TW200511145A - System and method for examining mask pattern fidelity - Google Patents

System and method for examining mask pattern fidelity

Info

Publication number
TW200511145A
TW200511145A TW093111786A TW93111786A TW200511145A TW 200511145 A TW200511145 A TW 200511145A TW 093111786 A TW093111786 A TW 093111786A TW 93111786 A TW93111786 A TW 93111786A TW 200511145 A TW200511145 A TW 200511145A
Authority
TW
Taiwan
Prior art keywords
mask
file
simulation
files
design
Prior art date
Application number
TW093111786A
Other languages
English (en)
Other versions
TWI240217B (en
Inventor
Wen-Chuan Wang
Shih-Ming Chang
Chih-Cheng Chin
Chi-Lun Lu
Sheng-Chi Chin
Hung Chang Hsieh
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200511145A publication Critical patent/TW200511145A/zh
Application granted granted Critical
Publication of TWI240217B publication Critical patent/TWI240217B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW093111786A 2003-05-05 2004-04-27 System and method for examining mask pattern fidelity TWI240217B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46797703P 2003-05-05 2003-05-05

Publications (2)

Publication Number Publication Date
TW200511145A true TW200511145A (en) 2005-03-16
TWI240217B TWI240217B (en) 2005-09-21

Family

ID=37007694

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111786A TWI240217B (en) 2003-05-05 2004-04-27 System and method for examining mask pattern fidelity

Country Status (2)

Country Link
US (2) US20040225488A1 (zh)
TW (1) TWI240217B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112764307A (zh) * 2019-11-06 2021-05-07 长鑫存储技术有限公司 光学临近效应的修正方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7469057B2 (en) * 2003-02-26 2008-12-23 Taiwan Semiconductor Manufacturing Corp System and method for inspecting errors on a wafer
US20040225488A1 (en) * 2003-05-05 2004-11-11 Wen-Chuan Wang System and method for examining mask pattern fidelity
US7558419B1 (en) 2003-08-14 2009-07-07 Brion Technologies, Inc. System and method for detecting integrated circuit pattern defects
US7003758B2 (en) * 2003-10-07 2006-02-21 Brion Technologies, Inc. System and method for lithography simulation
JP4247104B2 (ja) * 2003-12-18 2009-04-02 株式会社東芝 パターン検証方法、パターン検証システム
KR100982135B1 (ko) 2005-09-09 2010-09-14 에이에스엠엘 네델란즈 비.브이. 개별 마스크 오차 모델을 사용하는 마스크 검증 방법 및시스템
US7325225B2 (en) * 2005-10-05 2008-01-29 Yasushi Tanaka Method and apparatus for reducing OPC model errors
KR100673014B1 (ko) * 2005-10-28 2007-01-24 삼성전자주식회사 포토 마스크의 제조 방법
JP2007142275A (ja) * 2005-11-21 2007-06-07 Toshiba Corp フォトマスクの判定方法、半導体装置の製造方法及びプログラム
JP2007218711A (ja) * 2006-02-16 2007-08-30 Hitachi High-Technologies Corp 電子顕微鏡装置を用いた計測対象パターンの計測方法
JP2008299259A (ja) * 2007-06-04 2008-12-11 Dainippon Printing Co Ltd フォトマスク欠陥判定方法
US7664614B2 (en) * 2007-11-02 2010-02-16 United Microelectronics Corp. Method of inspecting photomask defect
NL2003678A (en) * 2008-12-17 2010-06-21 Asml Holding Nv Euv mask inspection system.
NL2003658A (en) * 2008-12-31 2010-07-01 Asml Holding Nv Euv mask inspection.
JP4918598B2 (ja) * 2010-01-18 2012-04-18 株式会社ニューフレアテクノロジー 検査装置および検査方法
US8619236B2 (en) 2010-11-24 2013-12-31 International Business Machines Corporation Determining lithographic set point using optical proximity correction verification simulation
US8577489B2 (en) 2011-01-26 2013-11-05 International Business Machines Corporation Diagnosing in-line critical dimension control adjustments using optical proximity correction verification
US8499260B2 (en) 2011-01-26 2013-07-30 International Business Machines Corporation Optical proximity correction verification accounting for mask deviations
US8856705B2 (en) * 2012-05-08 2014-10-07 Freescale Semiconductor, Inc. Mismatch verification device and methods thereof
US8782572B1 (en) * 2013-03-13 2014-07-15 United Microelectronics Corp. Method of optical proximity correction
US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
US9547745B1 (en) * 2015-07-27 2017-01-17 Dmo Systems Limited System and method for discovering unknown problematic patterns in chip design layout for semiconductor manufacturing
US9915625B2 (en) * 2016-01-04 2018-03-13 Kla-Tencor Corp. Optical die to database inspection
US10496780B1 (en) * 2016-10-19 2019-12-03 Mentor Graphics Corporation Dynamic model generation for lithographic simulation
WO2018125115A1 (en) * 2016-12-29 2018-07-05 Intel Corporation Accounting for mask manufacturing infidelities in semiconductor devices
US10678142B2 (en) * 2017-11-14 2020-06-09 Taiwan Semiconductor Manufacturing Co., Ltd. Optical proximity correction and photomasks
US10942443B2 (en) 2017-11-15 2021-03-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method of mask data synthesis and mask making
US10838305B2 (en) 2018-06-29 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Lithographic mask correction using volume correction techniques
US10866506B2 (en) 2018-10-30 2020-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Photo mask data correction method
US11451371B2 (en) * 2019-10-30 2022-09-20 Dell Products L.P. Data masking framework for information processing system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6078738A (en) * 1997-05-08 2000-06-20 Lsi Logic Corporation Comparing aerial image to SEM of photoresist or substrate pattern for masking process characterization
US6091845A (en) * 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask
US6466315B1 (en) * 1999-09-03 2002-10-15 Applied Materials, Inc. Method and system for reticle inspection by photolithography simulation
JP4580529B2 (ja) * 2000-09-26 2010-11-17 大日本印刷株式会社 半導体回路の設計パタンデータ補正方法と、補正された設計パタンデータを用いたフォトマスク、該フォトマスクの検査方法およびフォトマスク検査用パタンデータ作製方法
US6670082B2 (en) * 2001-10-09 2003-12-30 Numerical Technologies, Inc. System and method for correcting 3D effects in an alternating phase-shifting mask
US7093226B2 (en) * 2003-02-28 2006-08-15 Synopsys, Inc. Method and apparatus of wafer print simulation using hybrid model with mask optical images
US20040225488A1 (en) * 2003-05-05 2004-11-11 Wen-Chuan Wang System and method for examining mask pattern fidelity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112764307A (zh) * 2019-11-06 2021-05-07 长鑫存储技术有限公司 光学临近效应的修正方法

Also Published As

Publication number Publication date
TWI240217B (en) 2005-09-21
US20040225488A1 (en) 2004-11-11
US7383530B2 (en) 2008-06-03
US20070250805A1 (en) 2007-10-25

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees