TW200501366A - Heat sink structure - Google Patents

Heat sink structure

Info

Publication number
TW200501366A
TW200501366A TW092117783A TW92117783A TW200501366A TW 200501366 A TW200501366 A TW 200501366A TW 092117783 A TW092117783 A TW 092117783A TW 92117783 A TW92117783 A TW 92117783A TW 200501366 A TW200501366 A TW 200501366A
Authority
TW
Taiwan
Prior art keywords
heat sink
sink structure
package unit
chip package
spreader
Prior art date
Application number
TW092117783A
Other languages
Chinese (zh)
Other versions
TWI234257B (en
Inventor
Meng-Jen Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW092117783A priority Critical patent/TWI234257B/en
Priority to US10/710,269 priority patent/US20040261979A1/en
Publication of TW200501366A publication Critical patent/TW200501366A/en
Application granted granted Critical
Publication of TWI234257B publication Critical patent/TWI234257B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

A heat sink structure for a chip package unit is provided. The heat sink is composed of a heat spreader and at least one arcuate spring. The spreader has a top surface and a base surface covered over the chip package unit and the arcuate spring is located between the base surface of the spreader and the chip package unit. Therefore, the arcuate spring can touch the back of a chip on the chip package unit.
TW092117783A 2003-06-30 2003-06-30 Heat sink structure and chip package structure thereof TWI234257B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092117783A TWI234257B (en) 2003-06-30 2003-06-30 Heat sink structure and chip package structure thereof
US10/710,269 US20040261979A1 (en) 2003-06-30 2004-06-30 [heat sink structure]

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092117783A TWI234257B (en) 2003-06-30 2003-06-30 Heat sink structure and chip package structure thereof

Publications (2)

Publication Number Publication Date
TW200501366A true TW200501366A (en) 2005-01-01
TWI234257B TWI234257B (en) 2005-06-11

Family

ID=33538520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092117783A TWI234257B (en) 2003-06-30 2003-06-30 Heat sink structure and chip package structure thereof

Country Status (2)

Country Link
US (1) US20040261979A1 (en)
TW (1) TWI234257B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7312997B2 (en) 2005-04-22 2007-12-25 Quanta Computer Inc. Heat-dissipation device with elastic member and heat-dissipation method thereof
US7583502B2 (en) 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101826492B (en) * 2010-04-29 2012-11-28 南通富士通微电子股份有限公司 Chip-suspension-type packaging heat dissipation improved structure of semiconductor
CN101834150B (en) * 2010-04-29 2012-05-02 南通富士通微电子股份有限公司 High-heat-dispersion spherical array encapsulation method
CN112447631A (en) * 2020-11-09 2021-03-05 南昌航空大学 Heat radiation structure of packaged chip

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4442450A (en) * 1981-03-30 1984-04-10 International Business Machines Corporation Cooling element for solder bonded semiconductor devices
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
EP0512186A1 (en) * 1991-05-03 1992-11-11 International Business Machines Corporation Cooling structures and package modules for semiconductors
US5206792A (en) * 1991-11-04 1993-04-27 International Business Machines Corporation Attachment for contacting a heat sink with an integrated circuit chip and use thereof
US5270902A (en) * 1992-12-16 1993-12-14 International Business Machines Corporation Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
US5464054A (en) * 1993-08-09 1995-11-07 Thermalloy, Inc. Spring clamp and heat sink assembly
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
US6258609B1 (en) * 1996-09-30 2001-07-10 Micron Technology, Inc. Method and system for making known good semiconductor dice
US6229706B1 (en) * 1998-04-27 2001-05-08 Aavid Thermal Products, Inc. Reverse cantilever spring clip
KR100416980B1 (en) * 2002-02-22 2004-02-05 삼성전자주식회사 Fixing device for ball grid array chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7312997B2 (en) 2005-04-22 2007-12-25 Quanta Computer Inc. Heat-dissipation device with elastic member and heat-dissipation method thereof
US7583502B2 (en) 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

Also Published As

Publication number Publication date
TWI234257B (en) 2005-06-11
US20040261979A1 (en) 2004-12-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees