TW200513626A - Transport line with grooved microchannels for two-phase heat dissipation devices - Google Patents
Transport line with grooved microchannels for two-phase heat dissipation devicesInfo
- Publication number
- TW200513626A TW200513626A TW093112391A TW93112391A TW200513626A TW 200513626 A TW200513626 A TW 200513626A TW 093112391 A TW093112391 A TW 093112391A TW 93112391 A TW93112391 A TW 93112391A TW 200513626 A TW200513626 A TW 200513626A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- microchannels
- grooved
- transport line
- phase heat
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 239000007788 liquid Substances 0.000 abstract 3
- 238000005086 pumping Methods 0.000 abstract 2
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 239000002826 coolant Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000004064 recycling Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
Abstract
Grooved microchannels are used to enhance the capillary action in the transport line of two-phase heat dissipation devices, such as loop heat pipes, capillary pump loops, spray cooling devices, or others. Efficient heat dissipation is achieved by enhancing the capillary pumping force for the liquid flow without significantly increasing the friction force. The effective cross-sectional area of the liquid line is made smaller than that of the condensation section, either by inserting a plug or shrinking the liquid line, to provide additional pumping force for the coolant recycling.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093112391A TW200513626A (en) | 2004-05-03 | 2004-05-03 | Transport line with grooved microchannels for two-phase heat dissipation devices |
US10/936,065 US20050077030A1 (en) | 2003-10-08 | 2004-09-09 | Transport line with grooved microchannels for two-phase heat dissipation on devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093112391A TW200513626A (en) | 2004-05-03 | 2004-05-03 | Transport line with grooved microchannels for two-phase heat dissipation devices |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200513626A true TW200513626A (en) | 2005-04-16 |
Family
ID=57798740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093112391A TW200513626A (en) | 2003-10-08 | 2004-05-03 | Transport line with grooved microchannels for two-phase heat dissipation devices |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200513626A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112432532A (en) * | 2020-11-25 | 2021-03-02 | 北京空间飞行器总体设计部 | Evaporator assembly and loop heat pipe |
-
2004
- 2004-05-03 TW TW093112391A patent/TW200513626A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112432532A (en) * | 2020-11-25 | 2021-03-02 | 北京空间飞行器总体设计部 | Evaporator assembly and loop heat pipe |
CN112432532B (en) * | 2020-11-25 | 2022-07-26 | 北京空间飞行器总体设计部 | Evaporator assembly and loop heat pipe |
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