film 31 is disposed between the first electrode and the circuit board 20, a second electrode is disposed on a surface of the vibration film 31, and a first vibration space 315 and a second vibration space 317 are respectively formed on two sides of the vibration film 31.

In this embodiment, the vibration pickup unit 30 is a vibrating diaphragm 31, the vibrating diaphragm 31 is disposed in the packaging space 11 at intervals, and a first vibrating space 315 and a second vibrating space 317 are respectively formed at two sides of the vibrating diaphragm 31, the first vibrating space 315 is located at one side of the vibrating diaphragm 31 away from the circuit board 20, and the second vibrating space 317 is located between the vibrating diaphragm 31 and the circuit board 20, so that the vibrating diaphragm 31 can vibrate in the first vibrating space 315 and the second vibrating space 317, and thus the capacitance can be changed to generate an electric signal when the vibrating diaphragm 31 vibrates; it should be noted that in the embodiment, the diaphragm 31 may be a back electrode diaphragm 31, that is, the material of the second electrode on the diaphragm 31 is at least one of chromium powder, nickel powder or gold powder, and at this time, the second electrode on the diaphragm 31 may not store charges and is only used as one electrode of the capacitor; the second electrode on the diaphragm 31 may also be an electret material in the following embodiment, and after the diaphragm 31 is polarized, the second electrode can store a certain charge for a long time, so that no external polarization voltage is needed to be provided for the capacitor structure.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, the vibration sensor 100 further includes a connection ring 33, wherein the connection ring 33 is disposed inside the packaging space 11 and circumferentially surrounds the metal casing 10;

the connection ring 33 is penetrated at both ends, and the circuit board 20 and the vibration body 311 are respectively located at both ends of the connection ring 33 to form a second vibration space 317 in the connection ring 33.

Referring to fig. 3, based on the above hardware structure, in the method for manufacturing the vibration sensor 100 according to the present application, the step of forming the second electrode by electroplating the metal layer on the vibration pickup assembly 30 includes:

step S21, electroplating a metal layer on the surface of the diaphragm 31;

in step S23, the diaphragm 31 is fixed to an end opening of the connection ring 33 to form the vibration pickup assembly 30 with the connection ring 33.

In this embodiment, the vibration sensor 100 further includes a connection ring 33 disposed in the package space 11, the connection ring 33 is substantially in a cylindrical structure with two open ends, and the two open ends are disposed towards the circuit board 20 and the vibration body 311 of the diaphragm 31, so that the circuit board 20 and the vibration body 311 are respectively covered and disposed at the two open ends of the connection ring 33, at this time, a second vibration space 317 for the vibration body 311 to vibrate is formed in the connection ring 33, so that the vibration body 311 can vibrate towards the circuit board 20, and the connection ring 33 plays a role of supporting the diaphragm 31 and the circuit board 20. In this embodiment, the electrical connection relationship between the second electrode and the circuit board 20 may be, for example, that the connection ring 33 is made of a conductive material or that the surface of the connection ring 33 is covered with a metal material, so that the connection ring 33 forms a grid ring, and the second electrode is electrically connected to the circuit board 20 through the connection ring 33, or may be, for example, that a part of the diaphragm 31 is extended to the circuit board 20 and electrically connected to the circuit board, which is not limited herein.

Referring to fig. 4, based on the above hardware structure, in the method for manufacturing the vibration sensor 100 according to the present application, the step of fixing the diaphragm 31 in the metal housing 10 and opposite to the first electrode includes:

in step S32, the end covered with the diaphragm 31 faces the bottom wall of the metal casing 10 and is inserted into the metal casing 10, and the diaphragm 31 is spaced from the bottom wall of the metal casing 10.

