TW200516122A - Polishing composition and method for polishing substrate using the composition - Google Patents
Polishing composition and method for polishing substrate using the compositionInfo
- Publication number
- TW200516122A TW200516122A TW093118646A TW93118646A TW200516122A TW 200516122 A TW200516122 A TW 200516122A TW 093118646 A TW093118646 A TW 093118646A TW 93118646 A TW93118646 A TW 93118646A TW 200516122 A TW200516122 A TW 200516122A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- composition
- substrate
- ammonium salt
- acid ammonium
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A polishing composition characterized in that the composition is boehmite-free and comprises water, abrasive grains, a polishing accelerator, and an organic acid ammonium salt or an inorganic acid ammonium salt. The polishing composition provides a high-quality polished surface without surface defects while a high polishing rate is maintained.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003185264 | 2003-06-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200516122A true TW200516122A (en) | 2005-05-16 |
Family
ID=57798941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093118646A TW200516122A (en) | 2003-06-27 | 2004-06-25 | Polishing composition and method for polishing substrate using the composition |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200516122A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106687554A (en) * | 2014-09-29 | 2017-05-17 | 福吉米株式会社 | Polishing composition and polishing method |
CN109153889A (en) * | 2016-05-19 | 2019-01-04 | 东进世美肯株式会社 | Paste compound for chemically mechanical polishing |
-
2004
- 2004-06-25 TW TW093118646A patent/TW200516122A/en unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106687554A (en) * | 2014-09-29 | 2017-05-17 | 福吉米株式会社 | Polishing composition and polishing method |
US10093834B2 (en) | 2014-09-29 | 2018-10-09 | Fujimi Incorporated | Polishing composition and polishing method |
CN109153889A (en) * | 2016-05-19 | 2019-01-04 | 东进世美肯株式会社 | Paste compound for chemically mechanical polishing |
US11001732B2 (en) | 2016-05-19 | 2021-05-11 | Dongjin Semichem Co., Ltd. | Polishing slurry composition |
CN109153889B (en) * | 2016-05-19 | 2021-10-29 | 东进世美肯株式会社 | Slurry composition for chemical mechanical polishing |
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