1244871 九、發明說明： 【發明所屬之技術領域】 本專利係關於麥克風，且更明確地說，係關於用於通信 裝置、音訊裝置或其類似裝置中之高性能電介體麥克風及 其製造方法。 【先前技術】 近年來，行動通信技術發展迅速。消費者愈來愈多地使 用订動通信裝置，諸如蜂巢式電話、網頁啓用蜂巢式電話、 们人數位助理（PDA)、掌上型電腦、膝上型電腦、平板電腦 (tablet)及其他可藉由公衆或私人通信網路進行通信之裝 置。蜂巢式網路之擴展及行動通信之技術進步已促使了更 多消費者使用行動通信裝置。對通信裝置增長之需求.驅動 了併入行動通信裝置中之音訊元件之製造方法、功率消 耗接⑯製造及小型化之改良。行動通信裝置供應商之 間的競爭壓力增加了對更小、更低廉且更好執行之小型電 容式麥克風的需求。 大體而言，各種習知電介體電容式麥克風（"ECM”）已用於 通信裝置。先前技術之ECM包括_防塵罩、—具有聲璋之 一卜Γ + s振動膜、—間隔器、—絕緣本體、—後擋蓋組件、 …、: 、^刷私路板C’PCB’’）。該振動膜組件與該後擋 盖組件組成-藉由對應於間隔器厚度之聲璋而搞合之對聲 壓級變化作出回應之可變電容器部分。 因為ECM之尺寸減小 本體及導電環，導致…” 1可用於谷納絕緣 、包谷态口^刀與PCB之間的干擾增加。 93414.doc 1244871 除追求小型化以外，反復的撞擊與振動久而久之可對 之聲性能產生有害的影響。 【發明内容】 -種電介體麥克風，其包括··一外殼，其具有一形成 於其壁内之荦埠；一振動膜組件，其導電且與該外殼 私耦合，該振動膜組件鄰近於該壁；一絕緣間隔器，其 淨近於違振動膜、位於該振動膜之與該_埠相對之一側 上；一後擋蓋組件，該後擋蓋組件具有一自一外圓周徑 向延伸之犬起部，該後擋蓋與該絕緣間隔器接觸；一本 體組件，該本體組件由塑膠㈣，具彳一第一端及一第 一鈿，该本體組件被調適成嵌入於該外殼中且呈中空， 具有被调適成容納該後擋蓋組件之内部周邊，該本體 、、且件進#包括·一導電支架，其安置於該本體組件内， 該導電支架具有-第_端及_第二端，該導電支架藉由 省本體組件之一外圓周而與該外殼電絕緣，該導電支架 之該第一端安置於用於與該後擋蓋組件電耦合之該本體 組件之該中空部分内，該導電支架之該第二端延伸至該 本肢組件之该第二端；及一印刷電路板，其被調適成與 亥本肢、、且件之忒弟二端相搞合，該印刷電路板具有一第 一表面及一第二表面，其中該第一表面與該導電支架之 該第二端電耦合，且該第二表面與該外殼耦合，藉以在 该外忒之一内圓周與該後擋蓋組件之一外圓周之間的該 大起邓之该等側處形成一聲通路，該聲通路允許由該振 動膜回應耦合入該聲琿中之聲能量之移動所引起之空氣 93414.doc !244871 流動。 【實施方式】 :然本發明容許各種修改及替代形式，但是在圖式中兴 展不了確定實施例，且在本文中將詳細描述該等: :]。然而’應瞭解到，本揭示内容不應將本發明限制二： ^之特定形式，相反地’本發明意欲涵蓋屬於由隨附申钱 專利範圍所界；^之本發明之精神及料的所有修改月 及均等物。 曰代 圖1係一電容式麥克風100之分解圖，該電容式麥克風實 際上可用於任何類型之通信裝置，諸如可藉由一或多個： 衆或私人通信網料行通信之蜂巢式電話、網頁啓用蜂^ 式電話、個人數位助理（PDA)、掌上型電腦、其他類型之攜 帶型計算及網際網路存取電氣設備與裝置及其類似物。: 克風100可包含-具有上表面部分i 1〇及側壁部分i 12之杯 形外殼1G8。在替代實施例中，外殼1()8可採取各種其他形 狀之形式（諸如矩形、D形或梯形）且具有許多不同之尺寸。 外殼之側壁部分112終端位於連接表面114處，界定了一開 口 116。最初可形成具有一向外的張開部之連接表面丨丨#， 以使在外殼108内可置放其他元件。 當將所有元件以最終或封閉位置置放於外殼1〇8内時，將 連接表面114向開口 116之中心徑向地彎曲或再形成。此形 成钴作藉由連接表面114機械地俘獲pCB 164的後表面 168，將其他元件鎖定在合適位置以及電連接之後 表面168。所不之外殼1〇8具有至少一層。然而，外殼1〇8可 93414.doc 1244871 由導電材料及非導電材料之交替層製造，或一非導電基板 可具有塗覆在裏面之導電塗層，其允許振動膜組件12〇與 PCB 164之後表面168之電連接。在一實施例中，外殼log 係用無製造。 將至少一孔徑或聲埠118引入於外殼1〇8之上表面U〇 上，以允許將聲波傳送至振動膜組件12〇。聲槔lu可以任 何合適之方式形成，諸如鑽孔、衝壓或模製。聲埠1丨8允許 對應於聲壓級變化之聲能量進入外殼108。 防塵罩102具有對應於外殼108之形狀的形狀，但其可採 取未必對應於該外殼形狀之各種形狀，且可具有許多不同 之尺寸。在一實施例中，所示之防塵罩1〇2具有對應於環狀 外设108之裱狀形狀。該防塵罩可由布或毛氈來製造，其具 有第一表面104及第二表面106。防塵罩1〇2之第二表面ι〇6 藉由黏著劑而附著於外殼1G8以覆蓋聲埠118。以此方式有 助於防止碎屑進人麥克風⑽而損壞安置於外殼⑽内之電 -件1 70防塵罩! 〇2亦可改良頻率回應、引起延遲並提 供指向性回應。 >克風100可進一步包含一振動臈組件。振動膜組件 120包含-支撐環122及一附著於該支撐環m上之振動膜 124。振動膜組件120具有—大致對應於外殼⑽之形狀，作 其在不同實施射可採取各種形狀之形式，且具有許多不 5寸纟撐％ 122可由例如不錄鋼之導電材料製造；缺 而二利用任何導電材料或包含導電塗層（包含黃銅或 之材料。支撐環122具有—第—表面126及—第二表面128。 93414.doc 1244871 支撐％ 122之第一表面126與上表面丨1〇保持接觸，且第二表 面128與間隔器丨34保持接觸。振動膜124係由一可對聲波回 …而振動之導迅材料製造。此一材料為一般在商標下 可購得之聚對苯二甲酸乙二酯膜。振動膜124具有一第一表 面13 0及一第二表面132。振動膜124之第一表面13〇藉由（例 如）用黏著劑結合而附著於支撐環丨22之第二表面丨28。然 而，热悉此項技術者或一般技術者將瞭解到，任何形式之 接合均足夠，包含壓縮或在邊緣處機械附著及其類似形 式。藉由諸如鉻之導電材料層塗佈振動膜124之第二表面 U2,形成一電活性部分，其一般稱為活動電極，與間隔器 134保持接觸。 麥克風100可進一步包含一具有中空區域135及分別為 136與138之第一與第二表面之間隔器134，用於使振動膜組 件120與外殼ι〇8内之其他元件相隔離。間隔器134係由電絕 緣材料（例如200標準規格（gauge)之Mylar塑膠）製造，其具 有間隔於振動膜組件12〇與後擋蓋組件14〇之間之厚度。間 杰134使振動膜124向後擋蓋組件140偏斜。間隔器134可 具有未必對應於外殼形狀之各種形狀，且可具有許多不同 之尺寸。在一實施例中，所示之間隔器134具有對應於外殼 108之形狀的環狀形狀。間隔器134之厚度及材料可依應用 要求而改變。間隔器134置放於振動膜組件120與後擋蓋組 件140之間，且藉由連接表面114在其於PCB 164上封閉後所 施加之機械壓力而將該間隔器n4保持於合適之位置。間隔 為134之第一表面136與振動膜124之第二表面132保持接 93414.doc -10 - 1244871 觸。間隔杰134之第二表面138與後擋蓋組件i4〇保持接觸， 且將振動膜組件120與後擋蓋組件ι4〇隔離。 麥克風100可進一步包含一後擋蓋組件14〇。所示之後擋 蓋組件140具有至少一突起部142及至少一緩衝區域（reHef seCtion)144。然而，該後擋蓋組件可包含複數個突起部 142a-d及複數個緩衝部分丨44a_d，且對此實施例將作更詳細 之順述。後擔盍組件140藉由前述連接表面114之機械壓力 而置放於間隔器134之第二表面138與本體組件15〇之間。 麥克風1〇〇亦具有一本體組件150，其具有一中空區域152 及分別為154與156之上與下表面。本體組件15〇安置於外殼 1〇8内。本體組件15〇可被模製成不同形狀及尺寸以適合應 用之需要。在一實施例中，本體組件15〇呈圓柱體形狀，且 由例如模製聚乙烯塑膠之電絕緣材料製造。當組裝時，本 體組件150之第一表面154藉由前述連接表面之機械壓力而 與間隔器134之第二表面138保持接觸。本體組件15〇之第二 表面156形成有一定位突出構件丨6〇。定位突出構件i6〇係設 a十用以容納PCB 164，以使後擋蓋組件14〇與PCB 164機械隔 離但電連接。如此，後擋蓋組件14〇與振動膜組件12〇之間 的間隔未受到外殼108内變形之影響。在一實例中，定位突 出構件160係由諸如不銹鋼之導電材料製造；然而，可利用 任何導電材料或包含導電塗層之材料。 麥克風100還進一步包含一安置於外殼1〇8内之印刷電路 板（PCB)164。PCB 164可與外殼1〇8同軸排列 。PCB 164具 有一前表面166及一後表面丨68。PCB i 64可以對應於外殼或 93414.doc -11 - 12448711244871 IX. Description of the invention: [Technical field to which the invention belongs] This patent relates to microphones, and more specifically, to high-performance dielectric microphones used in communication devices, audio devices, or the like, and methods of manufacturing the same . [Previous Technology] In recent years, mobile communication technology has developed rapidly. Consumers are increasingly using subscription communication devices, such as cellular phones, web-enabled cellular phones, personal digital assistants (PDAs), palmtop computers, laptops, tablets, and other A device that communicates through a public or private communication network. The expansion of cellular networks and technological advances in mobile communications have led to more consumers using mobile communications devices. The growing demand for communication devices has driven improvements in the manufacturing methods, power consumption manufacturing, and miniaturization of audio components incorporated in mobile communication devices. Competitive pressure among mobile communication device vendors has increased the demand for smaller, cheaper and better performing small condenser microphones. Generally speaking, various conventional dielectric condenser microphones (" ECM ") have been used in communication devices. The ECM of the prior art includes _ dust cover,-with one of the acoustic diaphragm Γ + s diaphragm,-spacer ——— Insulating body, —Rear cover assembly,…,:, ^ Brush private circuit board C'PCB ''). The diaphragm assembly and the rear cover assembly are composed of-by the sound corresponding to the thickness of the spacer The variable capacitor part that responds to changes in sound pressure level. Because the size of the ECM is reduced by the body and the conductive ring, it leads to ... "1 It can be used for Gona insulation, and the interference between the GK blade and the PCB increases. 93414.doc 1244871 In addition to miniaturization, repeated shocks and vibrations can adversely affect sound performance over time. [Summary of the Invention]-A dielectric microphone comprising: a housing having a port formed in a wall thereof; a vibrating membrane module which is electrically conductive and privately coupled with the housing, and the vibrating membrane module is adjacent to The wall; an insulating spacer, which is close to the vibrating membrane and is located on the side of the vibrating membrane opposite to the port; a rear cover assembly having a radial direction from an outer circumference The extended dog raising part, the rear cover is in contact with the insulating spacer; a body component, which is made of plastic, with a first end and a first sleeve, the body component is adapted to be embedded in the casing It is hollow and has an inner perimeter that is adapted to receive the rear cover assembly. The body, and pieces # include a conductive support, which is disposed in the body assembly. The conductive support has a- And a second end, the conductive bracket is electrically insulated from the casing by an outer circumference of a provincial body component, and the first end of the conductive bracket is disposed on the body component for electrical coupling with the rear cover component In the hollow part, the conductive support The second end extends to the second end of the limb component; and a printed circuit board adapted to engage with the two ends of the eldest son of the limb, and the piece, the printed circuit board has a first A surface and a second surface, wherein the first surface is electrically coupled to the second end of the conductive bracket, and the second surface is coupled to the housing, so as to be in contact with the rear cover assembly at an inner circumference of one of the outer shells An acoustic path is formed at the sides of the big riser and Deng between an outer circumference, and the acoustic path allows the air caused by the vibration membrane to respond to the movement of the sound energy coupled into the vocal fold. 93414.doc! 244871 . [Embodiment]: Although the present invention allows various modifications and alternative forms, certain embodiments cannot be developed in the drawings, and these will be described in detail in this document::]. However, 'it should be understood that this disclosure should not limit the present invention to two: a specific form of ^, on the contrary' the present invention is intended to cover all the spirit and materials of the present invention which fall within the scope of the appended claims; Modify the month and the equivalent. Figure 1 is an exploded view of a condenser microphone 100, which can be used in virtually any type of communication device, such as a cellular phone that can communicate through one or more of: public or private communication networks, Web pages enable cellular phones, personal digital assistants (PDAs), palmtop computers, other types of portable computing and Internet access electrical equipment and devices, and the like. Kefeng 100 may include a cup-shaped housing 1G8 having an upper surface portion i 10 and a side wall portion i 12. In alternative embodiments, the housing 1 () 8 may take the form of various other shapes (such as rectangular, D-shaped, or trapezoidal) and have many different dimensions. The side wall portion 112 of the housing terminates at the connecting surface 114 and defines an opening 116. A connecting surface with an outwardly flared portion can be initially formed so that other components can be placed in the housing 108. When all components are placed in the housing 108 in the final or closed position, the connecting surface 114 is bent or reformed radially toward the center of the opening 116. This forms cobalt to mechanically capture the rear surface 168 of the pCB 164 via the connection surface 114, locking other components in place and the surface 168 after electrical connection. The outer shell 108 has at least one layer. However, the housing 108 may be made of alternating layers of conductive materials and non-conductive materials, or a non-conductive substrate may have a conductive coating applied thereon, which allows the vibrating membrane module 12 and the PCB 164 to be behind Electrical connection to surface 168. In one embodiment, the housing log is manufactured without fabrication. At least one aperture or sound port 118 is introduced on the upper surface U0 of the housing 108 to allow sound waves to be transmitted to the vibration membrane module 12o. The sonar lu can be formed in any suitable manner, such as by drilling, stamping, or molding. Sound ports 1-8 allow sound energy corresponding to changes in sound pressure level to enter the housing 108. The dust cover 102 has a shape corresponding to the shape of the case 108, but it can take various shapes that do not necessarily correspond to the shape of the case, and can have many different sizes. In one embodiment, the illustrated dust cover 102 has a mounting shape corresponding to the ring-shaped peripheral device 108. The dust cover can be made of cloth or felt and has a first surface 104 and a second surface 106. The second surface ι06 of the dust cover 102 is attached to the casing 1G8 by an adhesive to cover the sound port 118. In this way, it helps to prevent debris from entering the microphone ⑽ and damaging the electrical cover 1 70 inside the housing !! 〇2 can also improve frequency response, cause delays, and provide directional response. > Kefeng 100 may further include a vibrating chirp assembly. The diaphragm assembly 120 includes a support ring 122 and a diaphragm 124 attached to the support ring m. The vibrating membrane module 120 has a shape that roughly corresponds to the shape of the housing ，, and can take various forms in different implementations, and has a number of non-5 inch support 122 122 can be made of conductive materials such as non-recorded steel; Use any conductive material or materials that include a conductive coating (including brass or the like. The support ring 122 has a first surface 126 and a second surface 128. 93414.doc 1244871 The first surface 126 and the upper surface of the support 122 122 〇Keep in contact, and the second surface 128 is kept in contact with the spacer 丨 34. The vibrating membrane 124 is made of a conductive material that can respond to sound waves and vibrate. This material is a commercially available polymer Ethylene phthalate film. The vibration film 124 has a first surface 130 and a second surface 132. The first surface 13 of the vibration film 124 is attached to the support ring by, for example, bonding with an adhesive. 22 The second surface 28. However, those skilled in the art or those skilled in the art will understand that any form of joining is sufficient, including compression or mechanical attachment at the edges and the like. By means of electrical conductivity such as chromium The material layer is coated on the second surface U2 of the vibrating film 124 to form an electroactive portion, which is generally called a movable electrode, and is in contact with the spacer 134. The microphone 100 may further include a hollow region 135 and 136 and 138, respectively. The spacers 134 on the first and second surfaces are used to isolate the vibration membrane module 120 from other components in the housing 08. The spacers 134 are made of an electrically insulating material (for example, Mylar plastic of 200 gauge) It has a thickness that is spaced between the diaphragm assembly 12 and the rear cover assembly 14. The Jianjie 134 deflects the diaphragm 124 toward the rear cover assembly 140. The spacer 134 may have various kinds that do not necessarily correspond to the shape of the housing Shape and can have many different sizes. In one embodiment, the spacer 134 shown has a ring shape corresponding to the shape of the housing 108. The thickness and material of the spacer 134 can be changed according to application requirements. The spacer 134 is placed between the diaphragm assembly 120 and the rear cover assembly 140, and the spacer n4 is held in place by the mechanical pressure applied by the connection surface 114 after it is closed on the PCB 164 The first surface 136 with an interval of 134 and the second surface 132 of the vibrating membrane 124 remain in contact with 93414.doc -10-1244871. The second surface 138 of the interval 134 maintains contact with the rear cover assembly i4〇 and vibrates The membrane assembly 120 is isolated from the rear cover assembly ι40. The microphone 100 may further include a rear cover assembly 140. The rear cover assembly 140 is shown to have at least one protrusion 142 and at least one buffer area (reHef seCtion) 144. However, The rear cover assembly may include a plurality of protruding portions 142a-d and a plurality of buffer portions 44a_d, and this embodiment will be described in detail in this embodiment. The rear load bearing assembly 140 is placed between the second surface 138 of the spacer 134 and the body assembly 150 by the mechanical pressure of the aforementioned connecting surface 114. The microphone 100 also has a body assembly 150 having a hollow area 152 and upper and lower surfaces of 154 and 156, respectively. The body assembly 15 is housed in the housing 108. The body assembly 15 can be molded into different shapes and sizes to suit the needs of the application. In one embodiment, the body assembly 15 has a cylindrical shape and is made of an electrically insulating material such as a molded polyethylene plastic. When assembled, the first surface 154 of the body assembly 150 is held in contact with the second surface 