In this way, before the diaphragm 31 and the connecting ring 33 are fixed inside the metal casing 10, the diaphragm 31 and the connecting ring 33 are integrally connected and fixed, so that the diaphragm 31 is conveniently and fixedly forced and the diaphragm 31 and the connecting ring 33 are conveniently connected, and the installation convenience of the vibration sensor 100 is improved. The diaphragm 31 is close to the bottom wall of the metal shell 10, so that the problem that the electric signal cannot be fed back accurately due to small capacitance value change when the vibration signal is weak caused by the overlarge distance between the first electrode and the second electrode is avoided, and the sensing precision of the vibration sensor 100 is improved.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, the diaphragm 31 includes:

a vibrating body 311, the vibrating body 311 being disposed opposite to the circuit board 20, the second electrode being disposed on the vibrating body 311; and

the conductive part 313, the conductive part 313 locates inside the link 33 and extends to the circuit board 20 side, the conductive part 313 is kept away from the end of the vibration body 311 and is connected with circuit board 20 electricity, and set up with the first electrode interval.

In the present embodiment, the diaphragm 31 includes a vibrating body 311 and a conductive portion 313, the vibrating body 311 being disposed opposite to the circuit board 20, on which the second electrode is disposed; the conductive portion 313 extends from the vibration body 311 to the circuit board 20 to be electrically connected to the circuit board 20, so that a complete circuit is formed between the diaphragm 31 and the circuit board 20. In addition, the connection ring 33 is made of an insulating material to form an insulating inner shell, at this time, the conductive portion 313 of the diaphragm 31 is disposed inside the connection ring 33, so as to avoid the conductive portion 313 from contacting the metal outer shell 10, it can be understood that the first electrode is disposed on the bottom wall of the metal outer shell 10, and the connection ring 33 is disposed so as to avoid the conductive portion 313 from contacting the metal outer shell 10, thereby avoiding the first electrode and the second electrode from shorting through the metal outer shell 10, and improving the use safety of the vibration sensor 100. The connection ring 33 may be made of a material such as reinforced ABS (Acrylonitrile Butadiene Styrene, acrylonitrile-butadiene-styrene copolymer), polycarbonate, polyoxymethylene, PPS (Polyphenylene Sulfide ), or the like, and is not limited thereto.

Referring to fig. 5, based on this, the step of covering the diaphragm 31 over the opening at one end of the connection ring 33 and forming the vibration pickup assembly 30 with the connection ring 33 includes:

step S231, covering the diaphragm 31 on one end of the connection ring 33, and making a part of the diaphragm 31 stick to the inner wall of the connection ring 33 to extend to the other end of the connection ring 33;

the step of covering the circuit board 20 on the opening of the metal case 10 and electrically connecting the circuit board 20 with the metal case 10 and the second electrode, respectively, includes:

in step S41, the circuit board 20 is covered on the opening of the metal housing 10 and abuts against one end of the connection ring 30 facing away from the diaphragm 31, so that the circuit board 20 is electrically connected to the metal housing 10 and one end of the diaphragm 31 facing away from the first electrode, respectively.

In this embodiment, the vibrating bodies 311 of the circuit board 20 and the diaphragm 31 are respectively covered and arranged at two ends of the connecting ring 33, at this time, a second vibrating space 317 for vibrating the vibrating bodies 311 is formed in the connecting ring 33, so that the vibrating bodies 311 can vibrate towards one side of the circuit board 20, and the connecting ring 33 plays a role in supporting the diaphragm 31 and the circuit board 20; meanwhile, the conductive portion 313 of the diaphragm 31 is disposed inside the connection ring 33, so as to avoid the contact between the conductive portion 313 and the metal casing 10, and it can be understood that the first electrode is disposed on the bottom wall of the metal casing 10, and the connection ring 33 is disposed so as to avoid the contact between the conductive portion 313 and the metal casing 10, thereby avoiding the short circuit between the first electrode and the second electrode through the metal casing 10, and improving the use safety of the vibration sensor 100.

In some embodiments of the vibration sensor 100 of the present application, the conductive portion 313 is disposed circumferentially around the diaphragm 31.

In this embodiment, the conductive portion 313 is circumferentially disposed along the diaphragm 31 to improve the connection strength between the diaphragm 31 and the connection ring 33 and the circuit board 20, and the cross-sectional area of the conductive portion 313 is increased, so as to reduce the resistance between the diaphragm 31 and the circuit board 20, which is beneficial to increasing the generated electrical signal.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, the vibration sensor 100 further includes a mass 35, and the mass 35 is disposed on a surface of the diaphragm 31.

Based on the above hardware structure, the method for manufacturing the vibration sensor 100 according to the present application further includes, before the step of fixing the diaphragm 31 in the metal casing 10 and disposed opposite to the first electrode:

a mass 35 is attached to the diaphragm 31.

In this embodiment, by arranging the mass block 35 on the diaphragm 31, when the diaphragm 31 vibrates, the vibration amplitude of the diaphragm 31 under the same vibration signal can be significantly improved due to the mass block 35, so that a larger vibration airflow is generated, and the pickup and transmission sensitivity of the vibration signal are improved. The mass block 35 may be disposed at the top or bottom of the diaphragm 31, and in order to make the mass block 35 vibrate synchronously with the diaphragm 31, the mass block 35 may be fixed at the top or bottom of the diaphragm 31 by means of a bonding adhesive or the like, which is not limited herein.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, the diaphragm 31 is provided with a communication hole 319 for communicating the first vibration space 315 and the second vibration space 317.

the diaphragm 31 is provided with a communication hole 319.

In this embodiment, the diaphragm 31 is provided with the communication hole 319 for communicating the first vibration space 315 and the second vibration space 317, so that the stability of the airflow flowing in the first vibration space 315 and the second vibration space 317 can be ensured, the communication hole 319 can be only formed on the diaphragm 31, in some embodiments, the diaphragm 31 is provided with the mass block 35, and the communication hole 319 can also be made to penetrate through the mass block 35 and the diaphragm 31, or alternatively, a conduit can be provided for communicating, which is not limited in particular. While also avoiding damage to components during assembly of the inertial sensor due to expansion of the gases in the first and second vibrating spaces 315 and 317 caused by heat treatment.

Referring to fig. 6, in some embodiments of the method for manufacturing the vibration sensor 100 according to the present application, the step of electrically connecting the metal housing 10 and the circuit board 30 includes:

the metal shell 10 and the circuit board 30 are subjected to edge sealing treatment, and the metal shell 10 is electrically connected with an external circuit of the circuit board 30.

The vibration sensor 100 of the present application includes a metal casing 10 and a circuit board 20, where the metal casing 10 is a cylindrical structure with an opening at one end, and the cross section of the metal casing may be circular, rectangular, square, polygonal or other regular or irregular shapes, and the circuit board 20 is not limited herein, and covers the opening of the metal casing 10 to form an encapsulation space 11 with the metal casing 10 for mounting the vibration pickup assembly 30 and other components.

In this embodiment, the metal casing 10 and the circuit board 20 are subjected to edge sealing, and edge sealing can be performed by connecting conductive adhesive, or the limiting portion 13 is arranged to abut against the outer surface of the circuit board 20 in the following embodiment, so that the metal casing 10 is electrically connected with an outer circuit of the circuit board 20, and thus, other electrical connection structures are not required to be arranged, and the assembly convenience of the vibration sensor 100 is improved.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, an opening edge of the metal housing 10 is bent inward to form a limiting portion 13, the circuit board 20 is disposed inside the opening, and the limiting portion 13 abuts against a side of the circuit board 20 facing away from the vibration pickup assembly 30.

Referring to fig. 6, based on the above hardware structure, in the method for manufacturing the vibration sensor 100 according to the present application, the steps of covering the circuit board 20 on the opening of the metal housing 10 and electrically connecting the circuit board 20 with the metal housing 10 and the second electrode respectively include:

step S43, the circuit board 20 is arranged on the inner side of the opening of the metal shell 10 and is electrically connected with the second electrode;

in step S45, the opening edge of the metal case 10 is bent inward and is abutted against the outer surface of the circuit board 20, and is electrically connected to the circuit board 20.

