TW200518129A - Metal-insulator-metal (MIM) capacitor and fabrication method for making the same - Google Patents

Metal-insulator-metal (MIM) capacitor and fabrication method for making the same

Info

Publication number
TW200518129A
TW200518129A TW092132902A TW92132902A TW200518129A TW 200518129 A TW200518129 A TW 200518129A TW 092132902 A TW092132902 A TW 092132902A TW 92132902 A TW92132902 A TW 92132902A TW 200518129 A TW200518129 A TW 200518129A
Authority
TW
Taiwan
Prior art keywords
metal
capacitor
metal plate
mim
dielectric layer
Prior art date
Application number
TW092132902A
Other languages
Chinese (zh)
Other versions
TWI232472B (en
Inventor
Jing-Horng Gau
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW92132902A priority Critical patent/TWI232472B/en
Application granted granted Critical
Publication of TWI232472B publication Critical patent/TWI232472B/en
Publication of TW200518129A publication Critical patent/TW200518129A/en

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  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A metal-insulator-metal (MIM) capacitor includes a first metal plate; a first capacitor dielectric layer disposed on the first metal plate and a second metal plate stacked on the first capacitor dielectric layer. The first metal plate, the first capacitor dielectric layer, and the second metal plate constitute a lower capacitor. A second capacitor dielectric layer is disposed on the second metal plate. A third metal plate is stacked on the second capacitor dielectric layer. The second metal plate, the second capacitor dielectric layer, and the third metal plate constitute an upper capacitor. The first metal plate and the third metal plate are electrically connected to a first terminal of the MIM capacitor, while the second metal plate is electrically connected to a second terminal of the MIM capacitor.
TW92132902A 2003-11-24 2003-11-24 Metal-insulator-metal (MIM) capacitor and fabrication method for making the same TWI232472B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92132902A TWI232472B (en) 2003-11-24 2003-11-24 Metal-insulator-metal (MIM) capacitor and fabrication method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92132902A TWI232472B (en) 2003-11-24 2003-11-24 Metal-insulator-metal (MIM) capacitor and fabrication method for making the same

Publications (2)

Publication Number Publication Date
TWI232472B TWI232472B (en) 2005-05-11
TW200518129A true TW200518129A (en) 2005-06-01

Family

ID=36320035

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92132902A TWI232472B (en) 2003-11-24 2003-11-24 Metal-insulator-metal (MIM) capacitor and fabrication method for making the same

Country Status (1)

Country Link
TW (1) TWI232472B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116209353A (en) * 2023-05-06 2023-06-02 常州承芯半导体有限公司 Capacitor structure and forming method thereof, semiconductor structure and forming method thereof

Also Published As

Publication number Publication date
TWI232472B (en) 2005-05-11

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