138 of the spacer 134 by the mechanical pressure of the aforementioned connection surface. The second surface 156 of the body assembly 15 is formed with a positioning protrusion member 60. The positioning protruding member i6〇 is provided to receive the PCB 164, so that the rear cover assembly 14o is mechanically isolated from the PCB 164 but electrically connected. As such, the interval between the rear cover assembly 14o and the diaphragm assembly 12o is not affected by the deformation in the housing 108. In one example, the positioning protrusion member 160 is made of a conductive material such as stainless steel; however, any conductive material or a material including a conductive coating may be used. The microphone 100 further includes a printed circuit board (PCB) 164 disposed in the housing 108. The PCB 164 may be arranged coaxially with the housing 108. The PCB 164 has a front surface 166 and a rear surface 68. PCB i 64 can correspond to housing or 93414.doc -11-1244871
另外根據特定應用之各種形狀及尺寸而形成。PCB 1 64之前 表面166可具有印刷線路跡線及複數個電子元件17〇，諸如 一接面場效電晶體（jFET)及用於將由振動膜組件12〇與後 擔蓋組件140所產生之電容變化轉化為電阻抗之至少一電 谷裔。PCB 164之前表面166與定位突出構件16〇保持接觸， 且藉由導電支架158而與後擋蓋組件14〇電連接。後表面168 具有印刷線路迹線，且藉由連接表面114而與外殼1〇8電耦 a PCB 164可藉由焊接處理而附著於導電支架158 ;然而， 任何形式之電連接均足夠。 接著，將本體組件150按壓配合於外殼1〇8内與間隔器134 接觸。本體組件150之按壓配合抑制了下面之元件以減少在 製造期間可能出現之位移及損壞。另外，本體組件15〇使後 擋蓋組件140及振動膜組件12〇能與pCB 17〇電連接而未使 定位突出構件160變形。 參看圖2,其展示了後擔蓋組件14〇之一實施例。將後擔Also formed according to various shapes and sizes for specific applications. The front surface 166 of the PCB 1 64 may have printed circuit traces and a plurality of electronic components 17 such as a junction field effect transistor (jFET) and a capacitor for generating the capacitance generated by the vibration membrane module 120 and the rear cover module 140. The change translates into at least one electrical valley of electrical impedance. The front surface 166 of the PCB 164 is in contact with the positioning protruding member 160 and is electrically connected to the rear cover assembly 14 through the conductive bracket 158. The rear surface 168 has printed circuit traces, and is electrically coupled to the housing 108 through the connection surface 114. A PCB 164 can be attached to the conductive bracket 158 by soldering; however, any form of electrical connection is sufficient. Next, the body assembly 150 is press-fitted into the housing 108 and brought into contact with the spacer 134. The press fit of the body assembly 150 suppresses the underlying components to reduce displacement and damage that may occur during manufacturing. In addition, the main body assembly 150 allows the rear cover assembly 140 and the diaphragm assembly 120 to be electrically connected to the pCB 170 without deforming the positioning protrusion member 160. Referring to FIG. 2, an embodiment of the rear cover assembly 14 is shown. Postload
蓋組件140衝壓為碟升其具有至少一突起部142及至少一 緩衝區域1 4 4。在所子夕每# A丨i 社所不之貝轭例中，後擋蓋組件14()包含複 數個大起邛142a-d及複數個緩衝部分144a_d。後擋蓋組件 140係由諸如不錄鋼之導電材料製造；然而，可利用任何導 電材料或包含導電塗層之材料。後擒蓋組件14〇具有一第— 表面14 ό及 弟—表面1 4 8。你4^ 衣曲。後擋盍組件14〇之第一表面146 可用:偏振介電膜或電介體材料（例如聚四說乙稀）來塗覆 或覆盍。在運行中’該後擋蓋形成一固定電極，且可靜電 充電至-預定表面電荷，例如36〇 VI二表面148係由諸 93414.doc •12- 1244871 =:鋼之導電材料製造。以此方式形成之後撞蓋組件i4〇 二中心下方之表面區域增加或振動膜m之區域最易動 /勢，精此增加了麥克風100之電聲性能。根據本文所揭 不之發明性概Μ建置之裝置具有以下優勢：外形尺寸縮 小’同時在敏感性、雜訊、穩定性、緊密性、耐用性斑對 電磁干擾（”醜”敏感及其他外部與環境條件下（包含撞 擊與碎屑）均保持了良好之電聲性能。 現蒼看圖3，在-實施例中，將本體組件15〇按壓或模製 成具有中空區域152之圓柱體形狀。本體組件15〇係由諸如 模製聚乙烯塑膠之電絕緣材料製造，其具有一上表面Μ#及 一下表面156。定位突出構件160係由諸如不銹鋼之導電材 料製造，且可模製或按壓配合於本體組件15〇之下表面156 中。上端158a-d可被衝壓而成，且被附著或模製於本體組 件150之内部周邊部分。導電支架158及定位突出構件16〇可 由相同原料形成，且可作為一單元被模製或按壓配合於本 體組件150中。使用一本體組件150提供了裝置外形尺寸縮 小同時保持良好之電聲性能之優勢。在另一實施例中，後 擒盍組件140可為無突起部l42a-d之圓形。為產生必要的聲 通路172，可形成本體組件以於後擋蓋組件14〇外部邊緣之 至少一部分周圍提供緩衝。 參看圖4及圖5，對本體組件150及後擔蓋組件140進行了 論述及描述。本體組件15 〇之内部周邊部分形成有一具有複 數個上端158a、158b ' 158c、158d之導電支架158。在一實 例中，導電支架158係由諸如不銹鋼之導電材料製造；然 93414.doc -13- 1244871 而’可利用任何導電材料或包含導電塗層之材 ^58與定位突出構㈣轉㈣接㈣接而電連接^ + =及力定位突出構件16。