TW200512765A - Surface-mounted thermistor and manufacturing method thereof - Google Patents

Surface-mounted thermistor and manufacturing method thereof

Info

Publication number
TW200512765A
TW200512765A TW093114969A TW93114969A TW200512765A TW 200512765 A TW200512765 A TW 200512765A TW 093114969 A TW093114969 A TW 093114969A TW 93114969 A TW93114969 A TW 93114969A TW 200512765 A TW200512765 A TW 200512765A
Authority
TW
Taiwan
Prior art keywords
thermistor
grooves
connection portion
crack
sides
Prior art date
Application number
TW093114969A
Other languages
English (en)
Other versions
TWI255468B (en
Inventor
Jun-Ku Han
Su-An Choi
Chang-Mo Ko
An-Na Lee
Jong-Hwan Lee
Ju-Dam Kim
Jong-Ho Lee
Dong-Hyun Kim
Original Assignee
Lg Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Cable Ltd filed Critical Lg Cable Ltd
Publication of TW200512765A publication Critical patent/TW200512765A/zh
Application granted granted Critical
Publication of TWI255468B publication Critical patent/TWI255468B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Details Of Resistors (AREA)
TW093114969A 2003-09-17 2004-05-26 Surface-mounted thermistor and manufacturing method thereof TWI255468B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030064409A KR100694383B1 (ko) 2003-09-17 2003-09-17 표면 실장형 서미스터

Publications (2)

Publication Number Publication Date
TW200512765A true TW200512765A (en) 2005-04-01
TWI255468B TWI255468B (en) 2006-05-21

Family

ID=34270744

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093114969A TWI255468B (en) 2003-09-17 2004-05-26 Surface-mounted thermistor and manufacturing method thereof

Country Status (5)

Country Link
US (2) US7173511B2 (zh)
JP (1) JP2005093983A (zh)
KR (1) KR100694383B1 (zh)
CN (1) CN100449655C (zh)
TW (1) TWI255468B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7119655B2 (en) * 2004-11-29 2006-10-10 Therm-O-Disc, Incorporated PTC circuit protector having parallel areas of effective resistance
US20060202794A1 (en) * 2005-03-10 2006-09-14 Chang-Wei Ho Resettable over-current protection device and method for producing the same
US20060202791A1 (en) * 2005-03-10 2006-09-14 Chang-Wei Ho Resettable over-current protection device and method for producing the like
CN102446609B (zh) * 2010-10-12 2015-11-25 聚鼎科技股份有限公司 过电流保护装置
TWI456596B (zh) * 2012-07-31 2014-10-11 Polytronics Technology Corp 過電流保護元件及其製作方法
WO2014106331A1 (zh) * 2013-01-05 2014-07-10 上海卓凯电子科技有限公司 具有内埋式电阻的电路板
CN103037622B (zh) * 2013-01-05 2015-08-12 上海卓凯电子科技有限公司 具有内埋式电阻的电路板
KR102414185B1 (ko) 2015-06-16 2022-06-28 삼성전자주식회사 패키지 기판 및 이를 포함하는 반도체 패키지
US10186356B2 (en) 2016-07-06 2019-01-22 Littelfuse, Inc. Flexible positive temperature coefficient sheet and method for making the same
KR20190035762A (ko) 2016-08-15 2019-04-03 리텔퓨즈 인코퍼레이티드 배터리 관리 시스템을 구비한 플렉서블 정온도 계수 장치
KR102060384B1 (ko) * 2017-12-06 2019-12-30 순천대학교 산학협력단 유연 열저항기 제조 방법, 유연 열저항기를 포함하는 온도 감지 장치 제조 방법, 및 유연 열저항기를 포함하는 온도 감지 장치
CN108109791A (zh) * 2017-12-20 2018-06-01 广东爱晟电子科技有限公司 一种表面贴装式热敏电阻器件及其制作方法
DE102018205279A1 (de) * 2018-04-09 2019-10-10 Mahle International Gmbh Kaltleitermodul
TWI676187B (zh) * 2019-02-22 2019-11-01 聚鼎科技股份有限公司 過電流保護元件
WO2020191522A1 (en) 2019-03-22 2020-10-01 Littelfuse Electronics (Shanghai) Co., Ltd. Ptc device including polyswitch
EP3863029A1 (en) * 2020-02-05 2021-08-11 MAHLE International GmbH Ptc thermistor module for a temperature control device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3060968B2 (ja) 1996-10-22 2000-07-10 株式会社村田製作所 正特性サーミスタ及び正特性サーミスタ装置
KR100326778B1 (ko) * 1996-12-26 2002-03-12 모리시타 요이찌 Ｐｔｃ 서미스터 및 그 제조 방법
JPH10261507A (ja) * 1997-03-18 1998-09-29 Murata Mfg Co Ltd サーミスタ素子
CN1123895C (zh) * 1997-07-07 2003-10-08 松下电器产业株式会社 芯片形ptc热敏电阻及其制造方法
US6380839B2 (en) 1998-03-05 2002-04-30 Bourns, Inc. Surface mount conductive polymer device
JP4419214B2 (ja) * 1999-03-08 2010-02-24 パナソニック株式会社 チップ形ｐｔｃサーミスタ
JP3857571B2 (ja) * 2001-11-15 2006-12-13 タイコ エレクトロニクス レイケム株式会社 ポリマーｐｔｃサーミスタおよび温度センサ
TW529772U (en) * 2002-06-06 2003-04-21 Protectronics Technology Corp Surface mountable laminated circuit protection device
KR100495133B1 (ko) * 2002-11-28 2005-06-14 엘에스전선 주식회사 피티씨 서미스터

