TW200518655A - Method of forming through hole in photosensitive glass substrate - Google Patents

Method of forming through hole in photosensitive glass substrate

Info

Publication number
TW200518655A
TW200518655A TW093129975A TW93129975A TW200518655A TW 200518655 A TW200518655 A TW 200518655A TW 093129975 A TW093129975 A TW 093129975A TW 93129975 A TW93129975 A TW 93129975A TW 200518655 A TW200518655 A TW 200518655A
Authority
TW
Taiwan
Prior art keywords
photosensitive glass
holes
glass substrate
hole
forming
Prior art date
Application number
TW093129975A
Other languages
Chinese (zh)
Other versions
TWI333401B (en
Inventor
Kazuaki Hashimoto
Jun Ozawa
Yoshinari Motomura
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200518655A publication Critical patent/TW200518655A/en
Application granted granted Critical
Publication of TWI333401B publication Critical patent/TWI333401B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C11/00—Multi-cellular glass ; Porous or hollow glass or glass particles
    • C03C11/005—Multi-cellular glass ; Porous or hollow glass or glass particles obtained by leaching after a phase separation step
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/002—Other surface treatment of glass not in the form of fibres or filaments by irradiation by ultraviolet light
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C03C4/04—Compositions for glass with special properties for photosensitive glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The object of this invention is to provide plural uniform, fine-diameter through holes in a photosensitive glass substrate. Firstly, it applies the ultraviolet ray (4) onto substrate-form photosensitive glass (1) to form latent images (2). Further, the latent image portions are crystallized by heat treating. Furthermore, it removes the crystallized portions by etching to form through holes (5). Moreover, the front and rear surfaces of the photosensitive glass (1) are removed up to AA' and BB' respectively. Eventually, it keeps the aperture uniformity in the longitudinal direction of through holes within an allowable range.
TW093129975A 2003-10-06 2004-10-04 Method of forming through hole in photosensitive glass substrate TW200518655A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003347135 2003-10-06

Publications (2)

Publication Number Publication Date
TW200518655A true TW200518655A (en) 2005-06-01
TWI333401B TWI333401B (en) 2010-11-11

Family

ID=34419574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129975A TW200518655A (en) 2003-10-06 2004-10-04 Method of forming through hole in photosensitive glass substrate

Country Status (3)

Country Link
JP (1) JP4702794B2 (en)
TW (1) TW200518655A (en)
WO (1) WO2005034594A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105359633A (en) * 2013-07-04 2016-02-24 At&S奥地利科技与系统技术股份公司 Method for contacting and rewiring an electronic component embedded into a printed circuit board
US11527452B2 (en) 2017-07-24 2022-12-13 Corning Incorporated Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the same

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5662664B2 (en) 2008-12-19 2015-02-04 東京応化工業株式会社 Processed substrate and manufacturing method thereof
WO2013141400A1 (en) * 2012-03-23 2013-09-26 Hoya株式会社 Porous glass plate for electronic amplification, and detector
JP2013200196A (en) * 2012-03-23 2013-10-03 Hoya Corp Method for manufacturing electron amplification substrate, and electron amplification substrate
JP5917355B2 (en) * 2012-09-28 2016-05-11 ビアメカニクス株式会社 Laser processing method
JP5846185B2 (en) 2013-11-21 2016-01-20 大日本印刷株式会社 Through electrode substrate and semiconductor device using the through electrode substrate
TW201704177A (en) * 2015-06-10 2017-02-01 康寧公司 Methods of etching glass substrates and glass substrates
US20170103249A1 (en) 2015-10-09 2017-04-13 Corning Incorporated Glass-based substrate with vias and process of forming the same
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018117111A1 (en) 2016-12-21 2018-06-28 大日本印刷株式会社 Through electrode substrate, semiconductor device and method for producing through electrode substrate
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11719891B2 (en) * 2020-08-05 2023-08-08 Corning Research & Development Corporation Method of making a lensed connector with photosensitive glass

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2579358B2 (en) * 1989-03-29 1997-02-05 ホーヤ株式会社 Photosensitive glass pattern formation method
JPH1171139A (en) * 1997-08-26 1999-03-16 Res Dev Corp Of Japan Microcrystal-dispersing glass and its production
JP4109737B2 (en) * 1997-12-05 2008-07-02 株式会社東芝 Circuit board manufacturing method and circuit board manufacturing apparatus
JP2001105398A (en) * 1999-03-04 2001-04-17 Seiko Epson Corp Processing method
JP2000302488A (en) * 1999-04-23 2000-10-31 Seiko Epson Corp Fine holing of glass
JP4129906B2 (en) * 2002-02-01 2008-08-06 Ｈｏｙａ株式会社 Photosensitive glass, method for processing the same, method for manufacturing components for inkjet printer, and method for manufacturing semiconductor substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105359633A (en) * 2013-07-04 2016-02-24 At&S奥地利科技与系统技术股份公司 Method for contacting and rewiring an electronic component embedded into a printed circuit board
CN105359633B (en) * 2013-07-04 2018-03-13 At&S奥地利科技与系统技术股份公司 The electronic component electrical connection that will be embedded in printed circuit board and the method for rewiring
US10645816B2 (en) 2013-07-04 2020-05-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Method for contacting and rewiring an electronic component embedded into a printed circuit board
US11570904B2 (en) 2013-07-04 2023-01-31 At&S Austria Technologie & Systemtechnik Method for contacting and rewiring an electronic component embedded into a printed circuit board
US11527452B2 (en) 2017-07-24 2022-12-13 Corning Incorporated Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the same

Also Published As

Publication number Publication date
TWI333401B (en) 2010-11-11
JPWO2005034594A1 (en) 2007-11-22
WO2005034594A1 (en) 2005-04-14
JP4702794B2 (en) 2011-06-15

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees