TW200500795A - Chemical amplification resist composition - Google Patents
Chemical amplification resist compositionInfo
- Publication number
- TW200500795A TW200500795A TW093108386A TW93108386A TW200500795A TW 200500795 A TW200500795 A TW 200500795A TW 093108386 A TW093108386 A TW 093108386A TW 93108386 A TW93108386 A TW 93108386A TW 200500795 A TW200500795 A TW 200500795A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- aqueous solution
- alkali aqueous
- resist composition
- chemical amplification
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J47/00—Kitchen containers, stands or the like, not provided for in other groups of this subclass; Cutting-boards, e.g. for bread
- A47J47/16—Stands, or holders for kitchen articles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J36/00—Parts, details or accessories of cooking-vessels
- A47J36/34—Supports for cooking-vessels
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003090253 | 2003-03-28 | ||
JP2003102541 | 2003-04-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200500795A true TW200500795A (en) | 2005-01-01 |
Family
ID=32993054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093108386A TW200500795A (en) | 2003-03-28 | 2004-03-26 | Chemical amplification resist composition |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040191674A1 (zh) |
JP (1) | JP2004326092A (zh) |
KR (1) | KR20040084850A (zh) |
CN (1) | CN1550894B (zh) |
TW (1) | TW200500795A (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI336914B (en) * | 2003-09-26 | 2011-02-01 | Sumitomo Chemical Co | Method for evaluating solution for coating film for semiconductor |
WO2005070989A2 (en) * | 2004-01-27 | 2005-08-04 | Ciba Specialty Chemicals Holding Inc. | Thermally stable cationic photocurable compositions |
TWI377439B (en) * | 2004-09-28 | 2012-11-21 | Sumitomo Chemical Co | Chemically amplified resist composition |
US20060102554A1 (en) * | 2004-11-12 | 2006-05-18 | Munirathna Padmanaban | Process for producing film forming resins for photoresist compositions |
KR100732301B1 (ko) | 2005-06-02 | 2007-06-25 | 주식회사 하이닉스반도체 | 포토레지스트 중합체, 포토레지스트 조성물 및 이를 이용한반도체 소자의 제조 방법 |
US7473749B2 (en) | 2005-06-23 | 2009-01-06 | International Business Machines Corporation | Preparation of topcoat compositions and methods of use thereof |
JP5002137B2 (ja) * | 2005-07-28 | 2012-08-15 | 富士フイルム株式会社 | 化学増幅型レジスト組成物及びその製造方法 |
CN1940726B (zh) * | 2005-09-29 | 2011-07-13 | 住友化学株式会社 | 制备化学放大正性光刻胶用树脂的方法 |
JP5282015B2 (ja) * | 2008-12-09 | 2013-09-04 | 住友化学株式会社 | 樹脂溶解液の精製方法、取得方法及び化学増幅型フォトレジスト組成物の製造方法 |
JP5625547B2 (ja) * | 2010-06-30 | 2014-11-19 | 住友化学株式会社 | レジスト組成物の製造方法 |
JP5753749B2 (ja) * | 2010-09-27 | 2015-07-22 | 富士フイルム株式会社 | インプリント用硬化性組成物の製造方法 |
KR101988931B1 (ko) * | 2012-12-31 | 2019-09-30 | 동우 화인켐 주식회사 | 감광성 수지 조성물 및 이로부터 제조되는 절연막 |
JP6060012B2 (ja) * | 2013-03-15 | 2017-01-11 | 富士フイルム株式会社 | パターン形成方法、及び、電子デバイスの製造方法 |
CN105143291B (zh) * | 2013-04-23 | 2017-03-22 | 三菱瓦斯化学株式会社 | 新型脂环式酯化合物、(甲基)丙烯酸类共聚物以及包含它的感光性树脂组合物 |
CN110531579A (zh) * | 2019-09-26 | 2019-12-03 | 京东方科技集团股份有限公司 | 掩模版及其制造方法、光刻方法、显示面板、曝光装置 |
KR102619719B1 (ko) * | 2020-05-12 | 2023-12-28 | 삼성에스디아이 주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
CN117826532B (zh) * | 2024-03-05 | 2024-05-07 | 烟台舜康生物科技有限公司 | 无光引发剂的光刻胶的制备方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5143997A (en) * | 1989-10-11 | 1992-09-01 | Daicel Chemical Industries, Ltd. | Polycarbonate-polyol composition and polycarbonate(meth) acrylate compositions and urethane(meth) acrylate compositions prepared therefrom |
US5350714A (en) * | 1993-11-08 | 1994-09-27 | Shipley Company Inc. | Point-of-use purification |
KR100466301B1 (ko) * | 1996-04-03 | 2005-09-28 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 포토레지스트조성물 |
JP3743187B2 (ja) * | 1998-05-08 | 2006-02-08 | 住友化学株式会社 | フォトレジスト組成物 |
TWI277830B (en) * | 1999-01-28 | 2007-04-01 | Sumitomo Chemical Co | Resist composition |
JP2001215704A (ja) * | 2000-01-31 | 2001-08-10 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
TW507116B (en) * | 2000-04-04 | 2002-10-21 | Sumitomo Chemical Co | Chemically amplified positive resist composition |
TWI286664B (en) * | 2000-06-23 | 2007-09-11 | Sumitomo Chemical Co | Chemical amplification type positive resist composition and sulfonium salt |
-
2004
- 2004-03-25 US US10/808,515 patent/US20040191674A1/en not_active Abandoned
- 2004-03-25 KR KR1020040020438A patent/KR20040084850A/ko not_active Application Discontinuation
- 2004-03-26 CN CN2004100387044A patent/CN1550894B/zh not_active Expired - Fee Related
- 2004-03-26 TW TW093108386A patent/TW200500795A/zh unknown
- 2004-03-26 JP JP2004091365A patent/JP2004326092A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1550894B (zh) | 2011-11-30 |
CN1550894A (zh) | 2004-12-01 |
KR20040084850A (ko) | 2004-10-06 |
JP2004326092A (ja) | 2004-11-18 |
US20040191674A1 (en) | 2004-09-30 |
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