TW200518132A - Stacking electronic device and producing method - Google Patents

Stacking electronic device and producing method

Info

Publication number
TW200518132A
TW200518132A TW093125638A TW93125638A TW200518132A TW 200518132 A TW200518132 A TW 200518132A TW 093125638 A TW093125638 A TW 093125638A TW 93125638 A TW93125638 A TW 93125638A TW 200518132 A TW200518132 A TW 200518132A
Authority
TW
Taiwan
Prior art keywords
electronic device
producing method
stacking electronic
layers
dielectric layers
Prior art date
Application number
TW093125638A
Other languages
Chinese (zh)
Other versions
TWI387984B (en
Inventor
Katsuyoshi Yamaguchi
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of TW200518132A publication Critical patent/TW200518132A/en
Application granted granted Critical
Publication of TWI387984B publication Critical patent/TWI387984B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021Constructional details
    • H03H2001/0085Multilayer, e.g. LTCC, HTCC, green sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

A stacking electronic device is provided with external electrodes on the end faces of the main body of the component formed by alternately laminating pluralities of dielectric layers and internal electrode layers. In the dielectric layers, part of the dielectric layers has thickness larger than that of the other layers.
TW093125638A 2003-08-27 2004-08-26 Stacking electronics devices and producing methods TWI387984B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003302923A JP2005072452A (en) 2003-08-27 2003-08-27 Laminated electronic component and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200518132A true TW200518132A (en) 2005-06-01
TWI387984B TWI387984B (en) 2013-03-01

Family

ID=34407058

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125638A TWI387984B (en) 2003-08-27 2004-08-26 Stacking electronics devices and producing methods

Country Status (4)

Country Link
JP (1) JP2005072452A (en)
KR (1) KR20050022330A (en)
CN (1) CN100521002C (en)
TW (1) TWI387984B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4438659B2 (en) * 2005-03-24 2010-03-24 Tdk株式会社 Manufacturing method of multilayer ceramic electronic component
JP4952893B2 (en) * 2006-05-29 2012-06-13 学校法人日本大学 Ceramic electronic component and method for manufacturing the same
WO2011155241A1 (en) * 2010-06-11 2011-12-15 株式会社村田製作所 Electronic component
JP5590055B2 (en) * 2012-02-13 2014-09-17 株式会社村田製作所 Manufacturing method of multilayer ceramic capacitor and multilayer ceramic capacitor
JP6513328B2 (en) * 2013-07-10 2019-05-15 太陽誘電株式会社 Multilayer ceramic capacitor
KR20150053424A (en) 2013-11-08 2015-05-18 삼성전기주식회사 Multi-layered ceramic electronic component and board having the same mounted thereon
KR101762032B1 (en) * 2015-11-27 2017-07-26 삼성전기주식회사 Multi-layer ceramic electronic part and method for manufacturing the same
JP2019062023A (en) 2017-09-25 2019-04-18 Tdk株式会社 Electronic component device
KR102589835B1 (en) * 2018-10-02 2023-10-16 삼성전기주식회사 Multi-layered ceramic electronic component

Also Published As

Publication number Publication date
TWI387984B (en) 2013-03-01
KR20050022330A (en) 2005-03-07
CN1591717A (en) 2005-03-09
JP2005072452A (en) 2005-03-17
CN100521002C (en) 2009-07-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees