TW200511652A - Chip on flex tape - Google Patents

Chip on flex tape

Info

Publication number
TW200511652A
TW200511652A TW093124714A TW93124714A TW200511652A TW 200511652 A TW200511652 A TW 200511652A TW 093124714 A TW093124714 A TW 093124714A TW 93124714 A TW93124714 A TW 93124714A TW 200511652 A TW200511652 A TW 200511652A
Authority
TW
Taiwan
Prior art keywords
chip
flex
tape
cof
connecting portion
Prior art date
Application number
TW093124714A
Other languages
Chinese (zh)
Inventor
Hideo Yamazaki
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200511652A publication Critical patent/TW200511652A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

To provide a chip on flex (COF) tape having an improved precision of cumulative pitches while retaining bending properties. A chip on flex (COF) tape having a wiring pattern comprising a plurality of wirings arranged in parallel formed on the surface of a flexible insulating film, wherein a dimension retention pattern is formed on said surface of said flexible insulating film and/or the surface of the side of the film opposite thereto so as to cross the width direction of at least two of said wirings arranged in parallel in the vicinity of the connecting portion of said wiring pattern with a semiconductor chip and/or the connecting portion with an external device.
TW093124714A 2003-09-10 2004-08-17 Chip on flex tape TW200511652A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003318639A JP2005086098A (en) 2003-09-10 2003-09-10 Chip-on-flex (cof) tape

Publications (1)

Publication Number Publication Date
TW200511652A true TW200511652A (en) 2005-03-16

Family

ID=34308526

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124714A TW200511652A (en) 2003-09-10 2004-08-17 Chip on flex tape

Country Status (6)

Country Link
EP (1) EP1665378A1 (en)
JP (1) JP2005086098A (en)
KR (1) KR20060119937A (en)
CN (1) CN1849706A (en)
TW (1) TW200511652A (en)
WO (1) WO2005027221A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5092284B2 (en) * 2006-05-31 2012-12-05 凸版印刷株式会社 TOC structure for bonding IC chips
JP4464990B2 (en) 2007-05-22 2010-05-19 トヨタ自動車株式会社 Wiring board and manufacturing method thereof
US7906374B2 (en) 2008-02-18 2011-03-15 Himax Technologies Limited COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof
JP5985940B2 (en) * 2012-09-18 2016-09-06 東レ・デュポン株式会社 COF substrate for tablet devices
JP7016147B2 (en) * 2017-11-29 2022-02-04 深▲セン▼通鋭微電子技術有限公司 Chip-on-film semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0777228B2 (en) * 1987-06-23 1995-08-16 三菱電機株式会社 Tape carrier
KR100476524B1 (en) * 1997-12-31 2005-08-29 삼성전자주식회사 Tape Carrier Package for LCD Module
JP3523536B2 (en) * 1999-08-06 2004-04-26 シャープ株式会社 Semiconductor device and manufacturing method thereof, and liquid crystal module and mounting method thereof
US20010010947A1 (en) * 1999-11-22 2001-08-02 Advanced Semiconductor Engineering, Inc. Film ball grid array (BGA) semiconductor package
US6740962B1 (en) * 2000-02-24 2004-05-25 Micron Technology, Inc. Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
JP3866058B2 (en) * 2001-07-05 2007-01-10 シャープ株式会社 Semiconductor device, wiring board and tape carrier

Also Published As

Publication number Publication date
WO2005027221A1 (en) 2005-03-24
EP1665378A1 (en) 2006-06-07
KR20060119937A (en) 2006-11-24
JP2005086098A (en) 2005-03-31
CN1849706A (en) 2006-10-18

Similar Documents

Publication Publication Date Title
TW200705586A (en) Wiring board, semiconductor device and display module
US7723618B2 (en) Shifted segment layout for differential signal traces to mitigate bundle weave effect
HK1122906A1 (en) Antenna structure of an integrated circuit
EP1909543A3 (en) Wired circuit board and electronic device
ATE428153T1 (en) IC CARD WITH IMPROVED CIRCUIT BOARD
EP1081991A3 (en) Flexible wiring board, electro-optical device and electronic equipment
ATE383658T1 (en) POWER SEMICONDUCTOR MODULE IN PRESSURE CONTACT
DE202006019812U1 (en) Wire-printed circuit board or circuit board with lead wires of rectangular or square cross-section
EP1814369A4 (en) Long film circuit board, and production method and production device therefor
TW200742518A (en) Flexible printed circuit board and method for manufacturing the same
TW200746329A (en) Circuit board
DE50302052D1 (en) Arrangement with at least one capacitor
EP1069617A3 (en) Multilayer wiring board
TW200636883A (en) Semiconductor device and manufacturing method thereof
ATE427646T1 (en) PRINTED CIRCUIT BOARD
TW200621112A (en) Film carrier tape for mounting electronic devices thereon and flexible substrate
EP2519085A4 (en) Many-up wiring substrate, wiring substrate, and electronic device
EP1443556A3 (en) Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus
WO2008149508A1 (en) Semiconductor module and portable devices
TW200511652A (en) Chip on flex tape
WO2002029770A1 (en) Display module
WO2002046833A3 (en) Liquid crystal display device having an auxiliary wiring
WO2008149572A1 (en) Printed wiring board
TW200616170A (en) Optical device and method for manufacturing the same thereof
TW200642536A (en) Flexible circuit board