或者可由相同原料件形成：： 置W支…58以容納後措蓋組件14〇之第二表面⑷ 盍組件140上每個突起部142以均附著於—由導電支架^ 之上端伽-d形成之相應安裝點。該附著可藉由用黏著巧 結合而進行。替代接合形式可包含I縮、機械附著及其類 似形式。後擒蓋組件14〇可在安裝於外殼⑽内之前與本體 組件150接合，或後播蓋組件14〇可在麥克風ι〇〇之最終組合 期間與本體組件150接合。 將後擋蓋組件140按壓配合於本體組件15〇内，且藉由用 黏著劑結合而附著於安置在本體組件15〇内部周邊部分中 之導電支架158。交替突起部界定了複數個聲通路172。該 等聲通路172遠離振動膜之高遷移率中心至後擋蓋外部邊 緣，位於緩衝部分144a-d處，以使振動膜124與後擋蓋組件 140間之空間中的空氣自由流動至pCB 16〇所位於之後容積 而未損害性能。 圖6係將結合一組合麥克風ι〇〇之方法之實施例之描述而 參考的橫截面圖。首先，將振動膜組件12〇嵌入於外殼1〇8 中，與聲埠118相對。接著，將間隔器134嵌入於外殼1〇8中， 使間隔器134之第一表面136面向振動膜組件120之第二表 面132。然後，將後擋蓋組件14〇嵌入於本體組件150中。當 嵌入於外殼108中時，將後擋蓋組件14〇之第一表面146定向 成面向間隔器134之第二表面138。將複數個突起部142a-d 93414.doc •14- 1244871 進行排列，且將其黏附於導電支架158之複數個上端 158a-d。接著，將本體組件150嵌入於外殼108中。後擋蓋 組件140、間隔器134及振動膜組件120藉由本體組件150之 摩擦配合而抑制了因製造期間發生之振動而引起之其位置 的偏移。本體組件150之第二表面156形成有一安置於一對 應於PCB 164之位置處的定位突出構件160。Pcb 164預組合 有複數個電子元件170。在振動膜組件120之後，將間隔器 134、後擋蓋組件140及本體組件150完全嵌入於外殼1〇8 中，PCB 164之後表面168被外殼1〇8之連接表面114藉由（例 如）機械緊固、卷邊、熔接或黏著結合而俘獲。在此位置上， 振動膜組件120及後擋蓋組件14〇與pCB 164電連接。 本文引用之包含公開案、專财請案及專利案之所有來 照案係以引用的方式併入本文中，該引用之程度就如同已 個別地及料地將各個參照案以引用的方式併人且全 述於本文中一般。 你插遂本發The cover assembly 140 is stamped into a dish and has at least one protruding portion 142 and at least one buffer region 1 4 4. In the example of a yoke that is not included in the company, the rear cover assembly 14 () includes a plurality of large lifting pins 142a-d and a plurality of buffer portions 144a-d. The rear cover assembly 140 is made of a conductive material such as non-steel steel; however, any conductive material or a material including a conductive coating may be used. The rear cover assembly 14 has a first-surface 14 and a younger-surface 148. You 4 ^ Yiqu. The first surface 146 of the rear baffle assembly 14 can be coated or coated with a polarizing dielectric film or a dielectric material (such as polystyrene). During operation, the rear cover forms a fixed electrode and can be electrostatically charged to a predetermined surface charge. For example, 36 VI two surfaces 148 are made of 93414.doc • 12-1244871 =: steel conductive material. After being formed in this way, the surface area below the center of the striker assembly i40 is increased or the area of the vibrating membrane m is most susceptible to movement / potential, which improves the electro-acoustic performance of the microphone 100. The device built according to the inventive concept disclosed in this article has the following advantages: reduced size, while at the same time sensitivity, noise, stability, tightness, durability spots sensitive to electromagnetic interference ("ugly" and other external It maintains good electro-acoustic performance under environmental conditions (including impact and debris). Now looking at FIG. 3, in the embodiment, the body assembly 150 is pressed or molded into a cylindrical shape with a hollow region 152. The body assembly 15 is made of an electrically insulating material such as a molded polyethylene plastic, which has an upper surface M # and a lower surface 156. The positioning protrusion member 160 is made of a conductive material such as stainless steel, and can be molded or pressed It fits into the lower surface 156 of the main body component 15. The upper ends 158a-d can be stamped and attached or molded to the inner peripheral part of the main body component 150. The conductive bracket 158 and the positioning protruding member 16 can be formed of the same raw material. And can be molded or pressed as a unit in the body assembly 150. Using a body assembly 150 provides a reduction in the size of the device while maintaining good electro-acoustic performance Advantages. In another embodiment, the rear escapement assembly 140 may be round without protrusions 142a-d. To generate the necessary acoustic path 172, a body assembly may be formed to at least the outer edge of the rear cover assembly 14 A buffer is provided around a part. Referring to Figs. 4 and 5, the main