TW200513626A - Transport line with grooved microchannels for two-phase heat dissipation devices - Google Patents

Transport line with grooved microchannels for two-phase heat dissipation devices

Info

Publication number
TW200513626A
TW200513626A TW093112391A TW93112391A TW200513626A TW 200513626 A TW200513626 A TW 200513626A TW 093112391 A TW093112391 A TW 093112391A TW 93112391 A TW93112391 A TW 93112391A TW 200513626 A TW200513626 A TW 200513626A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
microchannels
grooved
transport line
phase heat
Prior art date
Application number
TW093112391A
Other languages
Chinese (zh)
Inventor
Shwin-Chung Wong
Original Assignee
Shwin-Chung Wong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shwin-Chung Wong filed Critical Shwin-Chung Wong
Priority to TW093112391A priority Critical patent/TW200513626A/en
Priority to US10/936,065 priority patent/US20050077030A1/en
Publication of TW200513626A publication Critical patent/TW200513626A/en

Links

Abstract

Grooved microchannels are used to enhance the capillary action in the transport line of two-phase heat dissipation devices, such as loop heat pipes, capillary pump loops, spray cooling devices, or others. Efficient heat dissipation is achieved by enhancing the capillary pumping force for the liquid flow without significantly increasing the friction force. The effective cross-sectional area of the liquid line is made smaller than that of the condensation section, either by inserting a plug or shrinking the liquid line, to provide additional pumping force for the coolant recycling.
TW093112391A 2003-10-08 2004-05-03 Transport line with grooved microchannels for two-phase heat dissipation devices TW200513626A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093112391A TW200513626A (en) 2004-05-03 2004-05-03 Transport line with grooved microchannels for two-phase heat dissipation devices
US10/936,065 US20050077030A1 (en) 2003-10-08 2004-09-09 Transport line with grooved microchannels for two-phase heat dissipation on devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093112391A TW200513626A (en) 2004-05-03 2004-05-03 Transport line with grooved microchannels for two-phase heat dissipation devices

Publications (1)

Publication Number Publication Date
TW200513626A true TW200513626A (en) 2005-04-16

Family

ID=57798740

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112391A TW200513626A (en) 2003-10-08 2004-05-03 Transport line with grooved microchannels for two-phase heat dissipation devices

Country Status (1)

Country Link
TW (1) TW200513626A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112432532A (en) * 2020-11-25 2021-03-02 北京空间飞行器总体设计部 Evaporator assembly and loop heat pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112432532A (en) * 2020-11-25 2021-03-02 北京空间飞行器总体设计部 Evaporator assembly and loop heat pipe
CN112432532B (en) * 2020-11-25 2022-07-26 北京空间飞行器总体设计部 Evaporator assembly and loop heat pipe

Similar Documents

Publication Publication Date Title
MX362903B (en) SYSTEMS, DEVICES AND METHODS FOR FLUID PUMPING, HEAT EXCHANGE, THERMAL DETECTION AND CONDUCTIVITY DETECTION.
TW200727122A (en) Embedded heat pipe in a hybrid cooling system
EP2757584A3 (en) Integrated thin film evaporation thermal spreader and planar heat pipe heat sink
TW200802970A (en) Heat pipe
WO2007101197A3 (en) A thermoelectric fluid heat exchange system
WO2007019558A3 (en) Nanostructured micro heat pipes
TW200622175A (en) Heat-dissipation device and fabricating method thereof
WO2007056599A3 (en) Liquid cooling for backlit displays
ATE394952T1 (en) PERSONAL COOLING AND WARMING SYSTEM WITH CIRCUIT FLUID FLOW
FR2903222B1 (en) PASSIVE THERMAL CONTROL ARRANGEMENT BASED ON DIPHASIC FLUID LOOP WITH CAPILLARY PUMPING WITH THERMAL CAPACITY.
FR2965905B1 (en) HEAT TRANSFER SYSTEM.
WO2006071930A3 (en) Fluidic pump for heat management
WO2007075599A3 (en) Multi-fluid coolant system
CN202902952U (en) Circulating thermosiphon cooling device
TW200708237A (en) Integrated liquid cooling system
HK1103435A1 (en) Fluid diode expansion device for heat pumps
WO2011023289A3 (en) Symmetrical intermediate storage means for heat pumps with cyclical drainage into a main system
WO2010018466A3 (en) Device, in particular for flow guidance, and a method for manufacturing a device, in particular for flow guidance
ATE536519T1 (en) COLLECTOR
TW200513624A (en) Transport line with grooved microchannels for two-phase heat dissipation devices
TW200513626A (en) Transport line with grooved microchannels for two-phase heat dissipation devices
MA20150378A1 (en) Energy Saving Fluid
TWI256876B (en) Liquid-cooling type heat dissipation module
FI20045216A (en) Heat sink
MY138510A (en) Using external radiators with electroosmotic pumps for cooling integrated circuits