Also Published As

Publication number Publication date
JP2005093983A (ja) 2005-04-07
KR20050028110A (ko) 2005-03-22
CN100449655C (zh) 2009-01-07
US20050057338A1 (en) 2005-03-17
KR100694383B1 (ko) 2007-03-12
US7173511B2 (en) 2007-02-06
TWI255468B (en) 2006-05-21
US20070103269A1 (en) 2007-05-10
CN1598976A (zh) 2005-03-23

Similar Documents

Publication Publication Date Title
TW200512765A (en) Surface-mounted thermistor and manufacturing method thereof
WO2007110616A8 (en) Electrical connector
EA201590995A1 (ru) Оконное стекло с электрическим присоединительным элементом и компенсационными пластинками
TW200742249A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
EA201391657A1 (ru) Стеклянный лист с элементом для электрического соединения
EP2009710A3 (en) Piezoelectric component and manufacturing method thereof
TW200710891A (en) Electronic component and method of manufacturing the same
WO2006042044A3 (en) Thermoelectric device structure and apparatus incorporating same
WO2008070836A8 (en) Connector assembly with internal seals and manufacturing method
DK1991716T3 (da) Element
FI20041525A0 (fi) Elektroniikka moduuli ja menetelmä sen valmistamiseksi
DK1829387T3 (da) Kabelstikforbinder til printplader
TW200718006A (en) Electric element and electric circuit
TW200718299A (en) Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method
DK1369958T3 (da) Skal til overflademonteret, elektrisk konnektor og konnektor med samme
MY177667A (en) Pane with at least two electrical connection elements and a connecting conductor
SG170744A1 (en) Circuit board and connection substrate
TW200642531A (en) A printed circuit board (PCB) with electrostatic discharge protection
TW200731297A (en) Chip resistor and method of manufacturing the same
TW200642538A (en) Printed circuit board attached with connecting plug terminals, electronic equipment and its manufacturing method
TW200728836A (en) Fluorescent lamp with external electrodes and backlight module using the same
TW200802425A (en) Varistor and light-emitting apparatus
CN203562541U (zh) 一种led灯条连接器
TW200713340A (en) Variable chip resistor
JP2011103931A5 (zh)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees