TW200500206A - Microelectromechanical device packages with integral heaters - Google Patents

Microelectromechanical device packages with integral heaters

Info

Publication number
TW200500206A
TW200500206A TW093110419A TW93110419A TW200500206A TW 200500206 A TW200500206 A TW 200500206A TW 093110419 A TW093110419 A TW 093110419A TW 93110419 A TW93110419 A TW 93110419A TW 200500206 A TW200500206 A TW 200500206A
Authority
TW
Taiwan
Prior art keywords
microelectromechanical device
package
device packages
integral
integral heaters
Prior art date
Application number
TW093110419A
Other languages
English (en)
Inventor
Terry Tarn
Original Assignee
Reflectivity Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reflectivity Inc filed Critical Reflectivity Inc
Publication of TW200500206A publication Critical patent/TW200500206A/zh

Links

Landscapes

  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
TW093110419A 2003-05-22 2004-04-14 Microelectromechanical device packages with integral heaters TW200500206A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43331803P 2003-05-22 2003-05-22

Publications (1)

Publication Number Publication Date
TW200500206A true TW200500206A (en) 2005-01-01

Family

ID=37025725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093110419A TW200500206A (en) 2003-05-22 2004-04-14 Microelectromechanical device packages with integral heaters

Country Status (2)

Country Link
CN (1) CN1836324A (zh)
TW (1) TW200500206A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115235299A (zh) * 2022-06-30 2022-10-25 四川航天川南火工技术有限公司 一种火工阵列微推进器封装结构及封装方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120085267A (ko) 2009-09-22 2012-07-31 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 디바이스의 실링을 위한 유리 패키지 및 유리 패키지를 포함하는 시스템
EP3056467B1 (en) * 2013-02-20 2017-05-24 Harman Becker Automotive Systems GmbH Circuit board comprising spatial light modulator
JP5795050B2 (ja) * 2013-12-27 2015-10-14 田中貴金属工業株式会社 気密封止パッケージ部材及びその製造方法、並びに、該気密封止パッケージ部材を用いた気密封止パッケージの製造方法
JP5692453B1 (ja) * 2014-01-14 2015-04-01 Ｃｒｏｓｓ大阪株式会社 封止装置及び封止方法
WO2017013971A1 (ja) * 2015-07-22 2017-01-26 ソニー株式会社 光学装置、画像表示装置及び表示装置
CN105129720A (zh) * 2015-07-25 2015-12-09 中国科学院地质与地球物理研究所 Mems传感器的封装结构及封装方法
CN108046207A (zh) * 2017-12-12 2018-05-18 烟台艾睿光电科技有限公司 一种红外探测器及其内置加热器的陶瓷管壳

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115235299A (zh) * 2022-06-30 2022-10-25 四川航天川南火工技术有限公司 一种火工阵列微推进器封装结构及封装方法
CN115235299B (zh) * 2022-06-30 2024-07-23 四川航天川南火工技术有限公司 一种火工阵列微推进器封装结构及封装方法

Also Published As

Publication number Publication date
CN1836324A (zh) 2006-09-20

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