body assembly 150 and the rear cover assembly 140 are discussed and described. The inner peripheral part of the main body assembly 150 is formed with a plurality of upper ends 158a, 158b ', 158c, and 158d. Conductive stent 158. In one example, the conductive stent 158 is made of a conductive material such as stainless steel; however, 93414.doc -13- 1244871 and 'any conductive material or material containing a conductive coating ^ 58 and positioning protrusion structure can be used. The switch is connected in series and is electrically connected ^ + = and the force positioning protruding member 16. Or it may be formed of the same raw material :: Place the W support ... 58 to accommodate the second surface of the rear cover assembly 14. Each of the components 140 on the assembly 140 The protrusions 142 are all attached to the corresponding mounting points formed by the upper end of the conductive bracket ^ -d. The attachment can be performed by adhesive bonding. Alternative bonding forms may include shrinkage, mechanical attachment, and the like The rear cover assembly 14 can be engaged with the body assembly 150 before being installed in the housing 或, or the rear broadcast cover assembly 14 can be engaged with the body assembly 150 during the final assembly of the microphone ι. The rear cover assembly 140 is press-fitted into the main body assembly 15 and is attached to the conductive bracket 158 disposed in the inner peripheral portion of the main body assembly 150 by bonding with an adhesive. The alternating protrusions define a plurality of acoustic paths 172. The acoustic paths 172 is away from the center of the high mobility of the diaphragm to the outer edge of the rear cover, and is located at the buffer portions 144a-d, so that the air in the space between the diaphragm 124 and the rear cover assembly 140 flows freely behind the pCB 16. Volume without compromising performance. Fig. 6 is a cross-sectional view which will be referred to in connection with the description of an embodiment of the method of combining microphones 〇00. First, the vibrating membrane module 120 is embedded in the housing 108, facing the sound port 118. Next, the spacer 134 is embedded in the housing 108 so that the first surface 136 of the spacer 134 faces the second surface 132 of the diaphragm assembly 120. Then, the rear cover assembly 14 is embedded in the body assembly 150. When embedded in the housing 108, the first surface 146 of the rear cover assembly 140 is oriented to face the second surface 138 of the spacer 134. A plurality of protrusions 142a-d 93414.doc • 14-1244871 are arranged, and they are adhered to a plurality of upper ends 158a-d of the conductive bracket 158. Next, the body assembly 150 is embedded in the casing 108. The rear cover assembly 140, the spacer 134, and the diaphragm assembly 120 suppress the displacement of their positions due to the vibration fit during the manufacturing process by the frictional fit of the body assembly 150. The second surface 156 of the body assembly 150 is formed with a positioning protrusion member 160 disposed at a pair of positions corresponding to the PCB 164. The Pcb 164 is pre-assembled with a plurality of electronic components 170. After the diaphragm assembly 120, the spacer 134, the rear cover assembly 140, and the body assembly 150 are completely embedded in the housing 108. The rear surface 168 of the PCB 164 is connected to the housing surface 108 of the housing 108 by, for example, machinery. Captured by fastening, crimping, welding or adhesive bonding. In this position, the diaphragm assembly 120 and the rear cover assembly 14 are electrically connected to the pCB 164. All references, including public cases, exclusive financial applications, and patent cases, are incorporated herein by reference, to the same extent as if each reference had been individually and materially incorporated by reference. People are described in general in this article. You interrupt the hair