In this embodiment, the circuit board 20 is disposed inside the opening of the metal casing 10, and the edge of the opening of the metal casing 10 is bent inward to form the limiting portion 13, so that the circuit board 20 can be stably limited in the metal casing 10, the circuit board 20 is prevented from being separated from the metal casing 10, and the structural stability of the vibration sensor 100 is improved. Meanwhile, the limiting part 13 is electrically connected with the circuit board 20, at this time, the limiting part 13 at the opening edge of the metal casing 10 protrudes out of the circuit board 20, and when the vibration sensor 100 is mounted at the mounting position of the electronic device through the circuit board 20, the limiting part 13 can be used to contact with the grounding part at the mounting position to be grounded, so that the signal pickup precision and the use safety of the vibration sensor 100 are improved.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, the vibration sensor 100 further includes a spacer 40, wherein the spacer 40 is disposed on an inner wall of the metal casing 10 and circumferentially surrounds the metal casing 10, and the vibration pickup assembly 30 is disposed on a side of the spacer facing away from the first motor.

Referring to fig. 7, based on the above hardware structure, in the method for manufacturing the vibration sensor 100 according to the present application, the steps of fixing the vibration pickup assembly 30 in the metal casing 10 and opposite to the first electrode include:

step S31, fixing a gasket 40 on the edge of the bottom wall of the metal shell 10;

in step S33, the vibration pickup assembly 30 is fixed to the spacer 40 and disposed opposite to the first electrode.

In this embodiment, the vibration sensor 100 further includes a gasket 40, where the gasket 40 has a substantially annular structure, and may have a closed loop structure or an open loop structure, and the shape of the gasket 40 may be contoured with the shape of the inner cavity of the metal casing 10, or may have other shapes, which is not specifically limited herein; the spacer 40 is connected to the inner wall of the metal casing 10, may be adhered to the bottom wall of the metal casing 10 facing the circuit board 20, or may be disposed on the inner side wall of the metal casing 10, so that the vibration pickup assembly 30 is disposed on the surface of the spacer 40 facing the circuit board 20 and contacts the spacer 40, and at this time, the first electrode and the second electrode may be prevented from contacting each other, and the first vibration space 315 is formed in the spacer 40.

Referring to fig. 1, in some embodiments of the vibration sensor 100 according to the present application, the vibration sensor 100 further includes a field effect transistor 50, and the field effect transistor 50 is disposed on a surface of the circuit board 20 facing the vibration pickup assembly 30 and is electrically connected to the circuit board 20 for amplifying the electrical signal.

Based on the above hardware structure, the method for manufacturing the vibration sensor 100 according to the present application further includes, before the step of covering the circuit board 20 on the opening of the metal casing 10 and electrically connecting the inner circuit of the circuit board 10 with the second electrode:

a field effect transistor 50 is mounted on the surface of the circuit board 20.

In the technical scheme of the embodiment of the application, the electric fields at the two ends of the first electrode and the second electrode are changed through the vibration of the vibration pickup assembly 30, so that alternating voltage which changes along with the change of the vibration signal is generated, and the circuit board 20 generates corresponding electric signals, but the generated signals are smaller. In this embodiment, the vibration sensor 100 is further provided with a field effect tube 50, where the field effect tube 50 is disposed on the circuit board 20, and is generally disposed on a side of the circuit board 20 facing the packaging space 11 and electrically connected to the circuit board 20, and the field effect tube 50 plays a role in impedance transformation, and can amplify an electrical signal, so that vibration information can be fed back more clearly; in addition, when the field effect transistor 50 is provided, a certain bias voltage may be applied in some embodiments to increase the degree of amplification of the electrical signal.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, a metal housing 10 is provided with an acoustic hole.

In this embodiment, the metal casing 10 is provided with the sound hole, so that the packaging space 11 is communicated with the external environment, and air vibration of the external environment can be transmitted into the packaging space 11 to make air in the packaging space 11 vibrate cooperatively, and the vibration sensor 100 can acquire external vibration signals by picking up the vibration signals of the air, so that the picking-up accuracy of external vibration information is improved, for example, distortion risk is reduced when sound information is acquired.

Referring to fig. 1, in some embodiments of the vibration sensor 100 of the present application, the vibration sensor 100 further includes a dust screen, and the dust screen is disposed in the sound hole.

Based on the above hardware structure, the method for manufacturing the vibration sensor 100 according to the present application further includes the following steps:

the metal casing 10 is provided with sound holes, and a dust screen is covered on the sound holes.

In this embodiment, the dust-proof net is covered on the sound hole, and the dust-proof net can protect the vibration sensor 100, for example, prevent dust from entering the packaging space 11 and falling onto the vibration pickup assembly 30, prevent an external object from puncturing the vibration pickup assembly 30, and can play a role in preventing water in a certain time, and can play a role in adjusting acoustic resistance and frequency response when being used as a microphone. The dust-proof net can be made of non-woven fabrics and can be fixed with the metal shell 10 in a bonding mode by glue such as self-adhesive glue. In this embodiment, the sound hole is usually disposed before the vibration pickup assembly 30 and the package circuit board 20 are fixed in the metal casing 10, so as to avoid damaging other components when the sound hole is opened later; the dust screen may be disposed before the vibration pickup assembly 30 and the package circuit board 20 are fixed in the metal casing 10, during assembly, or after other components are assembled

In some embodiments of the vibration sensor 100 of the present application, the material of the second electrode is an electret material.

Based on the above hardware structure, in the method for manufacturing the vibration sensor 100 according to the present application, the step of forming the second electrode by electroplating the metal layer on the surface of the vibration pickup assembly 30 includes:

step S25, electroplating electret materials on the surface of the vibration pickup assembly 30 to form a second electrode.

In the technical solution of the embodiment of the present application, the second electrode is close to or far from the first electrode by the vibration of the vibration pickup assembly 30, so that the electric fields at two ends of the first electrode and the second electrode are changed, thereby generating an alternating voltage which changes along with the change of the vibration signal, and enabling the circuit board 20 to generate a corresponding electric signal. In this embodiment, the second electrode on the vibration pickup assembly 30 is made of electret material, for example, quartz and other forms of silicon dioxide are natural electret materials, or synthetic materials such as fluoropolymers, polypropylene, polyethylene Terephthalate (PTFE), etc., without limitation. At this time, after the vibration pickup assembly 30 is polarized, the second electrode can store a certain charge for a long time, so that no external polarization voltage is needed to be provided for the capacitor structure.

The application also proposes an electronic device comprising a vibration sensor 100 as in any one of the preceding claims, the vibration sensor 100 comprising a circuit board 20, a metal casing 10 and a vibration pickup assembly 30; the metal shell 10 is covered on the circuit board 20 to form a packaging space 11 with the circuit board 20; the vibration pickup assembly 30 is disposed in the package space 11 and opposite to the circuit board 20, a bottom wall of the metal housing 10 facing the circuit board 20 forms a first electrode, and a second electrode is disposed on a surface of the vibration pickup assembly 30 to form a capacitor structure with the first electrode. The electronic device proposed by the present application may be, but is not limited to, a mobile phone, a notebook computer, a tablet computer, a personal digital assistant (Personal Digital Assistant, PDA), an electronic book reader, an MP3 (moving picture experts compression standard audio layer 3,Moving Picture Experts Group Audio Layer III) player, an MP4 (moving picture experts compression standard audio layer 4,Moving Picture Experts Group Audio Layer IV) player, a wearable device, a navigator, a palm game machine, a virtual and real device, an augmented reality device, etc.

The vibration sensor 100 applied to the electronic device of the present application is configured such that a first electrode is disposed on the metal casing 10 and a second electrode is disposed on the vibration pickup assembly 30, so that a capacitive structure is formed between the circuit board 20 and the vibration pickup assembly 30, and when the vibration pickup assembly 30 vibrates, a capacitance value is changed due to a change in a distance between the first electrode and the second electrode, so that a voltage is changed to generate an electrical signal, and the vibration signal is fed back through the electrical signal. That is, the vibration sensor 100 of the present application has the first electrode disposed on the metal casing 10, thereby eliminating the back plate structure in the current vibration sensor 100, so that the thickness of the back plate of the vibration sensor 100 is reduced compared with the conventional vibration sensor 100, and the thickness and the volume of the vibration sensor 100 are reduced, thereby making the electronic device lighter and thinner, reducing the volume of the electronic device, and meeting the trend of the development of the lightening and miniaturization of the electronic device.

Since the electronic device of the present application can employ all the technical solutions of all the embodiments of the vibration sensor 100, at least all the beneficial effects of all the technical solutions described above are provided, and are not described in detail herein.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the scope of the application, and all equivalent structural changes made by the description of the present application and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the application.

Claims

1. A method of manufacturing a vibration sensor, the method comprising the steps of:

2. A method of fabricating a vibration transducer according to claim 1, wherein the step of plating the metal layer on the vibration pickup assembly to form the second electrode comprises:

electroplating a metal layer on the surface of the vibrating diaphragm;

3. The method for manufacturing a vibration sensor according to claim 2, wherein the connecting ring is made of an insulating material, and the step of fixing the diaphragm cover to the opening at one end of the connecting ring and the connecting ring comprises:

4. A method of fabricating a vibration sensor according to claim 2, wherein the step of securing the vibration pickup assembly in the metal housing and disposed opposite the first electrode comprises:

5. The method for manufacturing a vibration sensor according to claim 2, wherein the step of fixing the diaphragm to the connecting ring with the opening at one end of the connecting ring is preceded by the steps of:

the diaphragm is provided with a communication hole;

and/or, attaching a mass block on the vibrating diaphragm.

6. The method of manufacturing a vibration sensor according to any one of claims 1 to 5, wherein the step of covering the circuit board on the opening of the metal case and electrically connecting the circuit board to the metal case and the second electrode, respectively, comprises:

7. A method of fabricating a vibration sensor according to any one of claims 1 to 5, wherein the step of fixing the vibration pickup assembly in the metal casing and disposed opposite the first electrode comprises:

fixing a gasket at the edge of the bottom wall of the metal shell;

mounting a field effect transistor on the surface of the circuit board;

and/or, the manufacturing method further comprises the following steps:

8. A vibration sensor, comprising:

a circuit board;

9. The vibration sensor of claim 8, wherein the vibration pickup assembly comprises a vibration film, the vibration film is arranged between the first electrode and the circuit board, the surface of the vibration film is provided with the second electrode, and two sides of the vibration film respectively form a first vibration space and a second vibration space.

10. The vibration sensor of claim 9, wherein the vibration pickup assembly further comprises a connection ring disposed inside the package space and circumferentially around the metal housing;

11. The vibration sensor of claim 10, wherein the connection ring is an insulating material, and the diaphragm comprises:

12. The vibration sensor of claim 9, wherein the vibration pickup assembly further comprises a mass, the mass being disposed on a surface of the diaphragm;

13. The vibration sensor of claim 8, wherein the metal housing is electrically connected to the circuit board;

14. A vibration sensor according to any one of claims 8 to 13, further comprising a spacer provided on an inner wall of the metal casing and circumferentially surrounding the metal casing, the vibration pickup assembly being provided on a side of the spacer facing away from the first motor;

and/or the material of the second electrode is electret material;

15. An electronic device comprising a vibration sensor as claimed in any one of claims 8 to 14.