TW200507714A - Manufacturing method for flexible printed wiring board - Google Patents

Manufacturing method for flexible printed wiring board

Info

Publication number
TW200507714A
TW200507714A TW093118067A TW93118067A TW200507714A TW 200507714 A TW200507714 A TW 200507714A TW 093118067 A TW093118067 A TW 093118067A TW 93118067 A TW93118067 A TW 93118067A TW 200507714 A TW200507714 A TW 200507714A
Authority
TW
Taiwan
Prior art keywords
manufacturing
wiring board
printed wiring
flexible printed
pattern
Prior art date
Application number
TW093118067A
Other languages
Chinese (zh)
Other versions
TWI239800B (en
Inventor
Yutaka Iguchi
Hiroshi Hasegawa
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200507714A publication Critical patent/TW200507714A/en
Application granted granted Critical
Publication of TWI239800B publication Critical patent/TWI239800B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The object of the present invention targets at providing a manufacturing method of flexible printed wiring board capable of improving the inspection of pattern defect. The solution of the present invention is that at least two electroplating layers are formed on a conductor pattern 13 that is made of a conductor layer disposed on the surface of an insulation layer 11; meanwhile, in any intermediate stage having heat treatment step of the manufacturing method for flexible printed wiring board, performing an image recognition to the conductor pattern 13 of an electroplating bottom layer 101 formed on the surface after forming the electroplating bottom layer 101 on the conductor pattern 13 and before the heat treatment step; carry out the pattern inspection step for detecting pattern defect, so as to improve the inspection of pattern defect.
TW093118067A 2003-06-23 2004-06-23 Manufacture method of flexible printed circuit board (PCB) TWI239800B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003178479A JP4004998B2 (en) 2003-06-23 2003-06-23 Manufacturing method of flexible printed wiring board

Publications (2)

Publication Number Publication Date
TW200507714A true TW200507714A (en) 2005-02-16
TWI239800B TWI239800B (en) 2005-09-11

Family

ID=34180092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118067A TWI239800B (en) 2003-06-23 2004-06-23 Manufacture method of flexible printed circuit board (PCB)

Country Status (3)

Country Link
JP (1) JP4004998B2 (en)
KR (1) KR100575039B1 (en)
TW (1) TWI239800B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116223515A (en) * 2023-05-05 2023-06-06 成都中航华测科技有限公司 Conductive pattern defect detection method for circuit board test process

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5127681B2 (en) * 2008-11-26 2013-01-23 日東電工株式会社 Method for manufacturing printed circuit board
KR100922415B1 (en) * 2009-06-15 2009-10-16 스템코 주식회사 Method for fabricating flexible circuit board and the board, method for fabricating semiconductor package and the package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5671173A (en) 1979-11-14 1981-06-13 Hitachi Ltd Pattern detection method of printed circuit substrate
JPH01295139A (en) * 1988-05-23 1989-11-28 Sharp Corp Pattern inspecting method
KR100232602B1 (en) * 1996-10-30 1999-12-01 구자홍 Board test method and printed circuit board manufacture process using cos system
KR100531419B1 (en) * 2001-06-12 2005-11-28 주식회사 하이닉스반도체 semiconductor device and method for fabricating the same
JP2003086919A (en) 2001-09-07 2003-03-20 Sun Tec Kk Pattern inspection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116223515A (en) * 2023-05-05 2023-06-06 成都中航华测科技有限公司 Conductive pattern defect detection method for circuit board test process

Also Published As

Publication number Publication date
KR100575039B1 (en) 2006-04-28
JP4004998B2 (en) 2007-11-07
KR20050000333A (en) 2005-01-03
JP2005019469A (en) 2005-01-20
TWI239800B (en) 2005-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees