TW200516122A - Polishing composition and method for polishing substrate using the composition - Google Patents

Polishing composition and method for polishing substrate using the composition

Info

Publication number
TW200516122A
TW200516122A TW093118646A TW93118646A TW200516122A TW 200516122 A TW200516122 A TW 200516122A TW 093118646 A TW093118646 A TW 093118646A TW 93118646 A TW93118646 A TW 93118646A TW 200516122 A TW200516122 A TW 200516122A
Authority
TW
Taiwan
Prior art keywords
polishing
composition
substrate
ammonium salt
acid ammonium
Prior art date
Application number
TW093118646A
Other languages
Chinese (zh)
Inventor
Norihiko Miyata
Junichiro Ando
Gong-Hong Hong
Yoshiki Hayashi
Original Assignee
Showa Denko Kk
Yamaguchi Seiken Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk, Yamaguchi Seiken Kogyo Kabushiki Kaisha filed Critical Showa Denko Kk
Publication of TW200516122A publication Critical patent/TW200516122A/en

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Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A polishing composition characterized in that the composition is boehmite-free and comprises water, abrasive grains, a polishing accelerator, and an organic acid ammonium salt or an inorganic acid ammonium salt. The polishing composition provides a high-quality polished surface without surface defects while a high polishing rate is maintained.
TW093118646A 2003-06-27 2004-06-25 Polishing composition and method for polishing substrate using the composition TW200516122A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003185264 2003-06-27

Publications (1)

Publication Number Publication Date
TW200516122A true TW200516122A (en) 2005-05-16

Family

ID=57798941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118646A TW200516122A (en) 2003-06-27 2004-06-25 Polishing composition and method for polishing substrate using the composition

Country Status (1)

Country Link
TW (1) TW200516122A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106687554A (en) * 2014-09-29 2017-05-17 福吉米株式会社 Polishing composition and polishing method
CN109153889A (en) * 2016-05-19 2019-01-04 东进世美肯株式会社 Paste compound for chemically mechanical polishing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106687554A (en) * 2014-09-29 2017-05-17 福吉米株式会社 Polishing composition and polishing method
US10093834B2 (en) 2014-09-29 2018-10-09 Fujimi Incorporated Polishing composition and polishing method
CN109153889A (en) * 2016-05-19 2019-01-04 东进世美肯株式会社 Paste compound for chemically mechanical polishing
US11001732B2 (en) 2016-05-19 2021-05-11 Dongjin Semichem Co., Ltd. Polishing slurry composition
CN109153889B (en) * 2016-05-19 2021-10-29 东进世美肯株式会社 Slurry composition for chemical mechanical polishing

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