TW200515094A - Wiring board, method of forming wiring pattern, and organic EL panel - Google Patents

Wiring board, method of forming wiring pattern, and organic EL panel

Info

Publication number
TW200515094A
TW200515094A TW093131436A TW93131436A TW200515094A TW 200515094 A TW200515094 A TW 200515094A TW 093131436 A TW093131436 A TW 093131436A TW 93131436 A TW93131436 A TW 93131436A TW 200515094 A TW200515094 A TW 200515094A
Authority
TW
Taiwan
Prior art keywords
wiring
wiring electrodes
panel
organic
pattern
Prior art date
Application number
TW093131436A
Other languages
Chinese (zh)
Inventor
Shigenobu Shibata
Yoshihiro Ogata
Original Assignee
Pioneer Tohoku Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Tohoku Corp filed Critical Pioneer Tohoku Corp
Publication of TW200515094A publication Critical patent/TW200515094A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Formed on an insulating substrate 1 is a wiring pattern 2 including at least two wiring electrodes 2A, 2B approaching each other and having different potentials. Of the two wiring electrodes 2A and 2B, at least one having a higher potential contains metal elements easy to migrate. In order to prevent a migration between the two mutually approaching wiring electrodes 2A and 2B, an electrically conductive pattern 3 is interposed therebetween which consists of an electrically conductive material not containing metal elements easy to migrate, but having a potential not lower than that of the wiring electrode 2A. In this way, it is possible to exactly prevent the migration between the wiring electrodes without carrying out additional processes.
TW093131436A 2003-10-17 2004-10-15 Wiring board, method of forming wiring pattern, and organic EL panel TW200515094A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003357282A JP2005123419A (en) 2003-10-17 2003-10-17 Wiring board, method of forming wiring pattern, and organic el panel

Publications (1)

Publication Number Publication Date
TW200515094A true TW200515094A (en) 2005-05-01

Family

ID=34614212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131436A TW200515094A (en) 2003-10-17 2004-10-15 Wiring board, method of forming wiring pattern, and organic EL panel

Country Status (4)

Country Link
JP (1) JP2005123419A (en)
KR (1) KR20050037350A (en)
CN (1) CN1610484A (en)
TW (1) TW200515094A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111163896B (en) * 2017-12-28 2022-10-04 株式会社藤仓 Soldering structure, wiring board with metal sheet, and soldering method
WO2023228798A1 (en) * 2022-05-26 2023-11-30 株式会社村田製作所 Expansion/contraction device

Also Published As

Publication number Publication date
CN1610484A (en) 2005-04-27
KR20050037350A (en) 2005-04-21
JP2005123419A (en) 2005-05-12

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