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L ^ "(a)"(an),'^^(the)" ^ ^ ^ ^ -力 =為涵蓋單數及複數，除非本文另有_ 本文中價值範圍之陳述僅用作 屬於“圍内之每一獨立價值之簡寫方法， 祝明’如同已個別地引用於本 併入本說明書中。本文所描述之所有:法;-獨立， 之次序執行，除非本文另有說明或… 所提供之任何及所有實例或例示…=矛才 旺m 3 (例如”諸如 93414.doc -15- 1244871 as)")之使用僅為更好地_本發明，並料本發明之範脅 造成限制’除非另有主張。本說明書t並無語言可被解釋 為將任何非主張之①素作為本發明實施之基本。 本文锸述了本發明之若干實施例，包含發明者已知之用 於執行本發明之最佳模式。應瞭解’所說明之該等實施例 僅是例示性的，且不應限制本發明之範疇。 [圖式簡單說明】 圖1係一電容式麥克風之分解圖；L ^ " (a) " (an), '^^ (the) " ^ ^ ^ ^ -force = is intended to cover both the singular and the plural, unless stated otherwise herein. The abbreviated method of each independent value within the scope, Zhu Ming 'as if individually referenced in the present and incorporated into this specification. All described in this article: law;-independent, in the order of execution, unless otherwise stated in this article or ... The use of any and all examples or illustrations provided = = spear mong m 3 (eg "such as 93414.doc -15-1244871 as) ") is only used to better _ the present invention, and is expected to be caused by the scope of the present invention Restricted 'unless stated otherwise. No language in this specification can be construed as taking any non-claimed element as the basis for the practice of the present invention. This document describes several embodiments of the invention, including the best mode known to the inventors for carrying out the invention. It should be understood that the embodiments described by 'are merely illustrative and should not limit the scope of the invention. [Schematic description] Figure 1 is an exploded view of a condenser microphone;
圖2係一後擋蓋組件之俯視圖； 圖3係一本體組件之俯視圖； 圖4係展示後擋蓋及本體組件之組態的透視圖； 圖5係圖4之後擋蓋及本體組件之組態的俯視圖；及 圖6係一電容式麥克風之橫截面圖。 【主要元件符號說明】 100 電容式麥克風 102 防塵罩 104 防塵罩之第一表面 106 防塵罩之第二表面 108 外殼 110 外殼之上表面部分 112 外殼之側壁部分 114 連接表面 116 開口 118 聲璋Figure 2 is a top view of a rear cover assembly; Figure 3 is a top view of a body assembly; Figure 4 is a perspective view showing the configuration of the rear cover and the body assembly; Figure 5 is a set of the rear cover and the body assembly of FIG. 4 FIG. 6 is a cross-sectional view of a condenser microphone. [Description of main component symbols] 100 Condenser microphone 102 Dust cover 104 First surface of dust cover 106 Second surface of dust cover 108 Housing 110 Upper surface portion of housing 112 Side wall portion of housing 114 Connection surface 116 Opening 118 Acoustics
93414.doc -16- 1244871 120 振動膜組件 122 支撐環 124 振動膜 126 支樓環之第一表面 128 支撐環之第二表面 130 振動膜之第一表面 132 振動膜之第二表面 134 間隔器 135 中空區域 136 間隔器之第一表面 138 間隔器之第二表面 140 後擋蓋組件 142a-d 後擋蓋組件之突起部 144a-d 後擋蓋組件之緩衝部分 146 後擋蓋組件之第一表面 148 後擔蓋組件之第二表面 150 本體組件 152 本體組件之中空區域 154 本體組件之上表面 156 本體組件之下表面 158 導電支架 158a-d 導電支架之上端 160 定位突出構件 164 印刷電路板（PCB) 93414.doc -17- 1244871 166 印刷電路板之前表面 168 印刷電路板之後表面 170 電子元件 172 聲通路 93414.doc -18-93414.doc -16- 1244871 120 Vibration membrane module 122 Support ring 124 Vibration membrane 126 First surface of supporting ring 128 Second surface of support ring 130 First surface of vibration membrane 132 Second surface of vibration membrane 134 Spacer 135 Hollow area 136 First surface of spacer 138 Second surface of spacer 140 Rear cover assembly 142a-d Protrusions of rear cover assembly 144a-d Buffer portion of rear cover assembly 146 First surface of rear cover assembly 148 Second surface of the rear cover assembly 150 Body assembly 152 Hollow area of the body assembly 154 Upper surface of the body assembly 156 Lower surface of the body assembly 158 Conductive bracket 158a-d Upper end of the conductive bracket 160 Positioning protruding member 164 Printed circuit board (PCB) ) 93414.doc -17- 1244871 166 Front surface of printed circuit board 168 Rear surface of printed circuit board 170 Electronic components 172 Sound path 93414.doc -18-